IC GATE NAND SCHMITT 2CH 8XSON
| 参数名称 | 属性值 |
| Brand Name | Nexperia |
| 厂商名称 | Nexperia |
| 零件包装代码 | SON |
| 包装说明 | SON, |
| 针数 | 8 |
| 制造商包装代码 | SOT1116 |
| Reach Compliance Code | compliant |
| Samacsys Description | 74AUP2G132 - Low-power dual 2-input NAND Schmitt trigger@en-us |
| 系列 | AUP/ULP/V |
| JESD-30 代码 | R-PDSO-N8 |
| JESD-609代码 | e3 |
| 长度 | 1.2 mm |
| 逻辑集成电路类型 | NAND GATE |
| 湿度敏感等级 | 1 |
| 功能数量 | 2 |
| 输入次数 | 2 |
| 端子数量 | 8 |
| 最高工作温度 | 125 °C |
| 最低工作温度 | -40 °C |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | SON |
| 封装形状 | RECTANGULAR |
| 封装形式 | SMALL OUTLINE |
| 峰值回流温度（摄氏度） | NOT SPECIFIED |
| 传播延迟（tpd） | 27.9 ns |
| 座面最大高度 | 0.35 mm |
| 最大供电电压 (Vsup) | 3.6 V |
| 最小供电电压 (Vsup) | 0.8 V |
| 标称供电电压 (Vsup) | 1.1 V |
| 表面贴装 | YES |
| 技术 | CMOS |
| 温度等级 | AUTOMOTIVE |
| 端子面层 | Tin (Sn) |
| 端子形式 | NO LEAD |
| 端子节距 | 0.3 mm |
| 端子位置 | DUAL |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED |
| 宽度 | 1 mm |
| 74AUP2G132GN,115 | 74AUP2G132GXX | 74AUP2G132DC,125 | 74AUP2G132GT,115 | 74AUP2G132GS,115 | 74AUP2G132GM,125 | 74AUP2G132GD,125 | 74AUP2G132GF,115 | 74AUP2G132GX | |
|---|---|---|---|---|---|---|---|---|---|
| 描述 | IC GATE NAND SCHMITT 2CH 8XSON | IC GATE NAND SCHMITT 2CH 8X2SON | IC GATE NAND SCHMITT 2CH 8VSSOP | IC GATE NAND SCHMITT 2CH 8XSON | IC GATE NAND SCHMITT 2CH 8XSON | IC GATE NAND SCHMITT 2CH 8XQFN | 74AUP2G132 - Low-power dual 2-input NAND Schmitt trigger SON 8-Pin | 74AUP2G132 - Low-power dual 2-input NAND Schmitt trigger SON 8-Pin | NAND Gate |
| 包装说明 | SON, | HVBCC, | VSSOP, | VSON, | SON-8 | QFN-8 | 3 X 2 MM, 0.50 MM HEIGHT, PLASTIC, SOT996-2, SON-8 | VSON, | X2SON-8 |
| Reach Compliance Code | compliant | compliant | compliant | compliant | compliant | compliant | compliant | compliant | compli |
| Brand Name | Nexperia | Nexperia | Nexperia | Nexperia | Nexperia | Nexperia | Nexperia | Nexperia | - |
| 零件包装代码 | SON | - | SSOP | SON | SON | QFN | SON | SON | - |
| 针数 | 8 | - | 8 | 8 | 8 | 8 | 8 | 8 | - |
| 制造商包装代码 | SOT1116 | SOT1233 | SOT765-1 | SOT833-1 | SOT1203 | SOT902-2 | SOT996-2 | SOT1089 | - |
| 系列 | AUP/ULP/V | AUP/ULP/V | AUP/ULP/V | AUP/ULP/V | AUP/ULP/V | AUP/ULP/V | - | AUP/ULP/V | AUP/ULP/V |
| JESD-30 代码 | R-PDSO-N8 | R-PBCC-B8 | R-PDSO-G8 | R-PDSO-N8 | R-PDSO-N8 | S-PQCC-N8 | - | R-PDSO-N8 | R-PBCC-B8 |
| JESD-609代码 | e3 | - | e4 | e3 | e3 | e4 | - | e3 | - |
| 长度 | 1.2 mm | 1.35 mm | 2.3 mm | 1.95 mm | 1.35 mm | 1.6 mm | - | 1.35 mm | 1.35 mm |
| 逻辑集成电路类型 | NAND GATE | NAND GATE | NAND GATE | NAND GATE | NAND GATE | NAND GATE | - | NAND GATE | NAND GATE |
