64KX8 OTPROM, 150ns, PDSO28, PLASTIC, SOIC-28
| 参数名称 | 属性值 |
| 是否无铅 | 含铅 |
| 是否Rohs认证 | 不符合 |
| 厂商名称 | ST(意法半导体) |
| 零件包装代码 | SOIC |
| 包装说明 | PLASTIC, SOIC-28 |
| 针数 | 28 |
| Reach Compliance Code | not_compliant |
| ECCN代码 | EAR99 |
| 最长访问时间 | 150 ns |
| I/O 类型 | COMMON |
| JESD-30 代码 | R-PDSO-G28 |
| JESD-609代码 | e0 |
| 长度 | 18.1 mm |
| 内存密度 | 524288 bit |
| 内存集成电路类型 | OTP ROM |
| 内存宽度 | 8 |
| 功能数量 | 1 |
| 端子数量 | 28 |
| 字数 | 65536 words |
| 字数代码 | 64000 |
| 工作模式 | ASYNCHRONOUS |
| 最高工作温度 | 70 °C |
| 最低工作温度 | |
| 组织 | 64KX8 |
| 输出特性 | 3-STATE |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | SOP |
| 封装等效代码 | SOP28,.5 |
| 封装形状 | RECTANGULAR |
| 封装形式 | SMALL OUTLINE |
| 并行/串行 | PARALLEL |
| 峰值回流温度（摄氏度） | NOT SPECIFIED |
| 电源 | 5 V |
| 认证状态 | Not Qualified |
| 座面最大高度 | 3.05 mm |
| 最大待机电流 | 0.0002 A |
| 最大压摆率 | 0.03 mA |
| 最大供电电压 (Vsup) | 5.25 V |
| 最小供电电压 (Vsup) | 4.75 V |
| 标称供电电压 (Vsup) | 5 V |
| 表面贴装 | YES |
| 技术 | CMOS |
| 温度等级 | COMMERCIAL |
| 端子面层 | Tin/Lead (Sn/Pb) |
| 端子形式 | GULL WING |
| 端子节距 | 1.27 mm |
| 端子位置 | DUAL |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED |
| 宽度 | 8.4 mm |
| M27C512-15XM1 | M27C512-15XF7 | M27C512-20F1L | M27C512-10B7 | M27C512-10C7 | M27C512-10F7 | M27C512-10XB7 | M27C512-10XC7 | M27C512-10XF7 | M27C512-12B7 | |
|---|---|---|---|---|---|---|---|---|---|---|
| 描述 | 64KX8 OTPROM, 150ns, PDSO28, PLASTIC, SOIC-28 | 64KX8 UVPROM, 150ns, CDIP28, FRIT SEALED, WINDOWED, CERAMIC, DIP-28 | 64KX8 UVPROM, 200ns, CDIP28, WINDOWED, FRIT SEALED, CERAMIC, DIP-28 | IC,EPROM,64KX8,CMOS,DIP,28PIN,PLASTIC | IC,EPROM,64KX8,CMOS,LDCC,32PIN,PLASTIC | IC,EPROM,64KX8,CMOS,DIP,28PIN,CERAMIC | IC,EPROM,64KX8,CMOS,DIP,28PIN,PLASTIC | IC,EPROM,64KX8,CMOS,LDCC,32PIN,PLASTIC | IC,EPROM,64KX8,CMOS,DIP,28PIN,CERAMIC | IC,EPROM,64KX8,CMOS,DIP,28PIN,PLASTIC |
| 是否Rohs认证 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 |
| 厂商名称 | ST(意法半导体) | ST(意法半导体) | ST(意法半导体) | ST(意法半导体) | ST(意法半导体) | ST(意法半导体) | ST(意法半导体) | ST(意法半导体) | ST(意法半导体) | ST(意法半导体) |
| Reach Compliance Code | not_compliant | not_compliant | not_compliant | _compli | _compli | _compli | _compli | _compli | _compli | _compli |
| 最长访问时间 | 150 ns | 150 ns | 200 ns | 100 ns | 100 ns | 100 ns | 100 ns | 100 ns | 100 ns | 120 ns |
| I/O 类型 | COMMON | COMMON | COMMON | COMMON | COMMON | COMMON | COMMON | COMMON | COMMON | COMMON |
| JESD-30 代码 | R-PDSO-G28 | R-GDIP-T28 | R-GDIP-T28 | R-PDIP-T28 | R-PQCC-J32 | R-XDIP-T28 | R-PDIP-T28 | R-PQCC-J32 | R-XDIP-T28 | R-PDIP-T28 |
