1 Watt Fully Differential Audio Power Amplifier With Shutdown Select
参数名称 | 属性值 |
是否Rohs认证 | 不符合 |
厂商名称 | National Semiconductor(TI ) |
包装说明 | VFBGA, BGA9,3X3,20 |
Reach Compliance Code | not_compliant |
ECCN代码 | EAR99 |
标称带宽 | 20 kHz |
商用集成电路类型 | AUDIO AMPLIFIER |
谐波失真 | 1% |
JESD-30 代码 | S-PBGA-B9 |
JESD-609代码 | e0 |
长度 | 1.514 mm |
湿度敏感等级 | 1 |
信道数量 | 1 |
功能数量 | 1 |
端子数量 | 9 |
最高工作温度 | 85 °C |
最低工作温度 | -40 °C |
标称输出功率 | 1 W |
封装主体材料 | PLASTIC/EPOXY |
封装代码 | VFBGA |
封装等效代码 | BGA9,3X3,20 |
封装形状 | SQUARE |
封装形式 | GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
峰值回流温度(摄氏度) | 260 |
电源 | 3/5 V |
认证状态 | Not Qualified |
座面最大高度 | 0.675 mm |
最大压摆率 | 8 mA |
最大供电电压 (Vsup) | 5.5 V |
最小供电电压 (Vsup) | 2.2 V |
表面贴装 | YES |
温度等级 | INDUSTRIAL |
端子面层 | Tin/Lead (Sn63Pb37) |
端子形式 | BALL |
端子节距 | 0.5 mm |
端子位置 | BOTTOM |
处于峰值回流温度下的最长时间 | 40 |
宽度 | 1.514 mm |
LM4894ITLX | LM4894 | LM4894IBP | LM4894ITL | LM4894LD | LM4894MM | |
---|---|---|---|---|---|---|
描述 | 1 Watt Fully Differential Audio Power Amplifier With Shutdown Select | 1 Watt Fully Differential Audio Power Amplifier With Shutdown Select | 1 Watt Fully Differential Audio Power Amplifier With Shutdown Select | 1 Watt Fully Differential Audio Power Amplifier With Shutdown Select | 1 Watt Fully Differential Audio Power Amplifier With Shutdown Select | 1 Watt Fully Differential Audio Power Amplifier With Shutdown Select |
是否Rohs认证 | 不符合 | - | 不符合 | - | 不符合 | 不符合 |
厂商名称 | National Semiconductor(TI ) | - | National Semiconductor(TI ) | - | National Semiconductor(TI ) | National Semiconductor(TI ) |
包装说明 | VFBGA, BGA9,3X3,20 | - | VFBGA, BGA9,3X3,20 | - | HVSON, SOLCC10,.16,20 | TSSOP, TSSOP10,.19,20 |
Reach Compliance Code | not_compliant | - | not_compliant | - | not_compliant | _compli |
ECCN代码 | EAR99 | - | EAR99 | - | EAR99 | EAR99 |
标称带宽 | 20 kHz | - | 20 kHz | - | 20 kHz | 20 kHz |
商用集成电路类型 | AUDIO AMPLIFIER | - | AUDIO AMPLIFIER | - | AUDIO AMPLIFIER | AUDIO AMPLIFIER |
谐波失真 | 1% | - | 1% | - | 1% | 1% |
JESD-30 代码 | S-PBGA-B9 | - | S-PBGA-B9 | - | R-XDSO-N10 | S-PDSO-G10 |
JESD-609代码 | e0 | - | e0 | - | e0 | e0 |
长度 | 1.514 mm | - | 1.361 mm | - | 4 mm | 3 mm |
湿度敏感等级 | 1 | - | 1 | - | 1 | 1 |
信道数量 | 1 | - | 1 | - | 1 | 1 |
功能数量 | 1 | - | 1 | - | 1 | 1 |
端子数量 | 9 | - | 9 | - | 10 | 10 |
最高工作温度 | 85 °C | - | 85 °C | - | 85 °C | 85 °C |
最低工作温度 | -40 °C | - | -40 °C | - | -40 °C | -40 °C |
标称输出功率 | 1 W | - | 1 W | - | 1.4 W | 1 W |
封装主体材料 | PLASTIC/EPOXY | - | PLASTIC/EPOXY | - | UNSPECIFIED | PLASTIC/EPOXY |
封装代码 | VFBGA | - | VFBGA | - | HVSON | TSSOP |
封装等效代码 | BGA9,3X3,20 | - | BGA9,3X3,20 | - | SOLCC10,.16,20 | TSSOP10,.19,20 |
封装形状 | SQUARE | - | SQUARE | - | RECTANGULAR | SQUARE |
封装形式 | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | - | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | - | SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
峰值回流温度(摄氏度) | 260 | - | 260 | - | 235 | 260 |
电源 | 3/5 V | - | 3/5 V | - | 3/5 V | 3/5 V |
认证状态 | Not Qualified | - | Not Qualified | - | Not Qualified | Not Qualified |
座面最大高度 | 0.675 mm | - | 0.85 mm | - | 0.8 mm | 1.09 mm |
最大压摆率 | 8 mA | - | 8 mA | - | 8 mA | 8 mA |
最大供电电压 (Vsup) | 5.5 V | - | 5.5 V | - | 5.5 V | 5.5 V |
最小供电电压 (Vsup) | 2.2 V | - | 2.2 V | - | 2.2 V | 2.2 V |
表面贴装 | YES | - | YES | - | YES | YES |
温度等级 | INDUSTRIAL | - | INDUSTRIAL | - | INDUSTRIAL | INDUSTRIAL |
端子面层 | Tin/Lead (Sn63Pb37) | - | Tin/Lead (Sn63Pb37) | - | Tin/Lead (Sn85Pb15) | Tin/Lead (Sn85Pb15) |
端子形式 | BALL | - | BALL | - | NO LEAD | GULL WING |
端子节距 | 0.5 mm | - | 0.5 mm | - | 0.5 mm | 0.5 mm |
端子位置 | BOTTOM | - | BOTTOM | - | DUAL | DUAL |
处于峰值回流温度下的最长时间 | 40 | - | 40 | - | 30 | 40 |
宽度 | 1.514 mm | - | 1.336 mm | - | 3 mm | 3 mm |
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