DDR DRAM,
参数名称 | 属性值 |
厂商名称 | Integrated Silicon Solution ( ISSI ) |
包装说明 | LBGA, |
Reach Compliance Code | unknow |
ECCN代码 | EAR99 |
Date Of I | 2019-10-02 |
访问模式 | MULTI BANK PAGE BURST |
其他特性 | AUTO REFRESH |
JESD-30 代码 | S-PBGA-B168 |
长度 | 13.5 mm |
内存密度 | 1207959552 bi |
内存集成电路类型 | DDR DRAM |
内存宽度 | 36 |
功能数量 | 1 |
端口数量 | 1 |
端子数量 | 168 |
字数 | 33554432 words |
字数代码 | 32000000 |
工作模式 | SYNCHRONOUS |
最高工作温度 | 95 °C |
最低工作温度 | |
组织 | 32MX36 |
封装主体材料 | PLASTIC/EPOXY |
封装代码 | LBGA |
封装形状 | SQUARE |
封装形式 | GRID ARRAY, LOW PROFILE |
座面最大高度 | 1.25 mm |
最大供电电压 (Vsup) | 1.42 V |
最小供电电压 (Vsup) | 1.28 V |
表面贴装 | YES |
技术 | CMOS |
温度等级 | OTHER |
端子形式 | BALL |
端子节距 | 1 mm |
端子位置 | BOTTOM |
宽度 | 13.5 mm |
IS49RL36320-083EBL | IS49RL36320-093FBLI | IS49RL36320-093FBL | IS49RL36320-093EBL | IS49RL36320-093EBLI | IS49RL36320-083FBL | IS49RL36320-083FBLI | IS49RL36320-107EBL | IS49RL36320-107EBLI | IS49RL36320-083EBLI | |
---|---|---|---|---|---|---|---|---|---|---|
描述 | DDR DRAM, | DDR DRAM, | DDR DRAM, | DDR DRAM, | DDR DRAM, | DDR DRAM, | DDR DRAM, | DDR DRAM, | DDR DRAM, | DDR DRAM, |
厂商名称 | Integrated Silicon Solution ( ISSI ) | Integrated Silicon Solution ( ISSI ) | Integrated Silicon Solution ( ISSI ) | Integrated Silicon Solution ( ISSI ) | Integrated Silicon Solution ( ISSI ) | Integrated Silicon Solution ( ISSI ) | Integrated Silicon Solution ( ISSI ) | Integrated Silicon Solution ( ISSI ) | Integrated Silicon Solution ( ISSI ) | Integrated Silicon Solution ( ISSI ) |
包装说明 | LBGA, | LBGA, | LBGA, | LBGA, | LBGA, | LBGA, | LBGA, | LBGA, | LBGA, | LBGA, |
Reach Compliance Code | unknow | unknown | unknown | unknown | unknown | unknown | unknown | unknown | unknown | unknow |
访问模式 | MULTI BANK PAGE BURST | MULTI BANK PAGE BURST | MULTI BANK PAGE BURST | MULTI BANK PAGE BURST | MULTI BANK PAGE BURST | MULTI BANK PAGE BURST | MULTI BANK PAGE BURST | MULTI BANK PAGE BURST | MULTI BANK PAGE BURST | MULTI BANK PAGE BURST |
其他特性 | AUTO REFRESH | AUTO REFRESH | AUTO REFRESH | AUTO REFRESH | AUTO REFRESH | AUTO REFRESH | AUTO REFRESH | AUTO REFRESH | AUTO REFRESH | AUTO REFRESH |
JESD-30 代码 | S-PBGA-B168 | S-PBGA-B168 | S-PBGA-B168 | S-PBGA-B168 | S-PBGA-B168 | S-PBGA-B168 | S-PBGA-B168 | S-PBGA-B168 | S-PBGA-B168 | S-PBGA-B168 |
长度 | 13.5 mm | 13.5 mm | 13.5 mm | 13.5 mm | 13.5 mm | 13.5 mm | 13.5 mm | 13.5 mm | 13.5 mm | 13.5 mm |
