EEPROM, 128X8, Serial, CMOS, PBGA8, 1.50 X 2 MM, 0.50 MM PITCH, GREEN, VFBGA-8
| 参数名称 | 属性值 |
| 是否Rohs认证 | 符合 |
| 厂商名称 | Atmel (Microchip) |
| 零件包装代码 | BGA |
| 包装说明 | 1.50 X 2 MM, 0.50 MM PITCH, GREEN, VFBGA-8 |
| 针数 | 8 |
| Reach Compliance Code | compli |
| ECCN代码 | EAR99 |
| 其他特性 | ALSO COMPATIBLE WITH 2.5 V AT 1 MHZ |
| 最大时钟频率 (fCLK) | 0.4 MHz |
| 数据保留时间-最小值 | 100 |
| 耐久性 | 1000000 Write/Erase Cycles |
| I2C控制字节 | 1010DDDR |
| JESD-30 代码 | R-PBGA-B8 |
| JESD-609代码 | e1 |
| 长度 | 2 mm |
| 内存密度 | 1024 bi |
| 内存集成电路类型 | EEPROM |
| 内存宽度 | 8 |
| 功能数量 | 1 |
| 端子数量 | 8 |
| 字数 | 128 words |
| 字数代码 | 128 |
| 工作模式 | SYNCHRONOUS |
| 最高工作温度 | 85 °C |
| 最低工作温度 | -40 °C |
| 组织 | 128X8 |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | VFBGA |
| 封装等效代码 | BGA8,2X4,40/20 |
| 封装形状 | RECTANGULAR |
| 封装形式 | GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
| 并行/串行 | SERIAL |
| 峰值回流温度（摄氏度） | NOT SPECIFIED |
| 电源 | 1.8/3.3 V |
| 认证状态 | Not Qualified |
| 座面最大高度 | 0.85 mm |
| 串行总线类型 | I2C |
| 最大待机电流 | 4e-7 A |
| 最大压摆率 | 0.001 mA |
| 最大供电电压 (Vsup) | 3.6 V |
| 最小供电电压 (Vsup) | 1.7 V |
| 标称供电电压 (Vsup) | 1.8 V |
| 表面贴装 | YES |
| 技术 | CMOS |
| 温度等级 | INDUSTRIAL |
| 端子面层 | Tin/Silver/Copper (Sn/Ag/Cu) |
| 端子形式 | BALL |
| 端子节距 | 0.5 mm |
| 端子位置 | BOTTOM |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED |
| 宽度 | 1.5 mm |
| 最长写入周期时间 (tWC) | 5 ms |
| 写保护 | HARDWARE |
| AT24C01D-CUM-T | AT24C02D-MAHM-T | AT24C02D-STUM-T | AT24C01D-STUM-T | AT24C01D-XHM-T | AT24C02D-CUM-T | AT24C01D-WWU11M | |
|---|---|---|---|---|---|---|---|
| 描述 | EEPROM, 128X8, Serial, CMOS, PBGA8, 1.50 X 2 MM, 0.50 MM PITCH, GREEN, VFBGA-8 | IC eeprom 2kbit 1mhz 8minimap | IC eeprom 2kbit 1mhz sot23-5 | EEPROM, 128X8, Serial, CMOS, PDSO5, 2.90 X 1.60 MM, GREEN, PLASTIC, MO-193AB, SOT23, 5-PINS | EEPROM, 128X8, Serial, CMOS, PDSO8, 4.40 MM, GREEN, PLASTIC, MO-153AA, TSSOP-8 | EEPROM, 256X8, Serial, CMOS, PBGA8, 1.50 X 2 MM, 0.50 MM PITCH, GREEN, VFBGA-8 | EEPROM, 128X8, Serial, CMOS, WAFER SALE |
| 厂商名称 | Atmel (Microchip) | Atmel (Microchip) | Atmel (Microchip) | Atmel (Microchip) | Atmel (Microchip) | Atmel (Microchip) | Atmel (Microchip) |
| 零件包装代码 | BGA | SON | TSOT | TSOT | TSSOP | BGA | WAFER |
| 包装说明 | 1.50 X 2 MM, 0.50 MM PITCH, GREEN, VFBGA-8 | HVSON, SOLCC8,.11,20 | VSSOP, TSOP5/6,.11,37 | 2.90 X 1.60 MM, GREEN, PLASTIC, MO-193AB, SOT23, 5-PINS | 4.40 MM, GREEN, PLASTIC, MO-153AA, TSSOP-8 | VFBGA, BGA8,2X4,40/20 | WAFER SALE |
| Reach Compliance Code | compli | compliant | compliant | compliant | compli | compli | compli |
| ECCN代码 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 |
| 其他特性 | ALSO COMPATIBLE WITH 2.5 V AT 1 MHZ | ALSO COMPATIBLE WITH 2.5 V AT 1 MHZ | ALSO COMPATIBLE WITH 2.5 V AT 1 MHZ | ALSO COMPATIBLE WITH 2.5 V AT 1 MHZ | ALSO COMPATIBLE WITH 2.5 V AT 1 MHZ | ALSO COMPATIBLE WITH 2.5 V AT 1 MHZ | ALSO COMPATIBLE WITH 2.5 V AT 1 MHZ |
| 最大时钟频率 (fCLK) | 0.4 MHz | 0.4 MHz | 0.4 MHz | 0.4 MHz | 0.4 MHz | 0.4 MHz | 0.4 MHz |
