64K 8K x 8 Battery-Voltage CMOS E2PROM
| 参数名称 | 属性值 |
| 是否Rohs认证 | 不符合 |
| 零件包装代码 | TSOP |
| 包装说明 | TSOP1, TSSOP28,.53,22 |
| 针数 | 28 |
| Reach Compliance Code | compli |
| ECCN代码 | EAR99 |
| Is Samacsys | N |
| 最长访问时间 | 300 ns |
| 其他特性 | 100K ENDURANCE CYCLES; 10 YEARS DATA RETENTION |
| 命令用户界面 | NO |
| 数据轮询 | YES |
| 数据保留时间-最小值 | 10 |
| 耐久性 | 100000 Write/Erase Cycles |
| JESD-30 代码 | R-PDSO-G28 |
| JESD-609代码 | e0 |
| 长度 | 11.8 mm |
| 内存密度 | 65536 bi |
| 内存集成电路类型 | EEPROM |
| 内存宽度 | 8 |
| 湿度敏感等级 | 3 |
| 功能数量 | 1 |
| 端子数量 | 28 |
| 字数 | 8192 words |
| 字数代码 | 8000 |
| 工作模式 | ASYNCHRONOUS |
| 最高工作温度 | 70 °C |
| 最低工作温度 | |
| 组织 | 8KX8 |
| 输出特性 | 3-STATE |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | TSOP1 |
| 封装等效代码 | TSSOP28,.53,22 |
| 封装形状 | RECTANGULAR |
| 封装形式 | SMALL OUTLINE, THIN PROFILE |
| 并行/串行 | PARALLEL |
| 峰值回流温度（摄氏度） | 240 |
| 电源 | 3/3.3 V |
| 编程电压 | 3 V |
| 认证状态 | Not Qualified |
| 就绪/忙碌 | YES |
| 座面最大高度 | 1.2 mm |
| 最大待机电流 | 0.00005 A |
| 最大压摆率 | 0.008 mA |
| 最大供电电压 (Vsup) | 3.6 V |
| 最小供电电压 (Vsup) | 2.7 V |
| 标称供电电压 (Vsup) | 3 V |
| 表面贴装 | YES |
| 技术 | CMOS |
| 温度等级 | COMMERCIAL |
| 端子面层 | Tin/Lead (Sn/Pb) |
| 端子形式 | GULL WING |
| 端子节距 | 0.55 mm |
| 端子位置 | DUAL |
| 处于峰值回流温度下的最长时间 | 30 |
| 切换位 | NO |
| 宽度 | 8 mm |
| 最长写入周期时间 (tWC) | 3 ms |
| Base Number Matches | 1 |
| AT28BV64-30TC | AT28BV64 | AT28BV64-30 | AT28BV64-30JC | AT28BV64-30JI | AT28BV64-30PI | AT28BV64-30PC | AT28BV64-30SC | AT28BV64-30SI | AT28BV64-30TI | |
|---|---|---|---|---|---|---|---|---|---|---|
| 描述 | 64K 8K x 8 Battery-Voltage CMOS E2PROM | 64K 8K x 8 Battery-Voltage CMOS E2PROM | 64K 8K x 8 Battery-Voltage CMOS E2PROM | 64K 8K x 8 Battery-Voltage CMOS E2PROM | 64K 8K x 8 Battery-Voltage CMOS E2PROM | 64K 8K x 8 Battery-Voltage CMOS E2PROM | 64K 8K x 8 Battery-Voltage CMOS E2PROM | 64K 8K x 8 Battery-Voltage CMOS E2PROM | 64K 8K x 8 Battery-Voltage CMOS E2PROM | 64K 8K x 8 Battery-Voltage CMOS E2PROM |
| 是否Rohs认证 | 不符合 | - | - | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 |
| 零件包装代码 | TSOP | - | - | QFJ | QFJ | DIP | DIP | SOIC | SOIC | TSOP1 |
| 包装说明 | TSOP1, TSSOP28,.53,22 | - | - | QCCJ, LDCC32,.5X.6 | QCCJ, LDCC32,.5X.6 | DIP, DIP28,.6 | DIP, DIP28,.6 | SOP, SOP28,.5 | SOP, SOP28,.5 | TSSOP, TSSOP28,.53,22 |
| 针数 | 28 | - | - | 32 | 32 | 28 | 28 | 28 | 28 | 28 |
| Reach Compliance Code | compli | - | - | compli | compli | compli | compli | compli | compli | compli |
| ECCN代码 | EAR99 | - | - | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 |
