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MCM54402AT80

产品描述1MX4 STATIC COLUMN DRAM, 80ns, PDSO20, 0.300 INCH, TSOP-26/20
产品类别存储    存储   
文件大小678KB,共22页
制造商Motorola ( NXP )
官网地址https://www.nxp.com
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MCM54402AT80概述

1MX4 STATIC COLUMN DRAM, 80ns, PDSO20, 0.300 INCH, TSOP-26/20

MCM54402AT80规格参数

参数名称属性值
厂商名称Motorola ( NXP )
零件包装代码TSOP
包装说明LSOP,
针数20
Reach Compliance Codeunknow
ECCN代码EAR99
访问模式STATIC COLUMN
最长访问时间80 ns
其他特性RAS ONLY; CAS BEFORE RAS; HIDDEN REFRESH
JESD-30 代码R-PDSO-G20
JESD-609代码e0
长度17.15 mm
内存密度4194304 bi
内存集成电路类型STATIC COLUMN DRAM
内存宽度4
功能数量1
端口数量1
端子数量20
字数1048576 words
字数代码1000000
工作模式ASYNCHRONOUS
最高工作温度70 °C
最低工作温度
组织1MX4
封装主体材料PLASTIC/EPOXY
封装代码LSOP
封装形状RECTANGULAR
封装形式SMALL OUTLINE, LOW PROFILE
认证状态Not Qualified
刷新周期1024
座面最大高度1.27 mm
最大供电电压 (Vsup)5.5 V
最小供电电压 (Vsup)4.5 V
标称供电电压 (Vsup)5 V
表面贴装YES
技术CMOS
温度等级COMMERCIAL
端子面层Tin/Lead (Sn/Pb)
端子形式GULL WING
端子节距1.27 mm
端子位置DUAL
宽度7.62 mm

