EE PLD, 20ns, CMOS, PQCC44, PLASTIC, LCC-44
参数名称 | 属性值 |
厂商名称 | Lattice(莱迪斯) |
零件包装代码 | LCC |
包装说明 | QCCJ, |
针数 | 44 |
Reach Compliance Code | unknown |
ECCN代码 | EAR99 |
最大时钟频率 | 51.3 MHz |
JESD-30 代码 | S-PQCC-J44 |
长度 | 16.5862 mm |
专用输入次数 | |
I/O 线路数量 | 32 |
端子数量 | 44 |
组织 | 0 DEDICATED INPUTS, 32 I/O |
输出函数 | MACROCELL |
封装主体材料 | PLASTIC/EPOXY |
封装代码 | QCCJ |
封装形状 | SQUARE |
封装形式 | CHIP CARRIER |
可编程逻辑类型 | EE PLD |
传播延迟 | 20 ns |
认证状态 | Not Qualified |
座面最大高度 | 4.57 mm |
标称供电电压 | 3.3 V |
表面贴装 | YES |
技术 | CMOS |
端子形式 | J BEND |
端子节距 | 1.27 mm |
端子位置 | QUAD |
宽度 | 16.5862 mm |
ISPLSI2032V-60LJ | ISPLSI2032V-100LJ | ISPLSI2032V-60LJI | ISPLSI2032V-80LJ | ISPLSI2032V-100LT | ISPLSI2032V-60LTI | ISPLSI2032V-60LT | ISPLSI2032V-80LT | |
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描述 | EE PLD, 20ns, CMOS, PQCC44, PLASTIC, LCC-44 | EE PLD, 12ns, CMOS, PQCC44, PLASTIC, LCC-44 | EE PLD, 20ns, CMOS, PQCC44, PLASTIC, LCC-44 | EE PLD, 15ns, CMOS, PQCC44, PLASTIC, LCC-44 | EE PLD, 12ns, CMOS, PQFP44, TQFP-44 | EE PLD, 20ns, CMOS, PQFP44, TQFP-44 | EE PLD, 20ns, CMOS, PQFP44, TQFP-44 | EE PLD, 15ns, CMOS, PQFP44, TQFP-44 |
厂商名称 | Lattice(莱迪斯) | Lattice(莱迪斯) | Lattice(莱迪斯) | Lattice(莱迪斯) | Lattice(莱迪斯) | Lattice(莱迪斯) | Lattice(莱迪斯) | Lattice(莱迪斯) |
零件包装代码 | LCC | LCC | LCC | LCC | QFP | QFP | QFP | QFP |
包装说明 | QCCJ, | QCCJ, | QCCJ, | QCCJ, | LQFP, | LQFP, | LQFP, | LQFP, |
针数 | 44 | 44 | 44 | 44 | 44 | 44 | 44 | 44 |
Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknown | unknown | unknown |
ECCN代码 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 |
最大时钟频率 | 51.3 MHz | 83.3 MHz | 51.3 MHz | 64.5 MHz | 83.3 MHz | 51.3 MHz | 51.3 MHz | 64.5 MHz |
JESD-30 代码 | S-PQCC-J44 | S-PQCC-J44 | S-PQCC-J44 | S-PQCC-J44 | S-PQFP-G44 | S-PQFP-G44 | S-PQFP-G44 | S-PQFP-G44 |
长度 | 16.5862 mm | 16.5862 mm | 16.5862 mm | 16.5862 mm | 10 mm | 10 mm | 10 mm | 10 mm |
I/O 线路数量 | 32 | 32 | 32 | 32 | 32 | 32 | 32 | 32 |
端子数量 | 44 | 44 | 44 | 44 | 44 | 44 | 44 | 44 |
组织 | 0 DEDICATED INPUTS, 32 I/O | 2 DEDICATED INPUTS, 32 I/O | 0 DEDICATED INPUTS, 32 I/O | 0 DEDICATED INPUTS, 32 I/O | 0 DEDICATED INPUTS, 32 I/O | 0 DEDICATED INPUTS, 32 I/O | 0 DEDICATED INPUTS, 32 I/O | 0 DEDICATED INPUTS, 32 I/O |
输出函数 | MACROCELL | MACROCELL | MACROCELL | MACROCELL | MACROCELL | MACROCELL | MACROCELL | MACROCELL |
封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
封装代码 | QCCJ | QCCJ | QCCJ | QCCJ | LQFP | LQFP | LQFP | LQFP |
封装形状 | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE |
封装形式 | CHIP CARRIER | CHIP CARRIER | CHIP CARRIER | CHIP CARRIER | FLATPACK, LOW PROFILE | FLATPACK, LOW PROFILE | FLATPACK, LOW PROFILE | FLATPACK, LOW PROFILE |
可编程逻辑类型 | EE PLD | EE PLD | EE PLD | EE PLD | EE PLD | EE PLD | EE PLD | EE PLD |
传播延迟 | 20 ns | 12 ns | 20 ns | 15 ns | 12 ns | 20 ns | 20 ns | 15 ns |
认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
座面最大高度 | 4.57 mm | 4.57 mm | 4.57 mm | 4.57 mm | 1.6 mm | 1.6 mm | 1.6 mm | 1.6 mm |
标称供电电压 | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V |
表面贴装 | YES | YES | YES | YES | YES | YES | YES | YES |
技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
端子形式 | J BEND | J BEND | J BEND | J BEND | GULL WING | GULL WING | GULL WING | GULL WING |
端子节距 | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm | 0.8 mm | 0.8 mm | 0.8 mm | 0.8 mm |
端子位置 | QUAD | QUAD | QUAD | QUAD | QUAD | QUAD | QUAD | QUAD |
宽度 | 16.5862 mm | 16.5862 mm | 16.5862 mm | 16.5862 mm | 10 mm | 10 mm | 10 mm | 10 mm |
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