S BAND, Si, NPN, RF POWER TRANSISTOR
参数名称 | 属性值 |
厂商名称 | Motorola ( NXP ) |
包装说明 | FLATPACK, R-CDFP-F2 |
Reach Compliance Code | unknown |
其他特性 | DIFFUSED BALLAST RESISTORS |
外壳连接 | BASE |
最大集电极电流 (IC) | 4 A |
基于收集器的最大容量 | 24 pF |
配置 | SINGLE |
最小直流电流增益 (hFE) | 10 |
最高频带 | S BAND |
JESD-30 代码 | R-CDFP-F2 |
元件数量 | 1 |
端子数量 | 2 |
最高工作温度 | 200 °C |
封装主体材料 | CERAMIC, METAL-SEALED COFIRED |
封装形状 | RECTANGULAR |
封装形式 | FLATPACK |
极性/信道类型 | NPN |
最小功率增益 (Gp) | 5.2 dB |
认证状态 | Not Qualified |
表面贴装 | YES |
端子形式 | FLAT |
端子位置 | DUAL |
晶体管应用 | AMPLIFIER |
晶体管元件材料 | SILICON |
MRW2020F | MRW2005F | MRW2003F | MRW2015F | MRW2020 | MRW2010F | |
---|---|---|---|---|---|---|
描述 | S BAND, Si, NPN, RF POWER TRANSISTOR | RF Power Bipolar Transistor, 1-Element, S Band, Silicon, NPN | RF Power Bipolar Transistor, 1-Element, S Band, Silicon, NPN | RF Power Bipolar Transistor, 1-Element, S Band, Silicon, NPN | S BAND, Si, NPN, RF POWER TRANSISTOR | S BAND, Si, NPN, RF POWER TRANSISTOR |
厂商名称 | Motorola ( NXP ) | Motorola ( NXP ) | Motorola ( NXP ) | Motorola ( NXP ) | Motorola ( NXP ) | Motorola ( NXP ) |
包装说明 | FLATPACK, R-CDFP-F2 | DISK BUTTON, O-CRDB-F2 | DISK BUTTON, O-CRDB-F2 | FLATPACK, R-CDFP-F2 | FLANGE MOUNT, R-CDFM-F2 | DISK BUTTON, O-CRDB-F2 |
Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknow |
其他特性 | DIFFUSED BALLAST RESISTORS | DIFFUSED BALLAST RESISTORS | DIFFUSED BALLAST RESISTORS | DIFFUSED BALLAST RESISTORS | DIFFUSED BALLAST RESISTORS | DIFFUSED BALLAST RESISTORS |
外壳连接 | BASE | BASE | BASE | BASE | BASE | BASE |
最大集电极电流 (IC) | 4 A | 1 A | 0.5 A | 3 A | 4 A | 2 A |
基于收集器的最大容量 | 24 pF | 7 pF | 5 pF | 21 pF | 24 pF | 12 pF |
配置 | SINGLE | SINGLE | SINGLE | SINGLE | SINGLE | SINGLE |
最小直流电流增益 (hFE) | 10 | 10 | 10 | 10 | 10 | 10 |
最高频带 | S BAND | S BAND | S BAND | S BAND | S BAND | S BAND |
JESD-30 代码 | R-CDFP-F2 | O-CRDB-F2 | O-CRDB-F2 | R-CDFP-F2 | R-CDFM-F2 | O-CRDB-F2 |
元件数量 | 1 | 1 | 1 | 1 | 1 | 1 |
端子数量 | 2 | 2 | 2 | 2 | 2 | 2 |
最高工作温度 | 200 °C | 200 °C | 200 °C | 200 °C | 200 °C | 200 °C |
封装主体材料 | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED |
封装形状 | RECTANGULAR | ROUND | ROUND | RECTANGULAR | RECTANGULAR | ROUND |
封装形式 | FLATPACK | DISK BUTTON | DISK BUTTON | FLATPACK | FLANGE MOUNT | DISK BUTTON |
极性/信道类型 | NPN | NPN | NPN | NPN | NPN | NPN |
最小功率增益 (Gp) | 5.2 dB | 8 dB | 8 dB | 6 dB | 5.2 dB | 7 dB |
认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
表面贴装 | YES | YES | YES | YES | YES | YES |
端子形式 | FLAT | FLAT | FLAT | FLAT | FLAT | FLAT |
端子位置 | DUAL | RADIAL | RADIAL | DUAL | DUAL | RADIAL |
晶体管应用 | AMPLIFIER | AMPLIFIER | AMPLIFIER | AMPLIFIER | AMPLIFIER | AMPLIFIER |
晶体管元件材料 | SILICON | SILICON | SILICON | SILICON | SILICON | SILICON |
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