AT16244 Fast Logic 16-Bit Buffer/Line Driver
| AT16244F | AT16244F-25XC | AT16244G | AT16244G-20XC | AT16244F-25YC | AT16244G-20YC | |
|---|---|---|---|---|---|---|
| 描述 | AT16244 Fast Logic 16-Bit Buffer/Line Driver | AT16244 Fast Logic 16-Bit Buffer/Line Driver | AT16244 Fast Logic 16-Bit Buffer/Line Driver | AT16244 Fast Logic 16-Bit Buffer/Line Driver | AT16244 Fast Logic 16-Bit Buffer/Line Driver | AT16244 Fast Logic 16-Bit Buffer/Line Driver |
| 是否Rohs认证 | - | 不符合 | - | 不符合 | 不符合 | 不符合 |
| 零件包装代码 | - | TSSOP | - | TSSOP | SSOP | SSOP |
| 包装说明 | - | TSSOP, TSSOP48,.3,20 | - | TSSOP, TSSOP48,.3,20 | SSOP, SSOP48,.4 | SSOP, SSOP48,.4 |
| 针数 | - | 48 | - | 48 | 48 | 48 |
| Reach Compliance Code | - | compli | - | compli | compli | compli |
| 控制类型 | - | ENABLE LOW | - | ENABLE LOW | ENABLE LOW | ENABLE LOW |
| JESD-30 代码 | - | R-PDSO-G48 | - | R-PDSO-G48 | R-PDSO-G48 | R-PDSO-G48 |
| JESD-609代码 | - | e0 | - | e0 | e0 | e0 |
| 长度 | - | 12.5 mm | - | 12.5 mm | 15.875 mm | 15.875 mm |
| 负载电容（CL） | - | 50 pF | - | 50 pF | 50 pF | 50 pF |
| 逻辑集成电路类型 | - | BUS DRIVER | - | BUS DRIVER | BUS DRIVER | BUS DRIVER |
| 最大I（ol） | - | 0.01 A | - | 0.012 A | 0.01 A | 0.012 A |
| 位数 | - | 4 | - | 4 | 4 | 4 |
| 功能数量 | - | 4 | - | 4 | 4 | 4 |
| 端口数量 | - | 2 | - | 2 | 2 | 2 |
| 端子数量 | - | 48 | - | 48 | 48 | 48 |
| 最高工作温度 | - | 70 °C | - | 70 °C | 70 °C | 70 °C |
| 输出特性 | - | 3-STATE | - | 3-STATE | 3-STATE | 3-STATE |
| 输出极性 | - | TRUE | - | TRUE | TRUE | TRUE |
| 封装主体材料 | - | PLASTIC/EPOXY | - | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | - | TSSOP | - | TSSOP | SSOP | SSOP |
| 封装等效代码 | - | TSSOP48,.3,20 | - | TSSOP48,.3,20 | SSOP48,.4 | SSOP48,.4 |
| 封装形状 | - | RECTANGULAR | - | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | - | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | - | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, SHRINK PITCH | SMALL OUTLINE, SHRINK PITCH |
| 峰值回流温度（摄氏度） | - | 240 | - | 240 | NOT SPECIFIED | NOT SPECIFIED |
| 电源 | - | 5 V | - | 5 V | 5 V | 5 V |
| Prop。Delay @ Nom-Su | - | 2.5 ns | - | 2 ns | 2.5 ns | 2 ns |
| 传播延迟（tpd） | - | 2.5 ns | - | 2 ns | 2.5 ns | 2 ns |
| 认证状态 | - | Not Qualified | - | Not Qualified | Not Qualified | Not Qualified |
| 座面最大高度 | - | 1.2 mm | - | 1.2 mm | 2.79 mm | 2.79 mm |
| 最大供电电压 (Vsup) | - | 5.25 V | - | 5.25 V | 5.25 V | 5.25 V |
| 最小供电电压 (Vsup) | - | 4.75 V | - | 4.75 V | 4.75 V | 4.75 V |
| 标称供电电压 (Vsup) | - | 5 V | - | 5 V | 5 V | 5 V |
| 表面贴装 | - | YES | - | YES | YES | YES |
| 技术 | - | CMOS | - | CMOS | CMOS | CMOS |
| 温度等级 | - | COMMERCIAL | - | COMMERCIAL | COMMERCIAL | COMMERCIAL |
| 端子面层 | - | Tin/Lead (Sn/Pb) | - | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| 端子形式 | - | GULL WING | - | GULL WING | GULL WING | GULL WING |
| 端子节距 | - | 0.5 mm | - | 0.5 mm | 0.635 mm | 0.635 mm |
| 端子位置 | - | DUAL | - | DUAL | DUAL | DUAL |
| 处于峰值回流温度下的最长时间 | - | 30 | - | 30 | NOT SPECIFIED | NOT SPECIFIED |
| 宽度 | - | 6.1 mm | - | 6.1 mm | 7.505 mm | 7.505 mm |
模拟与混合信号
嵌入式系统
ARM技术
RF/无线
工控电子
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