MCM54402AT80相似产品对比

MCM54402AT80 MCM54402AZ60 MCM54402AZ70 MCM54402AN60 MCM54402AT60 MCM54402AT70 MCM54402AZ80 MCM54402AN80 MCM54402AN70
描述 1MX4 STATIC COLUMN DRAM, 80ns, PDSO20, 0.300 INCH, TSOP-26/20 1MX4 STATIC COLUMN DRAM, 60ns, PZIP20, 2.54 MM PITCH, PLASTIC, ZIP-20 1MX4 STATIC COLUMN DRAM, 70ns, PZIP20, 2.54 MM PITCH, PLASTIC, ZIP-20 1MX4 STATIC COLUMN DRAM, 60ns, PDSO20, 0.300 INCH, SOJ-20 1MX4 STATIC COLUMN DRAM, 60ns, PDSO20, 0.300 INCH, TSOP-26/20 1MX4 STATIC COLUMN DRAM, 70ns, PDSO20, 0.300 INCH, TSOP-26/20 1M X 4 STATIC COLUMN DRAM, 80 ns, PZIP20, 2.54 MM PITCH, PLASTIC, ZIP-20 1MX4 STATIC COLUMN DRAM, 80ns, PDSO20, 0.300 INCH, SOJ-20 1MX4 STATIC COLUMN DRAM, 70ns, PDSO20, 0.300 INCH, SOJ-20
零件包装代码 TSOP ZIP ZIP SOJ TSOP TSOP ZIP SOJ SOJ
包装说明 LSOP, ZIP, ZIP, SOJ, LSOP, LSOP, ZIP, SOJ, SOJ,
针数 20 20 20 20 20 20 20 20 20
Reach Compliance Code unknow unknown unknown unknown unknown unknown unknown unknown unknown
ECCN代码 EAR99 EAR99 EAR99 EAR99 EAR99 EAR99 EAR99 EAR99 EAR99
访问模式 STATIC COLUMN STATIC COLUMN STATIC COLUMN STATIC COLUMN STATIC COLUMN STATIC COLUMN STATIC COLUMN STATIC COLUMN STATIC COLUMN
最长访问时间 80 ns 60 ns 70 ns 60 ns 60 ns 70 ns 80 ns 80 ns 70 ns
其他特性 RAS ONLY; CAS BEFORE RAS; HIDDEN REFRESH RAS ONLY; CAS BEFORE RAS; HIDDEN REFRESH RAS ONLY; CAS BEFORE RAS; HIDDEN REFRESH RAS ONLY; CAS BEFORE RAS; HIDDEN REFRESH RAS ONLY; CAS BEFORE RAS; HIDDEN REFRESH RAS ONLY; CAS BEFORE RAS; HIDDEN REFRESH RAS ONLY; CAS BEFORE RAS; HIDDEN REFRESH RAS ONLY; CAS BEFORE RAS; HIDDEN REFRESH RAS ONLY; CAS BEFORE RAS; HIDDEN REFRESH
JESD-30 代码 R-PDSO-G20 R-PZIP-T20 R-PZIP-T20 R-PDSO-J20 R-PDSO-G20 R-PDSO-G20 R-PZIP-T20 R-PDSO-J20 R-PDSO-J20
JESD-609代码 e0 e0 e0 e0 e0 e0 e0 e0 e0
长度 17.15 mm 25.715 mm 25.715 mm 17.145 mm 17.15 mm 17.15 mm 25.715 mm 17.145 mm 17.145 mm
内存密度 4194304 bi 4194304 bit 4194304 bit 4194304 bit 4194304 bit 4194304 bit 4194304 bit 4194304 bit 4194304 bit
内存集成电路类型 STATIC COLUMN DRAM STATIC COLUMN DRAM STATIC COLUMN DRAM STATIC COLUMN DRAM STATIC COLUMN DRAM STATIC COLUMN DRAM STATIC COLUMN DRAM STATIC COLUMN DRAM STATIC COLUMN DRAM
内存宽度 4 4 4 4 4 4 4 4 4
功能数量 1 1 1 1 1 1 1 1 1
端口数量 1 1 1 1 1 1 1 1 1
端子数量 20 20 20 20 20 20 20 20 20
字数 1048576 words 1048576 words 1048576 words 1048576 words 1048576 words 1048576 words 1048576 words 1048576 words 1048576 words
字数代码 1000000 1000000 1000000 1000000 1000000 1000000 1000000 1000000 1000000
工作模式 ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS
最高工作温度 70 °C 70 °C 70 °C 70 °C 70 °C 70 °C 70 °C 70 °C 70 °C
组织 1MX4 1MX4 1MX4 1MX4 1MX4 1MX4 1MX4 1MX4 1MX4
封装主体材料 PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
封装代码 LSOP ZIP ZIP SOJ LSOP LSOP ZIP SOJ SOJ
封装形状 RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR
封装形式 SMALL OUTLINE, LOW PROFILE IN-LINE IN-LINE SMALL OUTLINE SMALL OUTLINE, LOW PROFILE SMALL OUTLINE, LOW PROFILE IN-LINE SMALL OUTLINE SMALL OUTLINE
认证状态 Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified
刷新周期 1024 1024 1024 1024 1024 1024 1024 1024 1024
座面最大高度 1.27 mm 10.16 mm 10.16 mm 3.75 mm 1.27 mm 1.27 mm 10.16 mm 3.75 mm 3.75 mm
最大供电电压 (Vsup) 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V
最小供电电压 (Vsup) 4.5 V 4.5 V 4.5 V 4.5 V 4.5 V 4.5 V 4.5 V 4.5 V 4.5 V
标称供电电压 (Vsup) 5 V 5 V 5 V 5 V 5 V 5 V 5 V 5 V 5 V
表面贴装 YES NO NO YES YES YES NO YES YES
技术 CMOS CMOS CMOS CMOS CMOS CMOS CMOS CMOS CMOS
温度等级 COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL
端子面层 Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb)
端子形式 GULL WING THROUGH-HOLE THROUGH-HOLE J BEND GULL WING GULL WING THROUGH-HOLE J BEND J BEND
端子节距 1.27 mm 1.27 mm 1.27 mm 1.27 mm 1.27 mm 1.27 mm 1.27 mm 1.27 mm 1.27 mm
端子位置 DUAL ZIG-ZAG ZIG-ZAG DUAL DUAL DUAL ZIG-ZAG DUAL DUAL
宽度 7.62 mm 2.85 mm 2.85 mm 7.62 mm 7.62 mm 7.62 mm 2.85 mm 7.62 mm 7.62 mm
厂商名称 Motorola ( NXP ) Motorola ( NXP ) - - - - Motorola ( NXP ) Motorola ( NXP ) Motorola ( NXP )
输出特性 - 3-STATE 3-STATE 3-STATE - - 3-STATE 3-STATE 3-STATE

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