D/A Converter, 1 Func, Parallel, 8 Bits Input Loading, 6us Settling Time, PDSO24, PLASTIC, SSOP-24
| 参数名称 | 属性值 |
| 是否无铅 | 含铅 |
| 是否Rohs认证 | 不符合 |
| 厂商名称 | Maxim(美信半导体) |
| 包装说明 | SSOP, |
| Reach Compliance Code | compliant |
| 最大模拟输出电压 | 5.5 V |
| 最小模拟输出电压 | -5.5 V |
| 转换器类型 | D/A CONVERTER |
| 输入位码 | BINARY |
| 输入格式 | PARALLEL, 8 BITS |
| JESD-30 代码 | R-PDSO-G24 |
| 长度 | 7.7 mm |
| 湿度敏感等级 | 1 |
| 标称负供电电压 | -5 V |
| 位数 | 8 |
| 功能数量 | 1 |
| 端子数量 | 24 |
| 最高工作温度 | 85 °C |
| 最低工作温度 | -40 °C |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | SSOP |
| 封装形状 | RECTANGULAR |
| 封装形式 | SMALL OUTLINE, SHRINK PITCH |
| 峰值回流温度（摄氏度） | NOT SPECIFIED |
| 座面最大高度 | 1.99 mm |
| 标称安定时间 (tstl) | 6 µs |
| 标称供电电压 | 5 V |
| 表面贴装 | YES |
| 技术 | CMOS |
| 温度等级 | INDUSTRIAL |
| 端子形式 | GULL WING |
| 端子节距 | 0.65 mm |
| 端子位置 | DUAL |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED |
| 宽度 | 5.29 mm |
| MAX505BEAG/GG8 | MAX505AMRG | MAX505BMRG | MAX505AEWG+ | MAX506AEWP+T | MAX505BCNG+ | MAX505BCAG+ | |
|---|---|---|---|---|---|---|---|
| 描述 | D/A Converter, 1 Func, Parallel, 8 Bits Input Loading, 6us Settling Time, PDSO24, PLASTIC, SSOP-24 | Digital to Analog Converters - DAC | Digital to Analog Converters - DAC | IC DAC 8BIT QUAD R-R 24-SOIC | IC DAC 8BIT QUAD R-R 20-SOIC | IC DAC CMOS QUAD 8BIT R-R 24-DIP | IC DAC 8BIT QUAD R-R 24-SSOP |
| 是否无铅 | 含铅 | 含铅 | 含铅 | 不含铅 | 不含铅 | 不含铅 | 不含铅 |
| 是否Rohs认证 | 不符合 | 不符合 | 不符合 | 符合 | 符合 | 符合 | 符合 |
| 厂商名称 | Maxim(美信半导体) | Maxim(美信半导体) | Maxim(美信半导体) | Maxim(美信半导体) | Maxim(美信半导体) | Maxim(美信半导体) | Maxim(美信半导体) |
| 包装说明 | SSOP, | CERDIP-24 | CERDIP-24 | SOP, SOP24,.4 | SOP, SOP20,.4 | DIP, DIP24,.3 | SSOP, SSOP24,.3 |
| Reach Compliance Code | compliant | not_compliant | not_compliant | compliant | compliant | compliant | compliant |
| 最大模拟输出电压 | 5.5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| 最小模拟输出电压 | -5.5 V | -5.5 V | -5.5 V | -5.5 V | -5.5 V | -5.5 V | -5.5 V |
| 转换器类型 | D/A CONVERTER | D/A CONVERTER | D/A CONVERTER | D/A CONVERTER | D/A CONVERTER | D/A CONVERTER | D/A CONVERTER |
| 输入位码 | BINARY | BINARY | BINARY | BINARY | BINARY | BINARY | BINARY |
| 输入格式 | PARALLEL, 8 BITS | PARALLEL, 8 BITS | PARALLEL, 8 BITS | PARALLEL, 8 BITS | PARALLEL, 8 BITS | PARALLEL, 8 BITS | PARALLEL, 8 BITS |
| JESD-30 代码 | R-PDSO-G24 | R-GDIP-T24 | R-GDIP-T24 | R-PDSO-G24 | R-PDSO-G20 | R-PDIP-T24 | R-PDSO-G24 |