内存密度 | 1207959552 bi | 1207959552 bit | 1207959552 bit | 1207959552 bit | 1207959552 bit | 1207959552 bit | 1207959552 bit | 1207959552 bit | 1207959552 bit | 1207959552 bi |
内存集成电路类型 | DDR DRAM | DDR DRAM | DDR DRAM | DDR DRAM | DDR DRAM | DDR DRAM | DDR DRAM | DDR DRAM | DDR DRAM | DDR DRAM |
内存宽度 | 36 | 36 | 36 | 36 | 36 | 36 | 36 | 36 | 36 | 36 |
功能数量 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
端口数量 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
端子数量 | 168 | 168 | 168 | 168 | 168 | 168 | 168 | 168 | 168 | 168 |
字数 | 33554432 words | 33554432 words | 33554432 words | 33554432 words | 33554432 words | 33554432 words | 33554432 words | 33554432 words | 33554432 words | 33554432 words |
字数代码 | 32000000 | 32000000 | 32000000 | 32000000 | 32000000 | 32000000 | 32000000 | 32000000 | 32000000 | 32000000 |
工作模式 | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS |
最高工作温度 | 95 °C | 95 °C | 95 °C | 95 °C | 95 °C | 95 °C | 95 °C | 95 °C | 95 °C | 95 °C |
组织 | 32MX36 | 32MX36 | 32MX36 | 32MX36 | 32MX36 | 32MX36 | 32MX36 | 32MX36 | 32MX36 | 32MX36 |
封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
封装代码 | LBGA | LBGA | LBGA | LBGA | LBGA | LBGA | LBGA | LBGA | LBGA | LBGA |
封装形状 | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE |
封装形式 | GRID ARRAY, LOW PROFILE | GRID ARRAY, LOW PROFILE | GRID ARRAY, LOW PROFILE | GRID ARRAY, LOW PROFILE | GRID ARRAY, LOW PROFILE | GRID ARRAY, LOW PROFILE | GRID ARRAY, LOW PROFILE | GRID ARRAY, LOW PROFILE | GRID ARRAY, LOW PROFILE | GRID ARRAY, LOW PROFILE |
座面最大高度 | 1.25 mm | 1.25 mm | 1.25 mm | 1.25 mm | 1.25 mm | 1.25 mm | 1.25 mm | 1.25 mm | 1.25 mm | 1.25 mm |
最大供电电压 (Vsup) | 1.42 V | 1.42 V | 1.42 V | 1.42 V | 1.42 V | 1.42 V | 1.42 V | 1.42 V | 1.42 V | 1.42 V |
最小供电电压 (Vsup) | 1.28 V | 1.28 V | 1.28 V | 1.28 V | 1.28 V | 1.28 V | 1.28 V | 1.28 V | 1.28 V | 1.28 V |
表面贴装 | YES | YES | YES | YES | YES | YES | YES | YES | YES | YES |
技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
温度等级 | OTHER | INDUSTRIAL | OTHER | OTHER | INDUSTRIAL | OTHER | INDUSTRIAL | OTHER | INDUSTRIAL | INDUSTRIAL |
端子形式 | BALL | BALL | BALL | BALL | BALL | BALL | BALL | BALL | BALL | BALL |
端子节距 | 1 mm | 1 mm | 1 mm | 1 mm | 1 mm | 1 mm | 1 mm | 1 mm | 1 mm | 1 mm |
端子位置 | BOTTOM | BOTTOM | BOTTOM | BOTTOM | BOTTOM | BOTTOM | BOTTOM | BOTTOM | BOTTOM | BOTTOM |
宽度 | 13.5 mm | 13.5 mm | 13.5 mm | 13.5 mm | 13.5 mm | 13.5 mm | 13.5 mm | 13.5 mm | 13.5 mm | 13.5 mm |
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