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CTLM3410-M832DBKLEADFREE

产品描述Transistor
产品类别分立半导体    晶体管   
文件大小402KB,共2页
制造商Central Semiconductor
标准
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CTLM3410-M832DBKLEADFREE概述

Transistor

CTLM3410-M832DBKLEADFREE规格参数

参数名称属性值
是否Rohs认证符合
厂商名称Central Semiconductor
包装说明,
Reach Compliance Codeunknown
最大集电极电流 (IC)1 A
最小直流电流增益 (hFE)100
最高工作温度150 °C
极性/信道类型NPN
最大功率耗散 (Abs)1.65 W
表面贴装YES
标称过渡频率 (fT)100 MHz

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CTLM3410-M832D
CTLM7410-M832D
CTLM3474-M832D
SURFACE MOUNT
DUAL, LOW VCE (SAT)
SILICON TRANSISTORS
w w w. c e n t r a l s e m i . c o m
TLM832D CASE
MARKING CODES:
CTLM3410-M832D: CFG
CTLM7410-M832D: CFH
CTLM3474-M832D: CFJ
APPLICATIONS
Switching Circuits
DC - DC Converters
LCD Backlighting
Battery powered / Portable Equipment
applications including Cell Phones,
Digital Cameras, Pagers, PDAs,
Notebook PCs, etc.
MAXIMUM RATINGS:
(TA=25°C)
Collector-Base Voltage
Collector-Emitter Voltage
Emitter-Base Voltage
Continuous Collector Current
Power Dissipation (Note 1)
Operating and Storage Junction Temperature
Thermal Resistance
DESCRIPTION:
The CENTRAL SEMICONDUCTOR CTLM3410-
M832D (Dual NPN), CTLM7410-M832D (Dual PNP),
and CTLM3474-M832D (Complementary NPN & PNP)
are Low VCE(SAT) Transistors packaged in the small,
thermally efficient, 3x2mm Tiny Leadless Module
(TLM™) surface mount case. These devices are
designed for applications where small size, operational
efficiency, and low energy consumption are the prime
requirements. Due to its leadless package design this
device is capable of dissipating up to 4 times the power
of similar devices in comparable sized surface mount
packages.
FEATURES
Dual Chip Device
High Current (1.0A) Transistors
Low VCE(SAT) Transistors (450mV @ IC=1.0A MAX)
High Power to Footprint Ratio of 275mW per sq mm
(Package Power Dissipation / Package Surface Area)
Small TLM 3x2mm Leadless Surface Mount Package
Complementary Devices
SYMBOL
VCBO
VCEO
VEBO
IC
PD
TJ, Tstg
Θ
JA
UNITS
V
V
V
A
W
°C
°C/W
40
25
6.0
1.0
1.65
-65 to +150
76
ELECTRICAL CHARACTERISTICS PER TRANSISTOR:
(TA=25°C unless otherwise noted)
NPN
PNP
SYMBOL
TEST CONDITIONS
MIN
TYP
TYP
MAX
ICBO
VCB=40V
100
IEBO
VEB=6.0V
100
BVCBO
IC=100µA
40
BVCEO
BVEBO
VCE(SAT)
VCE(SAT)
IC=10mA
IE=100µA
IC=50mA, IB=5.0mA
IC=100mA, IB=10mA
25
6.0
25
40
30
50
50
75
UNITS
nA
nA
V
V
V
mV
mV
Notes: (1) FR-4 Epoxy PCB with copper mounting pad area of 54mm
2
.
R3 (1-August 2011)