| JESD-30 代码 | R-PBGA-B8 | R-PDSO-N8 | R-PDSO-G5 | R-PDSO-G5 | R-PDSO-G8 | R-PBGA-B8 | R-PUUC-N |
| 内存密度 | 1024 bi | 2048 bit | 2048 bit | 1024 bit | 1024 bi | 2048 bi | 1024 bi |
| 内存集成电路类型 | EEPROM | EEPROM | EEPROM | EEPROM | EEPROM | EEPROM | EEPROM |
| 内存宽度 | 8 | 8 | 8 | 8 | 8 | 8 | 8 |
| 功能数量 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
| 字数 | 128 words | 256 words | 256 words | 128 words | 128 words | 256 words | 128 words |
| 字数代码 | 128 | 256 | 256 | 128 | 128 | 256 | 128 |
| 工作模式 | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS |
| 最高工作温度 | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C |
| 最低工作温度 | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C |
| 组织 | 128X8 | 256X8 | 256X8 | 128X8 | 128X8 | 256X8 | 128X8 |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | VFBGA | HVSON | VSSOP | VSSOP | TSSOP | VFBGA | DIE |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE | SMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | UNCASED CHIP |
| 并行/串行 | SERIAL | SERIAL | SERIAL | SERIAL | SERIAL | SERIAL | SERIAL |
| 串行总线类型 | I2C | I2C | I2C | I2C | I2C | I2C | I2C |
| 最大供电电压 (Vsup) | 3.6 V | 3.6 V | 3.6 V | 3.6 V | 3.6 V | 3.6 V | 3.6 V |
| 最小供电电压 (Vsup) | 1.7 V | 1.7 V | 1.7 V | 1.7 V | 1.7 V | 1.7 V | 1.7 V |
| 标称供电电压 (Vsup) | 1.8 V | 1.8 V | 1.8 V | 1.8 V | 1.8 V | 1.8 V | 1.8 V |
| 表面贴装 | YES | YES | YES | YES | YES | YES | YES |
| 技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL |
| 端子形式 | BALL | NO LEAD | GULL WING | GULL WING | GULL WING | BALL | NO LEAD |
| 端子位置 | BOTTOM | DUAL | DUAL | DUAL | DUAL | BOTTOM | UPPER |
| 最长写入周期时间 (tWC) | 5 ms | 5 ms | 5 ms | 5 ms | 5 ms | 5 ms | 5 ms |
| 是否Rohs认证 | 符合 | 符合 | 符合 | 符合 | 符合 | 符合 | - |
| 针数 | 8 | 8 | 5 | 5 | 8 | 8 | - |
| 数据保留时间-最小值 | 100 | 100 | 100 | 100 | 100 | 100 | - |
| 耐久性 | 1000000 Write/Erase Cycles | 1000000 Write/Erase Cycles | 1000000 Write/Erase Cycles | 1000000 Write/Erase Cycles | 1000000 Write/Erase Cycles | 1000000 Write/Erase Cycles | - |
| I2C控制字节 | 1010DDDR | 1010DDDR | 1010000R | 1010000R | 1010DDDR | 1010DDDR | - |
| 长度 | 2 mm | 3 mm | 2.9 mm | 2.9 mm | 4.4 mm | 2 mm | - |
| 端子数量 | 8 | 8 | 5 | 5 | 8 | 8 | - |
| 封装等效代码 | BGA8,2X4,40/20 | SOLCC8,.11,20 | TSOP5/6,.11,37 | TSOP5/6,.11,37 | TSSOP8,.25 | BGA8,2X4,40/20 | - |
| 峰值回流温度（摄氏度） | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | - |
| 电源 | 1.8/3.3 V | 1.8/3.3 V | 1.8/3.3 V | 1.8/3.3 V | 1.8/3.3 V | 1.8/3.3 V | - |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | - |
| 座面最大高度 | 0.85 mm | 0.6 mm | 1 mm | 1 mm | 1.2 mm | 0.85 mm | - |
| 最大待机电流 | 4e-7 A | 4e-7 A | 4e-7 A | 4e-7 A | 4e-7 A | 4e-7 A | - |
| 最大压摆率 | 0.001 mA | 0.001 mA | 0.001 mA | 0.001 mA | 0.001 mA | 0.001 mA | - |
| 端子节距 | 0.5 mm | 0.5 mm | 0.95 mm | 0.95 mm | 0.65 mm | 0.5 mm | - |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | - |
| 宽度 | 1.5 mm | 2 mm | 1.6 mm | 1.6 mm | 3 mm | 1.5 mm | - |
| 写保护 | HARDWARE | HARDWARE | HARDWARE | HARDWARE | HARDWARE | HARDWARE | - |
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