Flash, 1MX8, 70ns, PDSO40, 10 X 20 MM, PLASTIC, TSOP1-40
| 参数名称 | 属性值 |
| 厂商名称 | Micron Technology |
| 零件包装代码 | TSOP1 |
| 包装说明 | 10 X 20 MM, PLASTIC, TSOP1-40 |
| 针数 | 40 |
| Reach Compliance Code | unknow |
| ECCN代码 | EAR99 |
| 最长访问时间 | 70 ns |
| 其他特性 | SELECTABLE 3V OR 5V VPP |
| JESD-30 代码 | R-PDSO-G40 |
| JESD-609代码 | e3 |
| 长度 | 18.4 mm |
| 内存密度 | 8388608 bi |
| 内存集成电路类型 | FLASH |
| 内存宽度 | 8 |
| 功能数量 | 1 |
| 端子数量 | 40 |
| 字数 | 1048576 words |
| 字数代码 | 1000000 |
| 工作模式 | ASYNCHRONOUS |
| 组织 | 1MX8 |
| 输出特性 | 3-STATE |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | TSOP1 |
| 封装形状 | RECTANGULAR |
| 封装形式 | SMALL OUTLINE, THIN PROFILE |
| 并行/串行 | PARALLEL |
| 编程电压 | 3 V |
| 认证状态 | Not Qualified |
| 座面最大高度 | 1.2 mm |
| 最大供电电压 (Vsup) | 5.5 V |
| 最小供电电压 (Vsup) | 3 V |
| 标称供电电压 (Vsup) | 5 V |
| 表面贴装 | YES |
| 技术 | CMOS |
| 端子面层 | MATTE TIN |
| 端子形式 | GULL WING |
| 端子节距 | 0.5 mm |
| 端子位置 | DUAL |
| 宽度 | 10 mm |
| MT28F008S2VG-7 | MT28F008S2SG-9 | MT28F008S2VG-12 | MT28F008S2SG-12 | MT28F008S2VG-9 | |
|---|---|---|---|---|---|
| 描述 | Flash, 1MX8, 70ns, PDSO40, 10 X 20 MM, PLASTIC, TSOP1-40 | Flash, 1MX8, 90ns, PDSO44, 0.600 INCH, PLASTIC, SOP-44 | Flash, 1MX8, 120ns, PDSO40, 10 X 20 MM, PLASTIC, TSOP1-40 | Flash, 1MX8, 120ns, PDSO44, 0.600 INCH, PLASTIC, SOP-44 | Flash, 1MX8, 90ns, PDSO40, 10 X 20 MM, PLASTIC, TSOP1-40 |
| 厂商名称 | Micron Technology | Micron Technology | Micron Technology | Micron Technology | Micron Technology |
| 零件包装代码 | TSOP1 | SOIC | TSOP1 | SOIC | TSOP1 |
| 包装说明 | 10 X 20 MM, PLASTIC, TSOP1-40 | 0.600 INCH, PLASTIC, SOP-44 | TSOP1, | 0.600 INCH, PLASTIC, SOP-44 | TSOP1, |
| 针数 | 40 | 44 | 40 | 44 | 40 |
| Reach Compliance Code | unknow | unknown | unknown | unknown | unknown |
| ECCN代码 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 |
| 最长访问时间 | 70 ns | 90 ns | 120 ns | 120 ns | 90 ns |
| 其他特性 | SELECTABLE 3V OR 5V VPP | SELECTABLE 3V OR 5V VPP | SELECTABLE 3V OR 5V VPP | SELECTABLE 3V OR 5V VPP | SELECTABLE 3V OR 5V VPP |
| JESD-30 代码 | R-PDSO-G40 | R-PDSO-G44 | R-PDSO-G40 | R-PDSO-G44 | R-PDSO-G40 |
| 长度 | 18.4 mm | 28.195 mm | 18.4 mm | 28.195 mm | 18.4 mm |
| 内存密度 | 8388608 bi | 8388608 bit | 8388608 bit | 8388608 bit | 8388608 bit |
| 内存集成电路类型 | FLASH | FLASH | FLASH | FLASH | FLASH |
| 内存宽度 | 8 | 8 | 8 | 8 | 8 |
| 功能数量 | 1 | 1 | 1 | 1 | 1 |
| 端子数量 | 40 | 44 | 40 | 44 | 40 |
| 字数 | 1048576 words | 1048576 words | 1048576 words | 1048576 words | 1048576 words |
| 字数代码 | 1000000 | 1000000 | 1000000 | 1000000 | 1000000 |
| 工作模式 | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS |
| 组织 | 1MX8 | 1MX8 | 1MX8 | 1MX8 | 1MX8 |
| 输出特性 | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | TSOP1 | SOP | TSOP1 | SOP | TSOP1 |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | SMALL OUTLINE, THIN PROFILE | SMALL OUTLINE | SMALL OUTLINE, THIN PROFILE | SMALL OUTLINE | SMALL OUTLINE, THIN PROFILE |
| 并行/串行 | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL |
| 编程电压 | 3 V | 3 V | 3 V | 3 V | 3 V |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 座面最大高度 | 1.2 mm | 2.7 mm | 1.2 mm | 2.7 mm | 1.2 mm |
| 最大供电电压 (Vsup) | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
| 最小供电电压 (Vsup) | 3 V | 3 V | 3 V | 3 V | 3 V |
| 标称供电电压 (Vsup) | 5 V | 5 V | 5 V | 5 V | 5 V |
| 表面贴装 | YES | YES | YES | YES | YES |
| 技术 | CMOS | CMOS | CMOS | CMOS | CMOS |
| 端子形式 | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING |
| 端子节距 | 0.5 mm | 1.27 mm | 0.5 mm | 1.27 mm | 0.5 mm |
| 端子位置 | DUAL | DUAL | DUAL | DUAL | DUAL |
| 宽度 | 10 mm | 12.6 mm | 10 mm | 12.6 mm | 10 mm |
| JESD-609代码 | e3 | - | e3 | - | e3 |
| 端子面层 | MATTE TIN | - | MATTE TIN | - | MATTE TIN |
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