SN74HC7074NTP3
| 参数名称 | 属性值 |
| 是否Rohs认证 | 不符合 |
| 厂商名称 | Texas Instruments(德州仪器) |
| 包装说明 | DIP, DIP24,.3 |
| Reach Compliance Code | not_compliant |
| JESD-30 代码 | R-PDIP-T24 |
| 端子数量 | 24 |
| 最高工作温度 | 85 °C |
| 最低工作温度 | -40 °C |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | DIP |
| 封装等效代码 | DIP24,.3 |
| 封装形状 | RECTANGULAR |
| 封装形式 | IN-LINE |
| 表面贴装 | NO |
| 技术 | CMOS |
| 温度等级 | INDUSTRIAL |
| 端子形式 | THROUGH-HOLE |
| 端子节距 | 2.54 mm |
| 端子位置 | DUAL |
| SN74HC7074NTP3 | SN74HC7074NT3 | SN74HC7074JT4 | SN74HC7074JTP4 | SN74HC7074DW3 | SN74HC7074JT | SN74HC7074NT1 | SN74HC7074FH | SN74HC7074NTP1 | SN54HC7074FH | |
|---|---|---|---|---|---|---|---|---|---|---|
| 描述 | SN74HC7074NTP3 | SN74HC7074NT3 | SN74HC7074JT4 | SN74HC7074JTP4 | SN74HC7074DW3 | IC,FLIP-FLOP/GATE,HC-CMOS,DIP,24PIN,CERAMIC | IC,FLIP-FLOP/GATE,HC-CMOS,DIP,24PIN,PLASTIC | IC,FLIP-FLOP/GATE,HC-CMOS,LLCC,28PIN,CERAMIC | IC,FLIP-FLOP/GATE,HC-CMOS,DIP,24PIN,PLASTIC | IC,FLIP-FLOP/GATE,HC-CMOS,LLCC,28PIN,CERAMIC |
| 是否Rohs认证 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 |
| 厂商名称 | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) |
| 包装说明 | DIP, DIP24,.3 | DIP, DIP24,.3 | DIP, DIP24,.3 | DIP, DIP24,.3 | SOP, SOP24,.4 | DIP, DIP24,.3 | DIP, DIP24,.3 | QCCN, LCC28,.45SQ | DIP, DIP24,.3 | QCCN, LCC28,.45SQ |
| Reach Compliance Code | not_compliant | not_compliant | not_compliant | not_compliant | not_compliant | not_compliant | not_compliant | not_compliant | not_compliant | not_compliant |
| JESD-30 代码 | R-PDIP-T24 | R-PDIP-T24 | R-XDIP-T24 | R-XDIP-T24 | R-PDSO-G24 | R-XDIP-T24 | R-PDIP-T24 | S-XQCC-N28 | R-PDIP-T24 | S-XQCC-N28 |
| 端子数量 | 24 | 24 | 24 | 24 | 24 | 24 | 24 | 28 | 24 | 28 |
| 最高工作温度 | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C | 125 °C |
| 最低工作温度 | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -55 °C |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | CERAMIC | CERAMIC | PLASTIC/EPOXY | CERAMIC | PLASTIC/EPOXY | CERAMIC | PLASTIC/EPOXY | CERAMIC |
| 封装代码 | DIP | DIP | DIP | DIP | SOP | DIP | DIP | QCCN | DIP | QCCN |
| 封装等效代码 | DIP24,.3 | DIP24,.3 | DIP24,.3 | DIP24,.3 | SOP24,.4 | DIP24,.3 | DIP24,.3 | LCC28,.45SQ | DIP24,.3 | LCC28,.45SQ |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | SQUARE | RECTANGULAR | SQUARE |
| 封装形式 | IN-LINE | IN-LINE | IN-LINE | IN-LINE | SMALL OUTLINE | IN-LINE | IN-LINE | CHIP CARRIER | IN-LINE | CHIP CARRIER |
| 表面贴装 | NO | NO | NO | NO | YES | NO | NO | YES | NO | YES |
| 技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | MILITARY |
| 端子形式 | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | GULL WING | THROUGH-HOLE | THROUGH-HOLE | NO LEAD | THROUGH-HOLE | NO LEAD |
| 端子节距 | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm | 1.27 mm | 2.54 mm | 2.54 mm | 1.27 mm | 2.54 mm | 1.27 mm |
| 端子位置 | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | QUAD | DUAL | QUAD |
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