| Is Samacsys | N | - | - | N | N | N | N | N | - | N |
| 最长访问时间 | 300 ns | - | - | 300 ns | 300 ns | 300 ns | 300 ns | 300 ns | 300 ns | 300 ns |
| 其他特性 | 100K ENDURANCE CYCLES; 10 YEARS DATA RETENTION | - | - | 100K ENDURANCE CYCLES; 10 YEARS DATA RETENTION | 100K ENDURANCE CYCLES; 10 YEARS DATA RETENTION | 100K ENDURANCE CYCLES; 10 YEARS DATA RETENTION | 100K ENDURANCE CYCLES; 10 YEARS DATA RETENTION | 100K ENDURANCE CYCLES; 10 YEARS DATA RETENTION | 100K ENDURANCE CYCLES; 10 YEARS DATA RETENTION | 100K ENDURANCE CYCLES; 10 YEARS DATA RETENTION |
| 命令用户界面 | NO | - | - | NO | NO | NO | NO | NO | NO | NO |
| 数据轮询 | YES | - | - | YES | YES | YES | YES | YES | YES | YES |
| 数据保留时间-最小值 | 10 | - | - | 10 | 10 | 10 | 10 | 10 | 10 | 10 |
| 耐久性 | 100000 Write/Erase Cycles | - | - | 100000 Write/Erase Cycles | 100000 Write/Erase Cycles | 100000 Write/Erase Cycles | 100000 Write/Erase Cycles | 100000 Write/Erase Cycles | 100000 Write/Erase Cycles | 100000 Write/Erase Cycles |
| JESD-30 代码 | R-PDSO-G28 | - | - | R-PQCC-J32 | R-PQCC-J32 | R-PDIP-T28 | R-PDIP-T28 | R-PDSO-G28 | R-PDSO-G28 | R-PDSO-G28 |
| JESD-609代码 | e0 | - | - | e0 | e0 | e0 | e0 | e0 | e0 | e0 |
| 长度 | 11.8 mm | - | - | 13.97 mm | 13.97 mm | 36.95 mm | 36.95 mm | 17.9 mm | 17.9 mm | 11.8 mm |
| 内存密度 | 65536 bi | - | - | 65536 bi | 65536 bi | 65536 bi | 65536 bi | 65536 bi | 65536 bi | 65536 bi |
| 内存集成电路类型 | EEPROM | - | - | EEPROM | EEPROM | EEPROM | EEPROM | EEPROM | EEPROM | EEPROM |
| 内存宽度 | 8 | - | - | 8 | 8 | 8 | 8 | 8 | 8 | 8 |
| 湿度敏感等级 | 3 | - | - | 2 | 2 | 1 | 1 | 2 | 1 | 3 |
| 功能数量 | 1 | - | - | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
| 端子数量 | 28 | - | - | 32 | 32 | 28 | 28 | 28 | 28 | 28 |
| 字数 | 8192 words | - | - | 8192 words | 8192 words | 8192 words | 8192 words | 8192 words | 8192 words | 8192 words |
| 字数代码 | 8000 | - | - | 8000 | 8000 | 8000 | 8000 | 8000 | 8000 | 8000 |
| 工作模式 | ASYNCHRONOUS | - | - | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS |
| 最高工作温度 | 70 °C | - | - | 70 °C | 85 °C | 85 °C | 70 °C | 70 °C | 85 °C | 85 °C |
| 组织 | 8KX8 | - | - | 8KX8 | 8KX8 | 8KX8 | 8KX8 | 8KX8 | 8KX8 | 8KX8 |
| 输出特性 | 3-STATE | - | - | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE |
| 封装主体材料 | PLASTIC/EPOXY | - | - | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | TSOP1 | - | - | QCCJ | QCCJ | DIP | DIP | SOP | SOP | TSSOP |
| 封装等效代码 | TSSOP28,.53,22 | - | - | LDCC32,.5X.6 | LDCC32,.5X.6 | DIP28,.6 | DIP28,.6 | SOP28,.5 | SOP28,.5 | TSSOP28,.53,22 |