CTLM3410-M832DBKLEADFREE相似产品对比

CTLM3410-M832DBKLEADFREE CTLM3474-M832DTR CTLM3474-M832DTRLEADFREE CTLM3410-M832DTR CTLM7410-M832DTRLEADFREE CTLM7410-M832DTR CTLM3474-M832DBK CTLM7410-M832DBK CTLM7410-M832DBKLEADFREE CTLM3410-M832DBK
描述 Transistor Power Bipolar Transistor, 1A I(C), 25V V(BR)CEO, 2-Element, NPN and PNP, Silicon, Plastic/Epoxy, 8 Pin, 3 X 2 MM, LEADLESS PACKAGE-10 Small Signal Bipolar Transistor, 1A I(C), NPN and PNP Power Bipolar Transistor, 1A I(C), 25V V(BR)CEO, 2-Element, NPN, Silicon, Plastic/Epoxy, 8 Pin, 3 X 2 MM, LEADLESS PACKAGE-10 Transistor Power Bipolar Transistor, 1A I(C), 25V V(BR)CEO, 2-Element, PNP, Silicon, Plastic/Epoxy, 8 Pin, 3 X 2 MM, LEADLESS PACKAGE-10 Power Bipolar Transistor, 1A I(C), 25V V(BR)CEO, 2-Element, NPN and PNP, Silicon, Plastic/Epoxy, 8 Pin, 3 X 2 MM, LEADLESS PACKAGE-10 Power Bipolar Transistor, 1A I(C), 25V V(BR)CEO, 2-Element, PNP, Silicon, Plastic/Epoxy, 8 Pin, 3 X 2 MM, LEADLESS PACKAGE-10 Transistor Power Bipolar Transistor, 1A I(C), 25V V(BR)CEO, 2-Element, NPN, Silicon, Plastic/Epoxy, 8 Pin, 3 X 2 MM, LEADLESS PACKAGE-10
是否Rohs认证 符合 符合 符合 符合 符合 符合 符合 符合 符合 符合
包装说明 , 3 X 2 MM, LEADLESS PACKAGE-10 , 3 X 2 MM, LEADLESS PACKAGE-10 , 3 X 2 MM, LEADLESS PACKAGE-10 3 X 2 MM, LEADLESS PACKAGE-10 3 X 2 MM, LEADLESS PACKAGE-10 , 3 X 2 MM, LEADLESS PACKAGE-10
Reach Compliance Code unknown compliant unknown compliant unknown compliant compliant compliant unknown compliant
最大集电极电流 (IC) 1 A 1 A 1 A 1 A 1 A 1 A 1 A 1 A 1 A 1 A
最小直流电流增益 (hFE) 100 50 100 50 100 50 50 50 100 50
最高工作温度 150 °C 150 °C 150 °C 150 °C 150 °C 150 °C 150 °C 150 °C 150 °C 150 °C
极性/信道类型 NPN NPN AND PNP NPN/PNP NPN PNP PNP NPN AND PNP PNP PNP NPN
最大功率耗散 (Abs) 1.65 W 1.65 W 1.65 W 1.65 W 1.65 W 1.65 W 1.65 W 1.65 W 1.65 W 1.65 W
表面贴装 YES YES YES YES YES YES YES YES YES YES
标称过渡频率 (fT) 100 MHz 100 MHz 100 MHz 100 MHz 100 MHz 100 MHz 100 MHz 100 MHz 100 MHz 100 MHz
针数 - 10 - 10 - 10 10 10 - 10
ECCN代码 - EAR99 - EAR99 - EAR99 EAR99 EAR99 - EAR99
外壳连接 - COLLECTOR - COLLECTOR - COLLECTOR COLLECTOR COLLECTOR - COLLECTOR
集电极-发射极最大电压 - 25 V - 25 V - 25 V 25 V 25 V - 25 V
配置 - SEPARATE, 2 ELEMENTS - SEPARATE, 2 ELEMENTS - SEPARATE, 2 ELEMENTS SEPARATE, 2 ELEMENTS SEPARATE, 2 ELEMENTS - SEPARATE, 2 ELEMENTS
JESD-30 代码 - R-PDSO-N8 - R-PDSO-N8 - R-PDSO-N8 R-PDSO-N8 R-PDSO-N8 - R-PDSO-N8
JESD-609代码 - e3 - e3 - e3 e3 e3 - e3
湿度敏感等级 - 1 - 1 - 1 1 1 - 1
元件数量 - 2 - 2 - 2 2 2 - 2
端子数量 - 8 - 8 - 8 8 8 - 8
封装主体材料 - PLASTIC/EPOXY - PLASTIC/EPOXY - PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY - PLASTIC/EPOXY
封装形状 - RECTANGULAR - RECTANGULAR - RECTANGULAR RECTANGULAR RECTANGULAR - RECTANGULAR
封装形式 - SMALL OUTLINE - SMALL OUTLINE - SMALL OUTLINE SMALL OUTLINE SMALL OUTLINE - SMALL OUTLINE
认证状态 - Not Qualified - Not Qualified - Not Qualified Not Qualified Not Qualified - Not Qualified
端子面层 - MATTE TIN - MATTE TIN - MATTE TIN MATTE TIN MATTE TIN - MATTE TIN
端子形式 - NO LEAD - NO LEAD - NO LEAD NO LEAD NO LEAD - NO LEAD
端子位置 - DUAL - DUAL - DUAL DUAL DUAL - DUAL
晶体管应用 - SWITCHING - SWITCHING - SWITCHING SWITCHING SWITCHING - SWITCHING
晶体管元件材料 - SILICON - SILICON - SILICON SILICON SILICON - SILICON

 
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