IC,EPROM,64KX8,CMOS,DIP,28PIN,CERAMIC
参数名称 | 属性值 |
是否Rohs认证 | 不符合 |
厂商名称 | ST(意法半导体) |
Reach Compliance Code | _compli |
最长访问时间 | 100 ns |
I/O 类型 | COMMON |
JESD-30 代码 | R-XDIP-T28 |
JESD-609代码 | e0 |
内存密度 | 524288 bi |
内存宽度 | 8 |
端子数量 | 28 |
字数 | 65536 words |
字数代码 | 64000 |
最高工作温度 | 105 °C |
最低工作温度 | -40 °C |
组织 | 64KX8 |
输出特性 | 3-STATE |
封装主体材料 | CERAMIC |
封装代码 | DIP |
封装等效代码 | DIP28,.6 |
封装形状 | RECTANGULAR |
封装形式 | IN-LINE |
电源 | 5 V |
认证状态 | Not Qualified |
最大待机电流 | 0.0002 A |
最大压摆率 | 0.03 mA |
标称供电电压 (Vsup) | 5 V |
表面贴装 | NO |
技术 | CMOS |
温度等级 | INDUSTRIAL |
端子面层 | Tin/Lead (Sn/Pb) |
端子形式 | THROUGH-HOLE |
端子节距 | 2.54 mm |
端子位置 | DUAL |
M27C512-10F7 | M27C512-15XF7 | M27C512-20F1L | M27C512-15XM1 | M27C512-10B7 | M27C512-10C7 | M27C512-10XB7 | M27C512-10XC7 | M27C512-10XF7 | M27C512-12B7 | |
---|---|---|---|---|---|---|---|---|---|---|
描述 | IC,EPROM,64KX8,CMOS,DIP,28PIN,CERAMIC | 64KX8 UVPROM, 150ns, CDIP28, FRIT SEALED, WINDOWED, CERAMIC, DIP-28 | 64KX8 UVPROM, 200ns, CDIP28, WINDOWED, FRIT SEALED, CERAMIC, DIP-28 | 64KX8 OTPROM, 150ns, PDSO28, PLASTIC, SOIC-28 | IC,EPROM,64KX8,CMOS,DIP,28PIN,PLASTIC | IC,EPROM,64KX8,CMOS,LDCC,32PIN,PLASTIC | IC,EPROM,64KX8,CMOS,DIP,28PIN,PLASTIC | IC,EPROM,64KX8,CMOS,LDCC,32PIN,PLASTIC | IC,EPROM,64KX8,CMOS,DIP,28PIN,CERAMIC | IC,EPROM,64KX8,CMOS,DIP,28PIN,PLASTIC |
是否Rohs认证 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 |
厂商名称 | ST(意法半导体) | ST(意法半导体) | ST(意法半导体) | ST(意法半导体) | ST(意法半导体) | ST(意法半导体) | ST(意法半导体) | ST(意法半导体) | ST(意法半导体) | ST(意法半导体) |
Reach Compliance Code | _compli | not_compliant | not_compliant | not_compliant | _compli | _compli | _compli | _compli | _compli | _compli |
最长访问时间 | 100 ns | 150 ns | 200 ns | 150 ns | 100 ns | 100 ns | 100 ns | 100 ns | 100 ns | 120 ns |
I/O 类型 | COMMON | COMMON | COMMON | COMMON | COMMON | COMMON | COMMON | COMMON | COMMON | COMMON |
JESD-30 代码 | R-XDIP-T28 | R-GDIP-T28 | R-GDIP-T28 | R-PDSO-G28 | R-PDIP-T28 | R-PQCC-J32 | R-PDIP-T28 | R-PQCC-J32 | R-XDIP-T28 | R-PDIP-T28 |
JESD-609代码 | e0 | e0 | e0 | e0 | e0 | e0 | e0 | e0 | e0 | e0 |
内存密度 | 524288 bi | 524288 bit | 524288 bit | 524288 bit | 524288 bi | 524288 bi | 524288 bi | 524288 bi | 524288 bi | 524288 bi |
内存宽度 | 8 | 8 | 8 | 8 | 8 | 8 | 8 | 8 | 8 | 8 |
端子数量 | 28 | 28 | 28 | 28 | 28 | 32 | 28 | 32 | 28 | 28 |
字数 | 65536 words | 65536 words | 65536 words | 65536 words | 65536 words | 65536 words | 65536 words | 65536 words | 65536 words | 65536 words |
字数代码 | 64000 | 64000 | 64000 | 64000 | 64000 | 64000 | 64000 | 64000 | 64000 | 64000 |
最高工作温度 | 105 °C | 105 °C | 70 °C | 70 °C | 125 °C | 105 °C | 125 °C | 105 °C | 105 °C | 105 °C |
最低工作温度 | -40 °C | -40 °C | - | - | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C |
组织 | 64KX8 | 64KX8 | 64KX8 | 64KX8 | 64KX8 | 64KX8 | 64KX8 | 64KX8 | 64KX8 | 64KX8 |
输出特性 | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE |
封装主体材料 | CERAMIC | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | CERAMIC | PLASTIC/EPOXY |
封装代码 | DIP | WDIP | WDIP | SOP | DIP | QCCJ | DIP | QCCJ | DIP | DIP |
封装等效代码 | DIP28,.6 | DIP28,.6 | DIP28,.6 | SOP28,.5 | DIP28,.6 | LDCC32,.5X.6 | DIP28,.6 | LDCC32,.5X.6 | DIP28,.6 | DIP28,.6 |
封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
封装形式 | IN-LINE | IN-LINE, WINDOW | IN-LINE, WINDOW | SMALL OUTLINE | IN-LINE | CHIP CARRIER | IN-LINE | CHIP CARRIER | IN-LINE | IN-LINE |
电源 | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
最大待机电流 | 0.0002 A | 0.0002 A | 0.0001 A | 0.0002 A | 0.0002 A | 0.0002 A | 0.0002 A | 0.0002 A | 0.0002 A | 0.0002 A |
最大压摆率 | 0.03 mA | 0.03 mA | 0.03 mA | 0.03 mA | 0.03 mA | 0.03 mA | 0.03 mA | 0.03 mA | 0.03 mA | 0.03 mA |
标称供电电压 (Vsup) | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
表面贴装 | NO | NO | NO | YES | NO | YES | NO | YES | NO | NO |
技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
温度等级 | INDUSTRIAL | INDUSTRIAL | COMMERCIAL | COMMERCIAL | AUTOMOTIVE | INDUSTRIAL | AUTOMOTIVE | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL |
端子面层 | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
端子形式 | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | GULL WING | THROUGH-HOLE | J BEND | THROUGH-HOLE | J BEND | THROUGH-HOLE | THROUGH-HOLE |
端子节距 | 2.54 mm | 2.54 mm | 2.54 mm | 1.27 mm | 2.54 mm | 1.27 mm | 2.54 mm | 1.27 mm | 2.54 mm | 2.54 mm |
端子位置 | DUAL | DUAL | DUAL | DUAL | DUAL | QUAD | DUAL | QUAD | DUAL | DUAL |
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