Multicore Fixed and Floating-Point Digital Signal Processor 841-FCBGA 0 to 85
| 参数名称 | 属性值 |
| Brand Name | Texas Instruments |
| 是否无铅 | 不含铅 |
| 是否Rohs认证 | 符合 |
| 零件包装代码 | BGA |
| 包装说明 | FBGA, BGA841,29X29,32 |
| 针数 | 841 |
| Reach Compliance Code | compli |
| ECCN代码 | 5A991.B.4 |
| Factory Lead Time | 12 weeks |
| 地址总线宽度 | 24 |
| 桶式移位器 | NO |
| 位大小 | 32 |
| 边界扫描 | YES |
| 外部数据总线宽度 | 16 |
| 格式 | FLOATING POINT |
| 集成缓存 | YES |
| 内部总线架构 | MULTIPLE |
| JESD-30 代码 | S-PBGA-B841 |
| JESD-609代码 | e1 |
| 长度 | 24 mm |
| 低功率模式 | YES |
| 湿度敏感等级 | 4 |
| DMA 通道数量 | 80 |
| 端子数量 | 841 |
| 计时器数量 | 16 |
| 最高工作温度 | 85 °C |
| 最低工作温度 | |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | FBGA |
| 封装等效代码 | BGA841,29X29,32 |
| 封装形状 | SQUARE |
| 封装形式 | GRID ARRAY, FINE PITCH |
| 峰值回流温度（摄氏度） | 245 |
| 电源 | 1,1.5,1.8 V |
| 认证状态 | Not Qualified |
| RAM（字数） | 8192 |
| 座面最大高度 | 3.39 mm |
| 表面贴装 | YES |
| 技术 | CMOS |
| 温度等级 | OTHER |
| 端子面层 | Tin/Silver/Copper (Sn/Ag/Cu) |
| 端子形式 | BALL |
| 端子节距 | 0.8 mm |
| 端子位置 | BOTTOM |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED |
| 宽度 | 24 mm |
| uPs/uCs/外围集成电路类型 | DIGITAL SIGNAL PROCESSOR, OTHER |
| Base Number Matches | 1 |
| TMS320C6678ACYP | TMS320C6678ACYP25 | TMS320C6678ACYPA | TMS320C6678ACYPA25 | TMS320C6678AXCYP | TMS320C6678AXCYP25 | TMS320C6678AXCYPA | |
|---|---|---|---|---|---|---|---|
| 描述 | Multicore Fixed and Floating-Point Digital Signal Processor 841-FCBGA 0 to 85 | Multicore Fixed and Floating-Point Digital Signal Processor 841-FCBGA 0 to 85 | Multicore Fixed and Floating-Point Digital Signal Processor 841-FCBGA -40 to 100 | Multicore Fixed and Floating-Point Digital Signal Processor 841-FCBGA -40 to 100 | Multicore Fixed and Floating-Point Digital Signal Processor 841-FCBGA 0 to 85 | Multicore Fixed and Floating-Point Digital Signal Processor 841-FCBGA 0 to 85 | Multicore Fixed and Floating-Point Digital Signal Processor 841-FCBGA -40 to 100 |
| Brand Name | Texas Instruments | Texas Instruments | Texas Instruments | Texas Instruments | - | - | - |
| 是否无铅 | 不含铅 | 不含铅 | 不含铅 | 不含铅 | - | - | - |
| 是否Rohs认证 | 符合 | 符合 | 符合 | 符合 | - | - | - |
| 零件包装代码 | BGA | BGA | BGA | BGA | - | - | - |
| 包装说明 | FBGA, BGA841,29X29,32 | FBGA, BGA841,29X29,32 | FBGA, BGA841,29X29,32 | FBGA, BGA841,29X29,32 | - | - | - |
| 针数 | 841 | 841 | 841 | 841 | - | - | - |
| Reach Compliance Code | compli | compli | compli | compli | - | - | - |
| ECCN代码 | 5A991.B.4 | 5A991.B | 5A991.B.4.A | 5A991.B.4.A | - | - | - |