| 封装形状 | RECTANGULAR | - | - | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | SMALL OUTLINE, THIN PROFILE | - | - | CHIP CARRIER | CHIP CARRIER | IN-LINE | IN-LINE | SMALL OUTLINE | SMALL OUTLINE | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
| 并行/串行 | PARALLEL | - | - | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL |
| 峰值回流温度（摄氏度） | 240 | - | - | 225 | 225 | 225 | 225 | 240 | 240 | 240 |
| 电源 | 3/3.3 V | - | - | 3/3.3 V | 3/3.3 V | 3/3.3 V | 3/3.3 V | 3/3.3 V | 3/3.3 V | 3/3.3 V |
| 编程电压 | 3 V | - | - | 3 V | 3 V | 3 V | 3 V | 3 V | 3 V | 3 V |
| 认证状态 | Not Qualified | - | - | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 就绪/忙碌 | YES | - | - | YES | YES | YES | YES | YES | YES | YES |
| 座面最大高度 | 1.2 mm | - | - | 3.55 mm | 3.55 mm | 4.826 mm | 5.59 mm | 2.65 mm | 2.65 mm | 1.2 mm |
| 最大待机电流 | 0.00005 A | - | - | 0.00005 A | 0.00005 A | 0.00005 A | 0.00005 A | 0.00005 A | 0.00005 A | 0.00005 A |
| 最大压摆率 | 0.008 mA | - | - | 0.008 mA | 0.008 mA | 0.008 mA | 0.008 mA | 0.008 mA | 0.008 mA | 0.008 mA |
| 最大供电电压 (Vsup) | 3.6 V | - | - | 3.6 V | 3.6 V | 3.6 V | 3.6 V | 3.6 V | 3.6 V | 3.6 V |
| 最小供电电压 (Vsup) | 2.7 V | - | - | 2.7 V | 2.7 V | 2.7 V | 2.7 V | 2.7 V | 2.7 V | 2.7 V |
| 标称供电电压 (Vsup) | 3 V | - | - | 3 V | 3 V | 3 V | 3 V | 3 V | 3 V | 3 V |
| 表面贴装 | YES | - | - | YES | YES | NO | NO | YES | YES | YES |
| 技术 | CMOS | - | - | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | COMMERCIAL | - | - | COMMERCIAL | INDUSTRIAL | INDUSTRIAL | COMMERCIAL | COMMERCIAL | INDUSTRIAL | INDUSTRIAL |
| 端子面层 | Tin/Lead (Sn/Pb) | - | - | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| 端子形式 | GULL WING | - | - | J BEND | J BEND | THROUGH-HOLE | THROUGH-HOLE | GULL WING | GULL WING | GULL WING |
| 端子节距 | 0.55 mm | - | - | 1.27 mm | 1.27 mm | 2.54 mm | 2.54 mm | 1.27 mm | 1.27 mm | 0.5 mm |
| 端子位置 | DUAL | - | - | QUAD | QUAD | DUAL | DUAL | DUAL | DUAL | DUAL |
| 处于峰值回流温度下的最长时间 | 30 | - | - | 30 | 30 | 30 | 30 | 30 | 30 | 30 |
| 切换位 | NO | - | - | NO | NO | NO | NO | NO | NO | NO |
| 宽度 | 8 mm | - | - | 11.43 mm | 11.43 mm | 15.24 mm | 15.24 mm | 7.5 mm | 7.5 mm | 8 mm |
| 最长写入周期时间 (tWC) | 3 ms | - | - | 3 ms | 3 ms | 3 ms | 3 ms | 3 ms | 3 ms | 3 ms |
| Base Number Matches | 1 | - | - | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
stm32/stm8
PCB设计
编程基础
DIY/开源硬件专区
WindowsCE
RF/无线
电子工程世界版权所有
京B2-20211791
京ICP备10001474号-1
电信业务审批[2006]字第258号函
京公网安备 11010802033920号
Copyright © 2005-2024 EEWORLD.com.cn, Inc. All rights reserved
电子工程世界
