IC 256K X 1 STANDARD SRAM, 18 ns, CDFP24, 0.365 X 0.535 INCH, 0.762 MM PITCH, CERPACK-24, Static RAM
| 参数名称 | 属性值 |
| 是否Rohs认证 | 不符合 |
| 厂商名称 | National Semiconductor（TI ） |
| 包装说明 | DFP, FL24,.54,30 |
| Reach Compliance Code | unknow |
| ECCN代码 | EAR99 |
| 最长访问时间 | 18 ns |
| I/O 类型 | SEPARATE |
| JESD-30 代码 | R-GDFP-F24 |
| JESD-609代码 | e0 |
| 长度 | 13.665 mm |
| 内存密度 | 262144 bi |
| 内存集成电路类型 | STANDARD SRAM |
| 内存宽度 | 1 |
| 负电源额定电压 | -5.2 V |
| 功能数量 | 1 |
| 端口数量 | 1 |
| 端子数量 | 24 |
| 字数 | 262144 words |
| 字数代码 | 256000 |
| 工作模式 | ASYNCHRONOUS |
| 最高工作温度 | 85 °C |
| 最低工作温度 | |
| 组织 | 256KX1 |
| 输出特性 | OPEN-EMITTER |
| 可输出 | NO |
| 封装主体材料 | CERAMIC, GLASS-SEALED |
| 封装代码 | DFP |
| 封装等效代码 | FL24,.54,30 |
| 封装形状 | RECTANGULAR |
| 封装形式 | FLATPACK |
| 并行/串行 | PARALLEL |
| 峰值回流温度（摄氏度） | NOT SPECIFIED |
| 电源 | -5.2 V |
| 认证状态 | Not Qualified |
| 座面最大高度 | 2.15 mm |
| 最大压摆率 | 0.2 mA |
| 表面贴装 | YES |
| 技术 | BICMOS |
| 温度等级 | OTHER |
| 端子面层 | Tin/Lead (Sn/Pb) |
| 端子形式 | FLAT |
| 端子节距 | 0.762 mm |
| 端子位置 | DUAL |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED |
| 宽度 | 9.398 mm |
| NM5100F18 | NM100500D15 | NM100500D18 | NM100500F18 | NM5100F15 | NM100500F15 | NM5100D18 | NM5100D15 | |
|---|---|---|---|---|---|---|---|---|
| 描述 | IC 256K X 1 STANDARD SRAM, 18 ns, CDFP24, 0.365 X 0.535 INCH, 0.762 MM PITCH, CERPACK-24, Static RAM | IC 256K X 1 STANDARD SRAM, 15 ns, CDIP24, 0.400 INCH, HERMETIC SEALED, SIDE BRAZED, CERAMIC, DIP-24, Static RAM | IC 256K X 1 STANDARD SRAM, 18 ns, CDIP24, 0.400 INCH, HERMETIC SEALED, SIDE BRAZED, CERAMIC, DIP-24, Static RAM | IC 256K X 1 STANDARD SRAM, 18 ns, CDFP24, 0.365 X 0.535 INCH, 0.762 MM PITCH, CERPACK-24, Static RAM | IC 256K X 1 STANDARD SRAM, 15 ns, CDFP24, 0.365 X 0.535 INCH, 0.762 MM PITCH, CERPACK-24, Static RAM | IC 256K X 1 STANDARD SRAM, 15 ns, CDFP24, 0.365 X 0.535 INCH, 0.762 MM PITCH, CERPACK-24, Static RAM | IC 256K X 1 STANDARD SRAM, 18 ns, CDIP24, 0.400 INCH, HERMETIC SEALED, SIDE BRAZED, CERAMIC, DIP-24, Static RAM | IC 256K X 1 STANDARD SRAM, 15 ns, CDIP24, 0.400 INCH, HERMETIC SEALED, SIDE BRAZED, CERAMIC, DIP-24, Static RAM |
| 是否Rohs认证 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 |
| 厂商名称 | National Semiconductor（TI ） | National Semiconductor（TI ） | National Semiconductor（TI ） | National Semiconductor（TI ） | National Semiconductor（TI ） | National Semiconductor（TI ） | National Semiconductor（TI ） | National Semiconductor（TI ） |
| 包装说明 | DFP, FL24,.54,30 | DIP, DIP24,.4 | DIP, DIP24,.4 | DFP, FL24,.54,30 | DFP, FL24,.54,30 | DFP, FL24,.54,30 | DIP, DIP24,.4 | DIP, DIP24,.4 |
| Reach Compliance Code | unknow | unknown | unknown | unknown | unknown | unknown | unknow | unknow |
| ECCN代码 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 |
| 最长访问时间 | 18 ns | 15 ns | 18 ns | 18 ns | 15 ns | 15 ns | 18 ns | 15 ns |
| I/O 类型 | SEPARATE | SEPARATE | SEPARATE | SEPARATE | SEPARATE | SEPARATE | SEPARATE | SEPARATE |