| Factory Lead Time | 12 weeks | 16 weeks | 16 weeks | 6 weeks | - | - | - |
| 地址总线宽度 | 24 | 24 | 24 | 24 | - | - | - |
| 桶式移位器 | NO | NO | NO | NO | - | - | - |
| 位大小 | 32 | 32 | 32 | 32 | - | - | - |
| 边界扫描 | YES | YES | YES | YES | - | - | - |
| 外部数据总线宽度 | 16 | 16 | 16 | 16 | - | - | - |
| 格式 | FLOATING POINT | FLOATING POINT | FLOATING POINT | FLOATING POINT | - | - | - |
| 集成缓存 | YES | YES | YES | YES | - | - | - |
| 内部总线架构 | MULTIPLE | MULTIPLE | SINGLE | MULTIPLE | - | - | - |
| JESD-30 代码 | S-PBGA-B841 | S-PBGA-B841 | S-PBGA-B841 | S-PBGA-B841 | - | - | - |
| JESD-609代码 | e1 | e1 | e1 | e1 | - | - | - |
| 长度 | 24 mm | 24 mm | 24 mm | 24 mm | - | - | - |
| 低功率模式 | YES | YES | YES | YES | - | - | - |
| 湿度敏感等级 | 4 | 4 | 4 | 4 | - | - | - |
| DMA 通道数量 | 80 | 80 | 80 | 80 | - | - | - |
| 端子数量 | 841 | 841 | 841 | 841 | - | - | - |
| 计时器数量 | 16 | 16 | 16 | 16 | - | - | - |
| 最高工作温度 | 85 °C | 85 °C | 100 °C | 100 °C | - | - | - |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | - | - | - |
| 封装代码 | FBGA | FBGA | FBGA | FBGA | - | - | - |
| 封装等效代码 | BGA841,29X29,32 | BGA841,29X29,32 | BGA841,29X29,32 | BGA841,29X29,32 | - | - | - |
| 封装形状 | SQUARE | SQUARE | SQUARE | SQUARE | - | - | - |
| 封装形式 | GRID ARRAY, FINE PITCH | GRID ARRAY, FINE PITCH | GRID ARRAY, FINE PITCH | GRID ARRAY, FINE PITCH | - | - | - |
| 峰值回流温度（摄氏度） | 245 | 245 | 245 | 245 | - | - | - |
| 电源 | 1,1.5,1.8 V | 1,1.5,1.8 V | 1,1.5,1.8 V | 1,1.5,1.8 V | - | - | - |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | - | - | - |
| RAM（字数） | 8192 | 8192 | 8192 | 8192 | - | - | - |
| 座面最大高度 | 3.39 mm | 3.39 mm | 3.39 mm | 3.39 mm | - | - | - |
| 表面贴装 | YES | YES | YES | YES | - | - | - |
| 技术 | CMOS | CMOS | CMOS | CMOS | - | - | - |
| 温度等级 | OTHER | OTHER | INDUSTRIAL | INDUSTRIAL | - | - | - |
| 端子面层 | Tin/Silver/Copper (Sn/Ag/Cu) | Tin/Silver/Copper (Sn/Ag/Cu) | Tin/Silver/Copper (Sn/Ag/Cu) | Tin/Silver/Copper (Sn/Ag/Cu) | - | - | - |
| 端子形式 | BALL | BALL | BALL | BALL | - | - | - |
| 端子节距 | 0.8 mm | 0.8 mm | 0.8 mm | 0.8 mm | - | - | - |
| 端子位置 | BOTTOM | BOTTOM | BOTTOM | BOTTOM | - | - | - |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | - | - | - |
| 宽度 | 24 mm | 24 mm | 24 mm | 24 mm | - | - | - |
| uPs/uCs/外围集成电路类型 | DIGITAL SIGNAL PROCESSOR, OTHER | DIGITAL SIGNAL PROCESSOR, OTHER | DIGITAL SIGNAL PROCESSOR, OTHER | DIGITAL SIGNAL PROCESSOR, OTHER | - | - | - |
| Base Number Matches | 1 | 1 | 1 | 1 | - | - | - |
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