MASK ROM, 512KX16, 120ns, CMOS, PDSO44, 0.600 INCH, SOP-44
参数名称 | 属性值 |
是否Rohs认证 | 不符合 |
厂商名称 | SAMSUNG(三星) |
零件包装代码 | SOIC |
包装说明 | SOP, SOP44,.63 |
针数 | 44 |
Reach Compliance Code | compliant |
ECCN代码 | EAR99 |
最长访问时间 | 120 ns |
其他特性 | ALL INPUTS AND OUTPUTS TTL COMPATIBLE |
备用内存宽度 | 8 |
JESD-30 代码 | R-PDSO-G44 |
JESD-609代码 | e0 |
长度 | 28.5 mm |
内存密度 | 8388608 bit |
内存集成电路类型 | MASK ROM |
内存宽度 | 16 |
功能数量 | 1 |
端子数量 | 44 |
字数 | 524288 words |
字数代码 | 512000 |
工作模式 | ASYNCHRONOUS |
最高工作温度 | 70 °C |
最低工作温度 | |
组织 | 512KX16 |
封装主体材料 | PLASTIC/EPOXY |
封装代码 | SOP |
封装等效代码 | SOP44,.63 |
封装形状 | RECTANGULAR |
封装形式 | SMALL OUTLINE |
并行/串行 | PARALLEL |
电源 | 3 V |
认证状态 | Not Qualified |
座面最大高度 | 3.1 mm |
最大待机电流 | 0.00003 A |
最大压摆率 | 0.025 mA |
最大供电电压 (Vsup) | 3.3 V |
最小供电电压 (Vsup) | 2.7 V |
标称供电电压 (Vsup) | 3 V |
表面贴装 | YES |
技术 | CMOS |
温度等级 | COMMERCIAL |
端子面层 | Tin/Lead (Sn/Pb) |
端子形式 | GULL WING |
端子节距 | 1.27 mm |
端子位置 | DUAL |
宽度 | 12.6 mm |
K3N4U1000D-GC12 | K3N4U1000D-DC120 | K3N4V1000D-DC100 | K3N4V1000D-GC10 | K3N4V1000D-GC100 | K3N4U1000D-DC12 | K3N4U1000D-GC120 | K3N4V1000D-DC10 | |
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描述 | MASK ROM, 512KX16, 120ns, CMOS, PDSO44, 0.600 INCH, SOP-44 | MASK ROM, 512KX16, 120ns, CMOS, PDIP42, 0.600 INCH, DIP-42 | MASK ROM, 512KX16, 100ns, CMOS, PDIP42, 0.600 INCH, DIP-42 | MASK ROM, 512KX16, 100ns, CMOS, PDSO44, 0.600 INCH, SOP-44 | MASK ROM, 512KX16, 100ns, CMOS, PDSO44, 0.600 INCH, SOP-44 | MASK ROM, 512KX16, 120ns, CMOS, PDIP42, 0.600 INCH, DIP-42 | MASK ROM, 512KX16, 120ns, CMOS, PDSO44, 0.600 INCH, SOP-44 | MASK ROM, 512KX16, 100ns, CMOS, PDIP42, 0.600 INCH, DIP-42 |
是否Rohs认证 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 |
零件包装代码 | SOIC | DIP | DIP | SOIC | SOIC | DIP | SOIC | DIP |
包装说明 | SOP, SOP44,.63 | DIP, | DIP, | SOP, SOP44,.63 | SOP, | DIP, DIP42,.6 | SOP, | DIP, DIP42,.6 |
针数 | 44 | 42 | 42 | 44 | 44 | 42 | 44 | 42 |
Reach Compliance Code | compliant | compliant | compliant | compliant | compliant | compliant | compliant | compliant |
ECCN代码 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 |
最长访问时间 | 120 ns | 120 ns | 100 ns | 100 ns | 100 ns | 120 ns | 120 ns | 100 ns |
备用内存宽度 | 8 | 8 | 8 | 8 | 8 | 8 | 8 | 8 |
JESD-30 代码 | R-PDSO-G44 | R-PDIP-T42 | R-PDIP-T42 | R-PDSO-G44 | R-PDSO-G44 | R-PDIP-T42 | R-PDSO-G44 | R-PDIP-T42 |
长度 | 28.5 mm | 52.42 mm | 52.42 mm | 28.5 mm | 28.5 mm | 52.42 mm | 28.5 mm | 52.42 mm |
内存密度 | 8388608 bit | 8388608 bit | 8388608 bit | 8388608 bit | 8388608 bit | 8388608 bit | 8388608 bit | 8388608 bit |
内存集成电路类型 | MASK ROM | MASK ROM | MASK ROM | MASK ROM | MASK ROM | MASK ROM | MASK ROM | MASK ROM |
内存宽度 | 16 | 16 | 16 | 16 | 16 | 16 | 16 | 16 |
功能数量 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
端子数量 | 44 | 42 | 42 | 44 | 44 | 42 | 44 | 42 |
字数 | 524288 words | 524288 words | 524288 words | 524288 words | 524288 words | 524288 words | 524288 words | 524288 words |
字数代码 | 512000 | 512000 | 512000 | 512000 | 512000 | 512000 | 512000 | 512000 |
工作模式 | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS |
最高工作温度 | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C |
组织 | 512KX16 | 512KX16 | 512KX16 | 512KX16 | 512KX16 | 512KX16 | 512KX16 | 512KX16 |
封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
封装代码 | SOP | DIP | DIP | SOP | SOP | DIP | SOP | DIP |
封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
封装形式 | SMALL OUTLINE | IN-LINE | IN-LINE | SMALL OUTLINE | SMALL OUTLINE | IN-LINE | SMALL OUTLINE | IN-LINE |
并行/串行 | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL |
认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
座面最大高度 | 3.1 mm | 5.08 mm | 5.08 mm | 3.1 mm | 3.1 mm | 5.08 mm | 3.1 mm | 5.08 mm |
最大供电电压 (Vsup) | 3.3 V | 3.3 V | 3.6 V | 3.6 V | 3.6 V | 3.3 V | 3.3 V | 3.6 V |
最小供电电压 (Vsup) | 2.7 V | 2.7 V | 3 V | 3 V | 3 V | 2.7 V | 2.7 V | 3 V |
标称供电电压 (Vsup) | 3 V | 3 V | 3.3 V | 3.3 V | 3.3 V | 3 V | 3 V | 3.3 V |
表面贴装 | YES | NO | NO | YES | YES | NO | YES | NO |
技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
温度等级 | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL |
端子形式 | GULL WING | THROUGH-HOLE | THROUGH-HOLE | GULL WING | GULL WING | THROUGH-HOLE | GULL WING | THROUGH-HOLE |
端子节距 | 1.27 mm | 2.54 mm | 2.54 mm | 1.27 mm | 1.27 mm | 2.54 mm | 1.27 mm | 2.54 mm |
端子位置 | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL |
宽度 | 12.6 mm | 15.24 mm | 15.24 mm | 12.6 mm | 12.6 mm | 15.24 mm | 12.6 mm | 15.24 mm |
厂商名称 | SAMSUNG(三星) | - | SAMSUNG(三星) | SAMSUNG(三星) | SAMSUNG(三星) | SAMSUNG(三星) | SAMSUNG(三星) | SAMSUNG(三星) |
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