NAND Gate
参数名称 | 属性值 |
是否Rohs认证 | 符合 |
厂商名称 | Nexperia |
包装说明 | X2SON-8 |
Reach Compliance Code | compli |
系列 | AUP/ULP/V |
JESD-30 代码 | R-PBCC-B8 |
长度 | 1.35 mm |
逻辑集成电路类型 | NAND GATE |
湿度敏感等级 | 1 |
功能数量 | 2 |
输入次数 | 2 |
端子数量 | 8 |
最高工作温度 | 125 °C |
最低工作温度 | -40 °C |
封装主体材料 | PLASTIC/EPOXY |
封装代码 | HVBCC |
封装形状 | RECTANGULAR |
封装形式 | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
峰值回流温度(摄氏度) | 260 |
传播延迟(tpd) | 27.9 ns |
座面最大高度 | 0.35 mm |
最大供电电压 (Vsup) | 3.6 V |
最小供电电压 (Vsup) | 0.8 V |
标称供电电压 (Vsup) | 1.1 V |
表面贴装 | YES |
技术 | CMOS |
温度等级 | AUTOMOTIVE |
端子形式 | BUTT |
端子位置 | BOTTOM |
处于峰值回流温度下的最长时间 | 30 |
宽度 | 0.8 mm |
74AUP2G132GX | 74AUP2G132GN,115 | 74AUP2G132GXX | 74AUP2G132DC,125 | 74AUP2G132GT,115 | 74AUP2G132GS,115 | 74AUP2G132GM,125 | 74AUP2G132GD,125 | 74AUP2G132GF,115 | |
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描述 | NAND Gate | IC GATE NAND SCHMITT 2CH 8XSON | IC GATE NAND SCHMITT 2CH 8X2SON | IC GATE NAND SCHMITT 2CH 8VSSOP | IC GATE NAND SCHMITT 2CH 8XSON | IC GATE NAND SCHMITT 2CH 8XSON | IC GATE NAND SCHMITT 2CH 8XQFN | 74AUP2G132 - Low-power dual 2-input NAND Schmitt trigger SON 8-Pin | 74AUP2G132 - Low-power dual 2-input NAND Schmitt trigger SON 8-Pin |
包装说明 | X2SON-8 | SON, | HVBCC, | VSSOP, | VSON, | SON-8 | QFN-8 | 3 X 2 MM, 0.50 MM HEIGHT, PLASTIC, SOT996-2, SON-8 | VSON, |
Reach Compliance Code | compli | compliant | compliant | compliant | compliant | compliant | compliant | compliant | compliant |
系列 | AUP/ULP/V | AUP/ULP/V | AUP/ULP/V | AUP/ULP/V | AUP/ULP/V | AUP/ULP/V | AUP/ULP/V | - | AUP/ULP/V |
JESD-30 代码 | R-PBCC-B8 | R-PDSO-N8 | R-PBCC-B8 | R-PDSO-G8 | R-PDSO-N8 | R-PDSO-N8 | S-PQCC-N8 | - | R-PDSO-N8 |
长度 | 1.35 mm | 1.2 mm | 1.35 mm | 2.3 mm | 1.95 mm | 1.35 mm | 1.6 mm | - | 1.35 mm |
逻辑集成电路类型 | NAND GATE | NAND GATE | NAND GATE | NAND GATE | NAND GATE | NAND GATE | NAND GATE | - | NAND GATE |
湿度敏感等级 | 1 | 1 | - | 1 | 1 | 1 | 1 | - | 1 |
功能数量 | 2 | 2 | 2 | 2 | 2 | 2 | 2 | - | 2 |
输入次数 | 2 | 2 | 2 | 2 | 2 | 2 | 2 | - | 2 |
端子数量 | 8 | 8 | 8 | 8 | 8 | 8 | 8 | - | 8 |
最高工作温度 | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C | - | 125 °C |
最低工作温度 | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | - | -40 °C |
封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | - | PLASTIC/EPOXY |
封装代码 | HVBCC | SON | HVBCC | VSSOP | VSON | VSON | VQCCN | - | VSON |
封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | SQUARE | - | RECTANGULAR |
封装形式 | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | SMALL OUTLINE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | SMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, VERY THIN PROFILE | SMALL OUTLINE, VERY THIN PROFILE | CHIP CARRIER, VERY THIN PROFILE | - | SMALL OUTLINE, VERY THIN PROFILE |
峰值回流温度(摄氏度) | 260 | NOT SPECIFIED | NOT SPECIFIED | 260 | 260 | NOT SPECIFIED | 260 | - | NOT SPECIFIED |
传播延迟(tpd) | 27.9 ns | 27.9 ns | 27.9 ns | 27.9 ns | 27.9 ns | 27.9 ns | 27.9 ns | - | 27.9 ns |
座面最大高度 | 0.35 mm | 0.35 mm | 0.35 mm | 1 mm | 0.5 mm | 0.35 mm | 0.5 mm | - | 0.5 mm |
最大供电电压 (Vsup) | 3.6 V | 3.6 V | 3.6 V | 3.6 V | 3.6 V | 3.6 V | 3.6 V | - | 3.6 V |
最小供电电压 (Vsup) | 0.8 V | 0.8 V | 0.8 V | 0.8 V | 0.8 V | 0.8 V | 0.8 V | - | 0.8 V |
标称供电电压 (Vsup) | 1.1 V | 1.1 V | 1.1 V | 1.1 V | 1.1 V | 1.1 V | 1.1 V | - | 1.1 V |
表面贴装 | YES | YES | YES | YES | YES | YES | YES | - | YES |
技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | - | CMOS |
温度等级 | AUTOMOTIVE | AUTOMOTIVE | AUTOMOTIVE | AUTOMOTIVE | AUTOMOTIVE | AUTOMOTIVE | AUTOMOTIVE | - | AUTOMOTIVE |
端子形式 | BUTT | NO LEAD | BUTT | GULL WING | NO LEAD | NO LEAD | NO LEAD | - | NO LEAD |
端子位置 | BOTTOM | DUAL | BOTTOM | DUAL | DUAL | DUAL | QUAD | - | DUAL |
处于峰值回流温度下的最长时间 | 30 | NOT SPECIFIED | NOT SPECIFIED | 30 | 30 | NOT SPECIFIED | 30 | - | NOT SPECIFIED |
宽度 | 0.8 mm | 1 mm | 0.8 mm | 2 mm | 1 mm | 1 mm | 1.6 mm | - | 1 mm |
Brand Name | - | Nexperia | Nexperia | Nexperia | Nexperia | Nexperia | Nexperia | Nexperia | Nexperia |
零件包装代码 | - | SON | - | SSOP | SON | SON | QFN | SON | SON |
针数 | - | 8 | - | 8 | 8 | 8 | 8 | 8 | 8 |
制造商包装代码 | - | SOT1116 | SOT1233 | SOT765-1 | SOT833-1 | SOT1203 | SOT902-2 | SOT996-2 | SOT1089 |
JESD-609代码 | - | e3 | - | e4 | e3 | e3 | e4 | - | e3 |
端子面层 | - | Tin (Sn) | - | Nickel/Palladium/Gold (Ni/Pd/Au) | Tin (Sn) | Tin (Sn) | Nickel/Palladium/Gold (Ni/Pd/Au) | - | Tin (Sn) |
端子节距 | - | 0.3 mm | - | 0.5 mm | 0.5 mm | 0.35 mm | 0.5 mm | - | 0.35 mm |
Base Number Matches | - | - | 1 | 1 | 1 | - | - | 1 | 1 |
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