| 湿度敏感等级 | 1 | - | 1 | 1 | 1 | 1 | - | 1 | 1 |
| 功能数量 | 2 | 2 | 2 | 2 | 2 | 2 | - | 2 | 2 |
| 输入次数 | 2 | 2 | 2 | 2 | 2 | 2 | - | 2 | 2 |
| 端子数量 | 8 | 8 | 8 | 8 | 8 | 8 | - | 8 | 8 |
| 最高工作温度 | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C | - | 125 °C | 125 °C |
| 最低工作温度 | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | - | -40 °C | -40 °C |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | - | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | SON | HVBCC | VSSOP | VSON | VSON | VQCCN | - | VSON | HVBCC |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | SQUARE | - | RECTANGULAR | RECTANGULAR |
| 封装形式 | SMALL OUTLINE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | SMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, VERY THIN PROFILE | SMALL OUTLINE, VERY THIN PROFILE | CHIP CARRIER, VERY THIN PROFILE | - | SMALL OUTLINE, VERY THIN PROFILE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
| 峰值回流温度（摄氏度） | NOT SPECIFIED | NOT SPECIFIED | 260 | 260 | NOT SPECIFIED | 260 | - | NOT SPECIFIED | 260 |
| 传播延迟（tpd） | 27.9 ns | 27.9 ns | 27.9 ns | 27.9 ns | 27.9 ns | 27.9 ns | - | 27.9 ns | 27.9 ns |
| 座面最大高度 | 0.35 mm | 0.35 mm | 1 mm | 0.5 mm | 0.35 mm | 0.5 mm | - | 0.5 mm | 0.35 mm |
| 最大供电电压 (Vsup) | 3.6 V | 3.6 V | 3.6 V | 3.6 V | 3.6 V | 3.6 V | - | 3.6 V | 3.6 V |
| 最小供电电压 (Vsup) | 0.8 V | 0.8 V | 0.8 V | 0.8 V | 0.8 V | 0.8 V | - | 0.8 V | 0.8 V |
| 标称供电电压 (Vsup) | 1.1 V | 1.1 V | 1.1 V | 1.1 V | 1.1 V | 1.1 V | - | 1.1 V | 1.1 V |
| 表面贴装 | YES | YES | YES | YES | YES | YES | - | YES | YES |
| 技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | - | CMOS | CMOS |
| 温度等级 | AUTOMOTIVE | AUTOMOTIVE | AUTOMOTIVE | AUTOMOTIVE | AUTOMOTIVE | AUTOMOTIVE | - | AUTOMOTIVE | AUTOMOTIVE |
| 端子面层 | Tin (Sn) | - | Nickel/Palladium/Gold (Ni/Pd/Au) | Tin (Sn) | Tin (Sn) | Nickel/Palladium/Gold (Ni/Pd/Au) | - | Tin (Sn) | - |
| 端子形式 | NO LEAD | BUTT | GULL WING | NO LEAD | NO LEAD | NO LEAD | - | NO LEAD | BUTT |
| 端子节距 | 0.3 mm | - | 0.5 mm | 0.5 mm | 0.35 mm | 0.5 mm | - | 0.35 mm | - |
| 端子位置 | DUAL | BOTTOM | DUAL | DUAL | DUAL | QUAD | - | DUAL | BOTTOM |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED | NOT SPECIFIED | 30 | 30 | NOT SPECIFIED | 30 | - | NOT SPECIFIED | 30 |
| 宽度 | 1 mm | 0.8 mm | 2 mm | 1 mm | 1 mm | 1.6 mm | - | 1 mm | 0.8 mm |
| Base Number Matches | - | 1 | 1 | 1 | - | - | 1 | 1 | - |
电子工程世界版权所有
京B2-20211791
京ICP备10001474号-1
电信业务审批[2006]字第258号函
京公网安备 11010802033920号
Copyright © 2005-2024 EEWORLD.com.cn, Inc. All rights reserved
电子工程世界
