Sample and Hold Circuit, 1 Func, Sample, 20us Acquisition Time, BIFET, MBCY8
| 参数名称 | 属性值 |
| 是否Rohs认证 | 不符合 |
| 厂商名称 | AMD(超微) |
| 零件包装代码 | BCY |
| 包装说明 | , CAN8,.2 |
| 针数 | 8 |
| Reach Compliance Code | unknow |
| ECCN代码 | EAR99 |
| 标称采集时间 | 20 µs |
| 放大器类型 | SAMPLE AND HOLD CIRCUIT |
| JESD-30 代码 | O-MBCY-W8 |
| JESD-609代码 | e0 |
| 湿度敏感等级 | 1 |
| 负供电电压上限 | -18 V |
| 标称负供电电压 (Vsup) | -15 V |
| 功能数量 | 1 |
| 端子数量 | 8 |
| 最高工作温度 | 85 °C |
| 最低工作温度 | -25 °C |
| 封装主体材料 | METAL |
| 封装等效代码 | CAN8,.2 |
| 封装形状 | ROUND |
| 封装形式 | CYLINDRICAL |
| 峰值回流温度（摄氏度） | NOT SPECIFIED |
| 电源 | +-15 V |
| 认证状态 | Not Qualified |
| 采样并保持/跟踪并保持 | SAMPLE |
| 供电电压上限 | 18 V |
| 标称供电电压 (Vsup) | 15 V |
| 表面贴装 | NO |
| 技术 | BIFET |
| 温度等级 | OTHER |
| 端子面层 | Tin/Lead (Sn/Pb) |
| 端子形式 | WIRE |
| 端子位置 | BOTTOM |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED |
| LF298H | LF398N | LD198 | LD398 | LF398H | LF198H | |
|---|---|---|---|---|---|---|
| 描述 | Sample and Hold Circuit, 1 Func, Sample, 20us Acquisition Time, BIFET, MBCY8 | Sample and Hold Circuit, 1 Func, PDIP8 | Sample and Hold Circuit, 1 Func, Sample, 20us Acquisition Time, BIFET | Sample and Hold Circuit, 1 Func, Sample, 20us Acquisition Time, BIFET | Sample and Hold Circuit, 1 Func, Sample, 20us Acquisition Time, BIFET, MBCY8 | Sample and Hold Circuit, 1 Func, Sample, 20us Acquisition Time, BIFET, MBCY8, |
| Reach Compliance Code | unknow | unknown | unknown | unknown | unknown | unknow |
| 放大器类型 | SAMPLE AND HOLD CIRCUIT | SAMPLE AND HOLD CIRCUIT | SAMPLE AND HOLD CIRCUIT | SAMPLE AND HOLD CIRCUIT | SAMPLE AND HOLD CIRCUIT | SAMPLE AND HOLD CIRCUIT |
| JESD-30 代码 | O-MBCY-W8 | R-PDIP-T8 | X-XUUC-N8 | X-XUUC-N8 | O-MBCY-W8 | O-MBCY-W8 |
| 标称负供电电压 (Vsup) | -15 V | -15 V | -15 V | -15 V | -15 V | -15 V |
| 功能数量 | 1 | 1 | 1 | 1 | 1 | 1 |
| 端子数量 | 8 | 8 | 8 | 8 | 8 | 8 |
| 最高工作温度 | 85 °C | 70 °C | 125 °C | 70 °C | 70 °C | 125 °C |
| 封装主体材料 | METAL | PLASTIC/EPOXY | UNSPECIFIED | UNSPECIFIED | METAL | METAL |
| 封装等效代码 | CAN8,.2 | DIP8,.3 | DIE OR CHIP | DIE OR CHIP | CAN8,.2 | CAN8,.2 |
| 封装形状 | ROUND | RECTANGULAR | UNSPECIFIED | UNSPECIFIED | ROUND | ROUND |
| 封装形式 | CYLINDRICAL | IN-LINE | UNCASED CHIP | UNCASED CHIP | CYLINDRICAL | CYLINDRICAL |
| 电源 | +-15 V | +-15 V | +-15 V | +-15 V | +-15 V | +-15 V |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 标称供电电压 (Vsup) | 15 V | 15 V | 15 V | 15 V | 15 V | 15 V |
| 表面贴装 | NO | NO | YES | YES | NO | NO |
| 温度等级 | OTHER | COMMERCIAL | MILITARY | COMMERCIAL | COMMERCIAL | MILITARY |
| 端子形式 | WIRE | THROUGH-HOLE | NO LEAD | NO LEAD | WIRE | WIRE |
| 端子位置 | BOTTOM | DUAL | UPPER | UPPER | BOTTOM | BOTTOM |
| 是否Rohs认证 | 不符合 | 不符合 | - | - | 不符合 | 不符合 |
| 厂商名称 | AMD(超微) | - | AMD(超微) | AMD(超微) | AMD(超微) | AMD(超微) |
| 零件包装代码 | BCY | - | WAFER | WAFER | BCY | BCY |
| 包装说明 | , CAN8,.2 | - | DIE, DIE OR CHIP | DIE, DIE OR CHIP | , CAN8,.2 | , CAN8,.2 |
| 针数 | 8 | - | 8 | 8 | 8 | 8 |
| ECCN代码 | EAR99 | - | EAR99 | EAR99 | EAR99 | EAR99 |
| 标称采集时间 | 20 µs | - | 20 µs | 20 µs | 20 µs | 20 µs |
| JESD-609代码 | e0 | e0 | - | - | e0 | e0 |
| 负供电电压上限 | -18 V | - | -18 V | -18 V | -18 V | -18 V |
| 采样并保持/跟踪并保持 | SAMPLE | - | SAMPLE | SAMPLE | SAMPLE | SAMPLE |
| 供电电压上限 | 18 V | - | 18 V | 18 V | 18 V | 18 V |
| 技术 | BIFET | - | BIFET | BIFET | BIFET | BIFET |
| 端子面层 | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | - | - | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
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