| 湿度敏感等级 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
| 标称负供电电压 | -5 V | -5.5 V | -5.5 V | -5.5 V | -5.5 V | -5.5 V | -5.5 V |
| 位数 | 8 | 8 | 8 | 8 | 8 | 8 | 8 |
| 功能数量 | 1 | 4 | 4 | 4 | 4 | 4 | 4 |
| 端子数量 | 24 | 24 | 24 | 24 | 20 | 24 | 24 |
| 最高工作温度 | 85 °C | 125 °C | 125 °C | 85 °C | 85 °C | 70 °C | 70 °C |
| 最低工作温度 | -40 °C | -55 °C | -55 °C | -40 °C | -40 °C | - | - |
| 封装主体材料 | PLASTIC/EPOXY | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | SSOP | DIP | DIP | SOP | SOP | DIP | SSOP |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | SMALL OUTLINE, SHRINK PITCH | IN-LINE | IN-LINE | SMALL OUTLINE | SMALL OUTLINE | IN-LINE | SMALL OUTLINE, SHRINK PITCH |
| 峰值回流温度（摄氏度） | NOT SPECIFIED | 245 | 245 | 260 | 260 | 260 | 260 |
| 座面最大高度 | 1.99 mm | 5.08 mm | 5.08 mm | 2.65 mm | 2.65 mm | 4.572 mm | 1.99 mm |
| 标称安定时间 (tstl) | 6 µs | 6 µs | 6 µs | 6 µs | 6 µs | 6 µs | 6 µs |
| 标称供电电压 | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| 表面贴装 | YES | NO | NO | YES | YES | NO | YES |
| 技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | INDUSTRIAL | MILITARY | MILITARY | INDUSTRIAL | INDUSTRIAL | COMMERCIAL | COMMERCIAL |
| 端子形式 | GULL WING | THROUGH-HOLE | THROUGH-HOLE | GULL WING | GULL WING | THROUGH-HOLE | GULL WING |
| 端子节距 | 0.65 mm | 2.54 mm | 2.54 mm | 1.27 mm | 1.27 mm | 2.54 mm | 0.65 mm |
| 端子位置 | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| 宽度 | 5.29 mm | 7.62 mm | 7.62 mm | 7.5 mm | 7.5 mm | 7.62 mm | 5.29 mm |
| 长度 | 7.7 mm | - | - | 15.4 mm | 12.8 mm | 30.545 mm | 8.2 mm |
| 零件包装代码 | - | DIP | DIP | SOIC | SOIC | DIP | SSOP |
| 针数 | - | 24 | 24 | 24 | 20 | 24 | 24 |
| ECCN代码 | - | 3A001.A.2.C | 3A001.A.2.C | EAR99 | EAR99 | EAR99 | EAR99 |
| JESD-609代码 | - | e0 | e0 | e3 | e3 | e3 | e3 |
| 封装等效代码 | - | DIP24,.3 | DIP24,.3 | SOP24,.4 | SOP20,.4 | DIP24,.3 | SSOP24,.3 |
| 电源 | - | 5,GND/-5 V | 5,GND/-5 V | 5,GND/-5 V | 5,GND/-5 V | 5,GND/-5 V | 5,GND/-5 V |
| 认证状态 | - | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 最大压摆率 | - | 12 mA | 12 mA | 10 mA | 10 mA | 10 mA | 10 mA |
| 端子面层 | - | Tin/Lead (Sn85Pb15) | Tin/Lead (Sn85Pb15) | Matte Tin (Sn) | Matte Tin (Sn) | Matte Tin (Sn) | Matte Tin (Sn) |
| Factory Lead Time | - | - | - | 1 week | 9 weeks | 6 weeks | 6 weeks |
电子工程世界版权所有
京B2-20211791
京ICP备10001474号-1
电信业务审批[2006]字第258号函
京公网安备 11010802033920号
Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved
电子工程世界
