Sample and Hold Circuit, 1 Func, Sample, 20us Acquisition Time, BIFET
参数名称 | 属性值 |
厂商名称 | AMD(超微) |
零件包装代码 | WAFER |
包装说明 | DIE, DIE OR CHIP |
针数 | 8 |
Reach Compliance Code | unknown |
ECCN代码 | EAR99 |
标称采集时间 | 20 µs |
放大器类型 | SAMPLE AND HOLD CIRCUIT |
JESD-30 代码 | X-XUUC-N8 |
负供电电压上限 | -18 V |
标称负供电电压 (Vsup) | -15 V |
功能数量 | 1 |
端子数量 | 8 |
最高工作温度 | 125 °C |
最低工作温度 | -55 °C |
封装主体材料 | UNSPECIFIED |
封装代码 | DIE |
封装等效代码 | DIE OR CHIP |
封装形状 | UNSPECIFIED |
封装形式 | UNCASED CHIP |
电源 | +-15 V |
认证状态 | Not Qualified |
采样并保持/跟踪并保持 | SAMPLE |
供电电压上限 | 18 V |
标称供电电压 (Vsup) | 15 V |
表面贴装 | YES |
技术 | BIFET |
温度等级 | MILITARY |
端子形式 | NO LEAD |
端子位置 | UPPER |
LD198 | LF398N | LD398 | LF398H | LF198H | LF298H | |
---|---|---|---|---|---|---|
描述 | Sample and Hold Circuit, 1 Func, Sample, 20us Acquisition Time, BIFET | Sample and Hold Circuit, 1 Func, PDIP8 | Sample and Hold Circuit, 1 Func, Sample, 20us Acquisition Time, BIFET | Sample and Hold Circuit, 1 Func, Sample, 20us Acquisition Time, BIFET, MBCY8 | Sample and Hold Circuit, 1 Func, Sample, 20us Acquisition Time, BIFET, MBCY8, | Sample and Hold Circuit, 1 Func, Sample, 20us Acquisition Time, BIFET, MBCY8 |
Reach Compliance Code | unknown | unknown | unknown | unknown | unknow | unknow |
放大器类型 | SAMPLE AND HOLD CIRCUIT | SAMPLE AND HOLD CIRCUIT | SAMPLE AND HOLD CIRCUIT | SAMPLE AND HOLD CIRCUIT | SAMPLE AND HOLD CIRCUIT | SAMPLE AND HOLD CIRCUIT |
JESD-30 代码 | X-XUUC-N8 | R-PDIP-T8 | X-XUUC-N8 | O-MBCY-W8 | O-MBCY-W8 | O-MBCY-W8 |
标称负供电电压 (Vsup) | -15 V | -15 V | -15 V | -15 V | -15 V | -15 V |
功能数量 | 1 | 1 | 1 | 1 | 1 | 1 |
端子数量 | 8 | 8 | 8 | 8 | 8 | 8 |
最高工作温度 | 125 °C | 70 °C | 70 °C | 70 °C | 125 °C | 85 °C |
封装主体材料 | UNSPECIFIED | PLASTIC/EPOXY | UNSPECIFIED | METAL | METAL | METAL |
封装等效代码 | DIE OR CHIP | DIP8,.3 | DIE OR CHIP | CAN8,.2 | CAN8,.2 | CAN8,.2 |
封装形状 | UNSPECIFIED | RECTANGULAR | UNSPECIFIED | ROUND | ROUND | ROUND |
封装形式 | UNCASED CHIP | IN-LINE | UNCASED CHIP | CYLINDRICAL | CYLINDRICAL | CYLINDRICAL |
电源 | +-15 V | +-15 V | +-15 V | +-15 V | +-15 V | +-15 V |
认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
标称供电电压 (Vsup) | 15 V | 15 V | 15 V | 15 V | 15 V | 15 V |
表面贴装 | YES | NO | YES | NO | NO | NO |
温度等级 | MILITARY | COMMERCIAL | COMMERCIAL | COMMERCIAL | MILITARY | OTHER |
端子形式 | NO LEAD | THROUGH-HOLE | NO LEAD | WIRE | WIRE | WIRE |
端子位置 | UPPER | DUAL | UPPER | BOTTOM | BOTTOM | BOTTOM |
厂商名称 | AMD(超微) | - | AMD(超微) | AMD(超微) | AMD(超微) | AMD(超微) |
零件包装代码 | WAFER | - | WAFER | BCY | BCY | BCY |
包装说明 | DIE, DIE OR CHIP | - | DIE, DIE OR CHIP | , CAN8,.2 | , CAN8,.2 | , CAN8,.2 |
针数 | 8 | - | 8 | 8 | 8 | 8 |
ECCN代码 | EAR99 | - | EAR99 | EAR99 | EAR99 | EAR99 |
标称采集时间 | 20 µs | - | 20 µs | 20 µs | 20 µs | 20 µs |
负供电电压上限 | -18 V | - | -18 V | -18 V | -18 V | -18 V |
采样并保持/跟踪并保持 | SAMPLE | - | SAMPLE | SAMPLE | SAMPLE | SAMPLE |
供电电压上限 | 18 V | - | 18 V | 18 V | 18 V | 18 V |
技术 | BIFET | - | BIFET | BIFET | BIFET | BIFET |
是否Rohs认证 | - | 不符合 | - | 不符合 | 不符合 | 不符合 |
JESD-609代码 | - | e0 | - | e0 | e0 | e0 |
端子面层 | - | Tin/Lead (Sn/Pb) | - | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
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