MASK ROM, 512KX16, 100ns, CMOS, PDIP42, 0.600 INCH, DIP-42
| 参数名称 | 属性值 |
| 是否Rohs认证 | 不符合 |
| 厂商名称 | SAMSUNG(三星) |
| 零件包装代码 | DIP |
| 包装说明 | DIP, DIP42,.6 |
| 针数 | 42 |
| Reach Compliance Code | compliant |
| ECCN代码 | EAR99 |
| 最长访问时间 | 100 ns |
| 其他特性 | ALL INPUTS AND OUTPUTS TTL COMPATIBLE |
| 备用内存宽度 | 8 |
| JESD-30 代码 | R-PDIP-T42 |
| JESD-609代码 | e0 |
| 长度 | 52.42 mm |
| 内存密度 | 8388608 bit |
| 内存集成电路类型 | MASK ROM |
| 内存宽度 | 16 |
| 功能数量 | 1 |
| 端子数量 | 42 |
| 字数 | 524288 words |
| 字数代码 | 512000 |
| 工作模式 | ASYNCHRONOUS |
| 最高工作温度 | 70 °C |
| 最低工作温度 | |
| 组织 | 512KX16 |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | DIP |
| 封装等效代码 | DIP42,.6 |
| 封装形状 | RECTANGULAR |
| 封装形式 | IN-LINE |
| 并行/串行 | PARALLEL |
| 电源 | 3.3 V |
| 认证状态 | Not Qualified |
| 座面最大高度 | 5.08 mm |
| 最大待机电流 | 0.00003 A |
| 最大压摆率 | 0.03 mA |
| 最大供电电压 (Vsup) | 3.6 V |
| 最小供电电压 (Vsup) | 3 V |
| 标称供电电压 (Vsup) | 3.3 V |
| 表面贴装 | NO |
| 技术 | CMOS |
| 温度等级 | COMMERCIAL |
| 端子面层 | Tin/Lead (Sn/Pb) |
| 端子形式 | THROUGH-HOLE |
| 端子节距 | 2.54 mm |
| 端子位置 | DUAL |
| 宽度 | 15.24 mm |
| K3N4V1000D-DC10 | K3N4U1000D-DC120 | K3N4V1000D-DC100 | K3N4V1000D-GC10 | K3N4V1000D-GC100 | K3N4U1000D-DC12 | K3N4U1000D-GC12 | K3N4U1000D-GC120 | |
|---|---|---|---|---|---|---|---|---|
| 描述 | MASK ROM, 512KX16, 100ns, CMOS, PDIP42, 0.600 INCH, DIP-42 | MASK ROM, 512KX16, 120ns, CMOS, PDIP42, 0.600 INCH, DIP-42 | MASK ROM, 512KX16, 100ns, CMOS, PDIP42, 0.600 INCH, DIP-42 | MASK ROM, 512KX16, 100ns, CMOS, PDSO44, 0.600 INCH, SOP-44 | MASK ROM, 512KX16, 100ns, CMOS, PDSO44, 0.600 INCH, SOP-44 | MASK ROM, 512KX16, 120ns, CMOS, PDIP42, 0.600 INCH, DIP-42 | MASK ROM, 512KX16, 120ns, CMOS, PDSO44, 0.600 INCH, SOP-44 | MASK ROM, 512KX16, 120ns, CMOS, PDSO44, 0.600 INCH, SOP-44 |
| 是否Rohs认证 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 |
| 零件包装代码 | DIP | DIP | DIP | SOIC | SOIC | DIP | SOIC | SOIC |
| 包装说明 | DIP, DIP42,.6 | DIP, | DIP, | SOP, SOP44,.63 | SOP, | DIP, DIP42,.6 | SOP, SOP44,.63 | SOP, |
| 针数 | 42 | 42 | 42 | 44 | 44 | 42 | 44 | 44 |
| Reach Compliance Code | compliant | compliant | compliant | compliant | compliant | compliant | compliant | compliant |
| ECCN代码 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 |
| 最长访问时间 | 100 ns | 120 ns | 100 ns | 100 ns | 100 ns | 120 ns | 120 ns | 120 ns |
| 备用内存宽度 | 8 | 8 | 8 | 8 | 8 | 8 | 8 | 8 |
| JESD-30 代码 | R-PDIP-T42 | R-PDIP-T42 | R-PDIP-T42 | R-PDSO-G44 | R-PDSO-G44 | R-PDIP-T42 | R-PDSO-G44 | R-PDSO-G44 |
| 长度 | 52.42 mm | 52.42 mm | 52.42 mm | 28.5 mm | 28.5 mm | 52.42 mm | 28.5 mm | 28.5 mm |
| 内存密度 | 8388608 bit | 8388608 bit | 8388608 bit | 8388608 bit | 8388608 bit | 8388608 bit | 8388608 bit | 8388608 bit |
| 内存集成电路类型 | MASK ROM | MASK ROM | MASK ROM | MASK ROM | MASK ROM | MASK ROM | MASK ROM | MASK ROM |
| 内存宽度 | 16 | 16 | 16 | 16 | 16 | 16 | 16 | 16 |
| 功能数量 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
| 端子数量 | 42 | 42 | 42 | 44 | 44 | 42 | 44 | 44 |
| 字数 | 524288 words | 524288 words | 524288 words | 524288 words | 524288 words | 524288 words | 524288 words | 524288 words |
| 字数代码 | 512000 | 512000 | 512000 | 512000 | 512000 | 512000 | 512000 | 512000 |
| 工作模式 | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS |
| 最高工作温度 | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C |
| 组织 | 512KX16 | 512KX16 | 512KX16 | 512KX16 | 512KX16 | 512KX16 | 512KX16 | 512KX16 |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | DIP | DIP | DIP | SOP | SOP | DIP | SOP | SOP |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | IN-LINE | IN-LINE | IN-LINE | SMALL OUTLINE | SMALL OUTLINE | IN-LINE | SMALL OUTLINE | SMALL OUTLINE |
| 并行/串行 | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 座面最大高度 | 5.08 mm | 5.08 mm | 5.08 mm | 3.1 mm | 3.1 mm | 5.08 mm | 3.1 mm | 3.1 mm |
| 最大供电电压 (Vsup) | 3.6 V | 3.3 V | 3.6 V | 3.6 V | 3.6 V | 3.3 V | 3.3 V | 3.3 V |
| 最小供电电压 (Vsup) | 3 V | 2.7 V | 3 V | 3 V | 3 V | 2.7 V | 2.7 V | 2.7 V |
| 标称供电电压 (Vsup) | 3.3 V | 3 V | 3.3 V | 3.3 V | 3.3 V | 3 V | 3 V | 3 V |
| 表面贴装 | NO | NO | NO | YES | YES | NO | YES | YES |
| 技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL |
| 端子形式 | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | GULL WING | GULL WING | THROUGH-HOLE | GULL WING | GULL WING |
| 端子节距 | 2.54 mm | 2.54 mm | 2.54 mm | 1.27 mm | 1.27 mm | 2.54 mm | 1.27 mm | 1.27 mm |
| 端子位置 | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL |
| 宽度 | 15.24 mm | 15.24 mm | 15.24 mm | 12.6 mm | 12.6 mm | 15.24 mm | 12.6 mm | 12.6 mm |
| 厂商名称 | SAMSUNG(三星) | - | SAMSUNG(三星) | SAMSUNG(三星) | SAMSUNG(三星) | SAMSUNG(三星) | SAMSUNG(三星) | SAMSUNG(三星) |
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