7272L50P概述

Bi-Directional FIFO, 1KX9, 50ns, Asynchronous, CMOS, PDIP32

7272L50P规格参数

参数名称	属性值
是否Rohs认证	不符合
厂商名称	IDT (Integrated Device Technology)
Reach Compliance Code	not_compliant
ECCN代码	EAR99
最长访问时间	50 ns
最大时钟频率 (fCLK)	15.4 MHz
JESD-30 代码	R-PDIP-T32
JESD-609代码	e0
内存密度	9216 bit
内存集成电路类型	BI-DIRECTIONAL FIFO
内存宽度	9
端子数量	32
字数	1024 words
字数代码	1000
工作模式	ASYNCHRONOUS
最高工作温度	70 °C
最低工作温度
组织	1KX9
封装主体材料	PLASTIC/EPOXY
封装代码	DIP
封装等效代码	DIP32,.6
封装形状	RECTANGULAR
封装形式	IN-LINE
峰值回流温度（摄氏度）	260
电源	5 V
认证状态	Not Qualified
最大待机电流	0.008 A
最大压摆率	0.12 mA
标称供电电压 (Vsup)	5 V
表面贴装	NO
技术	CMOS
温度等级	COMMERCIAL
端子面层	Tin/Lead (Sn/Pb)
端子形式	THROUGH-HOLE
端子节距	2.54 mm
端子位置	DUAL
处于峰值回流温度下的最长时间	6

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7272L50P相似产品对比

	7272L50P	IDT7272L35LB	IDT7272L50P	IDT7273L35LB	IDT7273L35P	7273L35LB	7273L35P	7273L35J	7272L20J
描述	Bi-Directional FIFO, 1KX9, 50ns, Asynchronous, CMOS, PDIP32	Bi-Directional FIFO, 1KX9, 35ns, Asynchronous, CMOS, CQCC32	Bi-Directional FIFO, 1KX9, 50ns, Asynchronous, CMOS, PDIP32	Bi-Directional FIFO, 2KX9, 35ns, Asynchronous, CMOS, CQCC32	Bi-Directional FIFO, 2KX9, 35ns, Asynchronous, CMOS, PDIP32	Bi-Directional FIFO, 2KX9, 35ns, Asynchronous, CMOS, CQCC32	Bi-Directional FIFO, 2KX9, 35ns, Asynchronous, CMOS, PDIP32	Bi-Directional FIFO, 2KX9, 35ns, Asynchronous, CMOS, PQCC32	Bi-Directional FIFO, 1KX9, 20ns, Asynchronous, CMOS, PQCC32
是否Rohs认证	不符合	不符合	不符合	不符合	不符合	不符合	不符合	不符合	不符合
Reach Compliance Code	not_compliant	not_compliant	not_compliant	not_compliant	not_compliant	not_compliant	not_compliant	not_compliant	not_compliant
ECCN代码	EAR99	EAR99	EAR99	EAR99	EAR99	EAR99	EAR99	EAR99	EAR99
最长访问时间	50 ns	35 ns	50 ns	35 ns	35 ns	35 ns	35 ns	35 ns	20 ns
最大时钟频率 (fCLK)	15.4 MHz	22.2 MHz	15.4 MHz	22.2 MHz	22.2 MHz	22.2 MHz	22.2 MHz	22.2 MHz	33.3 MHz
JESD-30 代码	R-PDIP-T32	R-XQCC-N32	R-PDIP-T32	R-XQCC-N32	R-PDIP-T32	R-XQCC-N32	R-PDIP-T32	R-PQCC-J32	R-PQCC-J32
JESD-609代码	e0	e0	e0	e0	e0	e0	e0	e0	e0
内存密度	9216 bit	9216 bit	9216 bit	18432 bit	18432 bit	18432 bit	18432 bit	18432 bit	9216 bit
内存集成电路类型	BI-DIRECTIONAL FIFO	BI-DIRECTIONAL FIFO	BI-DIRECTIONAL FIFO	BI-DIRECTIONAL FIFO	BI-DIRECTIONAL FIFO	BI-DIRECTIONAL FIFO	BI-DIRECTIONAL FIFO	BI-DIRECTIONAL FIFO	BI-DIRECTIONAL FIFO
内存宽度	9	9	9	9	9	9	9	9	9
端子数量	32	32	32	32	32	32	32	32	32
字数	1024 words	1024 words	1024 words	2048 words	2048 words	2048 words	2048 words	2048 words	1024 words
字数代码	1000	1000	1000	2000	2000	2000	2000	2000	1000
工作模式	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS
最高工作温度	70 °C	125 °C	70 °C	125 °C	70 °C	125 °C	70 °C	70 °C	70 °C
组织	1KX9	1KX9	1KX9	2KX9	2KX9	2KX9	2KX9	2KX9	1KX9
封装主体材料	PLASTIC/EPOXY	CERAMIC	PLASTIC/EPOXY	CERAMIC	PLASTIC/EPOXY	CERAMIC	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
封装代码	DIP	QCCN	DIP	QCCN	DIP	QCCN	DIP	QCCJ	QCCJ
封装等效代码	DIP32,.6	LCC32,.45X.55	DIP32,.6	LCC32,.45X.55	DIP32,.6	LCC32,.45X.55	DIP32,.6	LDCC32,.5X.6	LDCC32,.5X.6
封装形状	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
封装形式	IN-LINE	CHIP CARRIER	IN-LINE	CHIP CARRIER	IN-LINE	CHIP CARRIER	IN-LINE	CHIP CARRIER	CHIP CARRIER
峰值回流温度（摄氏度）	260	260	260	260	260	260	260	225	225
电源	5 V	5 V	5 V	5 V	5 V	5 V	5 V	5 V	5 V
认证状态	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
最大待机电流	0.008 A	0.012 A	0.008 A	0.012 A	0.008 A	0.012 A	0.008 A	0.008 A	0.008 A
最大压摆率	0.12 mA	0.15 mA	0.12 mA	0.15 mA	0.12 mA	0.15 mA	0.12 mA	0.12 mA	0.12 mA
标称供电电压 (Vsup)	5 V	5 V	5 V	5 V	5 V	5 V	5 V	5 V	5 V
表面贴装	NO	YES	NO	YES	NO	YES	NO	YES	YES
技术	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS
温度等级	COMMERCIAL	MILITARY	COMMERCIAL	MILITARY	COMMERCIAL	MILITARY	COMMERCIAL	COMMERCIAL	COMMERCIAL
端子面层	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn85Pb15)	Tin/Lead (Sn85Pb15)
端子形式	THROUGH-HOLE	NO LEAD	THROUGH-HOLE	NO LEAD	THROUGH-HOLE	NO LEAD	THROUGH-HOLE	J BEND	J BEND
端子节距	2.54 mm	1.27 mm	2.54 mm	1.27 mm	2.54 mm	1.27 mm	2.54 mm	1.27 mm	1.27 mm
端子位置	DUAL	QUAD	DUAL	QUAD	DUAL	QUAD	DUAL	QUAD	QUAD
处于峰值回流温度下的最长时间	6	6	6	6	6	6	6	30	30
厂商名称	IDT (Integrated Device Technology)	-	IDT (Integrated Device Technology)	IDT (Integrated Device Technology)	IDT (Integrated Device Technology)	IDT (Integrated Device Technology)	IDT (Integrated Device Technology)	IDT (Integrated Device Technology)	-

7272L50P

7272L50P概述

7272L50P规格参数

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7272L50P相似产品对比

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