| JESD-30 代码 | R-GDFP-F24 | R-CDIP-T24 | R-CDIP-T24 | R-GDFP-F24 | R-GDFP-F24 | R-GDFP-F24 | R-CDIP-T24 | R-CDIP-T24 |
| JESD-609代码 | e0 | e0 | e0 | e0 | e0 | e0 | e0 | e0 |
| 内存密度 | 262144 bi | 262144 bit | 262144 bit | 262144 bit | 262144 bit | 262144 bit | 262144 bi | 262144 bi |
| 内存集成电路类型 | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM |
| 内存宽度 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
| 负电源额定电压 | -5.2 V | -4.5 V | -4.5 V | -4.5 V | -5.2 V | -4.5 V | -5.2 V | -5.2 V |
| 功能数量 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
| 端口数量 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
| 端子数量 | 24 | 24 | 24 | 24 | 24 | 24 | 24 | 24 |
| 字数 | 262144 words | 262144 words | 262144 words | 262144 words | 262144 words | 262144 words | 262144 words | 262144 words |
| 字数代码 | 256000 | 256000 | 256000 | 256000 | 256000 | 256000 | 256000 | 256000 |
| 工作模式 | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS |
| 最高工作温度 | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C |
| 组织 | 256KX1 | 256KX1 | 256KX1 | 256KX1 | 256KX1 | 256KX1 | 256KX1 | 256KX1 |
| 输出特性 | OPEN-EMITTER | OPEN-EMITTER | OPEN-EMITTER | OPEN-EMITTER | OPEN-EMITTER | OPEN-EMITTER | OPEN-EMITTER | OPEN-EMITTER |
| 可输出 | NO | NO | NO | NO | NO | NO | NO | NO |
| 封装主体材料 | CERAMIC, GLASS-SEALED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED |
| 封装代码 | DFP | DIP | DIP | DFP | DFP | DFP | DIP | DIP |
| 封装等效代码 | FL24,.54,30 | DIP24,.4 | DIP24,.4 | FL24,.54,30 | FL24,.54,30 | FL24,.54,30 | DIP24,.4 | DIP24,.4 |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | FLATPACK | IN-LINE | IN-LINE | FLATPACK | FLATPACK | FLATPACK | IN-LINE | IN-LINE |
| 并行/串行 | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL |
| 峰值回流温度（摄氏度） | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| 电源 | -5.2 V | -4.5 V | -4.5 V | -4.5 V | -5.2 V | -4.5 V | -5.2 V | -5.2 V |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 座面最大高度 | 2.15 mm | 5.08 mm | 5.08 mm | 2.15 mm | 2.15 mm | 2.15 mm | 5.08 mm | 5.08 mm |
| 最大压摆率 | 0.2 mA | 0.2 mA | 0.2 mA | 0.2 mA | 0.2 mA | 0.2 mA | 0.2 mA | 0.2 mA |
| 表面贴装 | YES | NO | NO | YES | YES | YES | NO | NO |
| 技术 | BICMOS | BICMOS | BICMOS | BICMOS | BICMOS | BICMOS | BICMOS | BICMOS |
| 温度等级 | OTHER | OTHER | OTHER | OTHER | OTHER | OTHER | OTHER | OTHER |
| 端子面层 | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| 端子形式 | FLAT | THROUGH-HOLE | THROUGH-HOLE | FLAT | FLAT | FLAT | THROUGH-HOLE | THROUGH-HOLE |
| 端子节距 | 0.762 mm | 2.54 mm | 2.54 mm | 0.762 mm | 0.762 mm | 0.762 mm | 2.54 mm | 2.54 mm |
| 端子位置 | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| 宽度 | 9.398 mm | 10.16 mm | 10.16 mm | 9.398 mm | 9.398 mm | 9.398 mm | 10.16 mm | 10.16 mm |
微控制器 MCU
综合技术交流
DSP 与 ARM 处理器
汽车电子
嵌入式系统
微控制器 MCU
电子工程世界版权所有
京B2-20211791
京ICP备10001474号-1
电信业务审批[2006]字第258号函
京公网安备 11010802033920号
Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved
电子工程世界