| JESD-609代码 | e0 | e0 | e0 | e0 | e0 | e0 | e0 | e0 | e0 | e0 |
| 内存密度 | 524288 bit | 524288 bit | 524288 bit | 524288 bi | 524288 bi | 524288 bi | 524288 bi | 524288 bi | 524288 bi | 524288 bi |
| 内存宽度 | 8 | 8 | 8 | 8 | 8 | 8 | 8 | 8 | 8 | 8 |
| 端子数量 | 28 | 28 | 28 | 28 | 32 | 28 | 28 | 32 | 28 | 28 |
| 字数 | 65536 words | 65536 words | 65536 words | 65536 words | 65536 words | 65536 words | 65536 words | 65536 words | 65536 words | 65536 words |
| 字数代码 | 64000 | 64000 | 64000 | 64000 | 64000 | 64000 | 64000 | 64000 | 64000 | 64000 |
| 最高工作温度 | 70 °C | 105 °C | 70 °C | 125 °C | 105 °C | 105 °C | 125 °C | 105 °C | 105 °C | 105 °C |
| 最低工作温度 | - | -40 °C | - | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C |
| 组织 | 64KX8 | 64KX8 | 64KX8 | 64KX8 | 64KX8 | 64KX8 | 64KX8 | 64KX8 | 64KX8 | 64KX8 |
| 输出特性 | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE |
| 封装主体材料 | PLASTIC/EPOXY | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED | PLASTIC/EPOXY | PLASTIC/EPOXY | CERAMIC | PLASTIC/EPOXY | PLASTIC/EPOXY | CERAMIC | PLASTIC/EPOXY |
| 封装代码 | SOP | WDIP | WDIP | DIP | QCCJ | DIP | DIP | QCCJ | DIP | DIP |
| 封装等效代码 | SOP28,.5 | DIP28,.6 | DIP28,.6 | DIP28,.6 | LDCC32,.5X.6 | DIP28,.6 | DIP28,.6 | LDCC32,.5X.6 | DIP28,.6 | DIP28,.6 |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | SMALL OUTLINE | IN-LINE, WINDOW | IN-LINE, WINDOW | IN-LINE | CHIP CARRIER | IN-LINE | IN-LINE | CHIP CARRIER | IN-LINE | IN-LINE |
| 电源 | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 最大待机电流 | 0.0002 A | 0.0002 A | 0.0001 A | 0.0002 A | 0.0002 A | 0.0002 A | 0.0002 A | 0.0002 A | 0.0002 A | 0.0002 A |
| 最大压摆率 | 0.03 mA | 0.03 mA | 0.03 mA | 0.03 mA | 0.03 mA | 0.03 mA | 0.03 mA | 0.03 mA | 0.03 mA | 0.03 mA |
| 标称供电电压 (Vsup) | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| 表面贴装 | YES | NO | NO | NO | YES | NO | NO | YES | NO | NO |
| 技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | COMMERCIAL | INDUSTRIAL | COMMERCIAL | AUTOMOTIVE | INDUSTRIAL | INDUSTRIAL | AUTOMOTIVE | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL |
| 端子面层 | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| 端子形式 | GULL WING | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | J BEND | THROUGH-HOLE | THROUGH-HOLE | J BEND | THROUGH-HOLE | THROUGH-HOLE |
| 端子节距 | 1.27 mm | 2.54 mm | 2.54 mm | 2.54 mm | 1.27 mm | 2.54 mm | 2.54 mm | 1.27 mm | 2.54 mm | 2.54 mm |
| 端子位置 | DUAL | DUAL | DUAL | DUAL | QUAD | DUAL | DUAL | QUAD | DUAL | DUAL |
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