SMJ417100-70HKBM概述

16MX1 FAST PAGE DRAM, 70ns, CDFP28, FP-28

SMJ417100-70HKBM规格参数

参数名称	属性值
厂商名称	Texas Instruments(德州仪器)
Objectid	1401374775
零件包装代码	DFP
包装说明	DFP,
针数	28
Reach Compliance Code	unknown
ECCN代码	EAR99
compound_id	9970462
访问模式	FAST PAGE
最长访问时间	70 ns
其他特性	RAS ONLY; CAS BEFORE RAS; HIDDEN REFRESH
JESD-30 代码	R-CDFP-F28
长度	19.685 mm
内存密度	16777216 bit
内存集成电路类型	FAST PAGE DRAM
内存宽度	1
功能数量	1
端口数量	1
端子数量	28
字数	16777216 words
字数代码	16000000
工作模式	ASYNCHRONOUS
最高工作温度	125 °C
最低工作温度	-55 °C
组织	16MX1
封装主体材料	CERAMIC, METAL-SEALED COFIRED
封装代码	DFP
封装形状	RECTANGULAR
封装形式	FLATPACK
认证状态	Not Qualified
刷新周期	2048
座面最大高度	3.32 mm
最大供电电压 (Vsup)	5.5 V
最小供电电压 (Vsup)	4.5 V
标称供电电压 (Vsup)	5 V
表面贴装	YES
技术	CMOS
温度等级	MILITARY
端子形式	FLAT
端子节距	1.27 mm
端子位置	DUAL
宽度	11.43 mm

SMJ417100-70HKBM相似产品对比

	SMJ417100-70HKBM	SMJ417100-80HKBM	SMJ417100-80FNCM	SMJ417100-70FNCM	SMJ417100-10FNCM	SMJ417100-60FNCM	SMJ417100-60HKBM	SMJ417100-10HKBM
描述	16MX1 FAST PAGE DRAM, 70ns, CDFP28, FP-28	16MX1 FAST PAGE DRAM, 80ns, CDFP28, FP-28	IC 16M X 1 FAST PAGE DRAM, 80 ns, CDSO24, 0.450 INCH, CERAMIC, SOLCC-28/24, Dynamic RAM	16MX1 FAST PAGE DRAM, 70ns, CDSO24, 0.450 INCH, CERAMIC, SOLCC-28/24	16MX1 FAST PAGE DRAM, 100ns, CDSO24, 0.450 INCH, CERAMIC, SOLCC-28/24	16MX1 FAST PAGE DRAM, 60ns, CDSO24, 0.450 INCH, CERAMIC, SOLCC-28/24	16MX1 FAST PAGE DRAM, 60ns, CDFP28, FP-28	IC 16M X 1 FAST PAGE DRAM, 100 ns, CDFP28, FP-28, Dynamic RAM
零件包装代码	DFP	DFP	DLCC	DLCC	DLCC	DLCC	DFP	DFP
包装说明	DFP,	DFP,	SON,	SON,	SON,	SON,	DFP,	DFP,
针数	28	28	28/24	28/24	28/24	28/24	28	28
Reach Compliance Code	unknown	unknown	unknown	unknown	unknown	unknown	unknown	unknow
ECCN代码	EAR99	EAR99	EAR99	EAR99	EAR99	EAR99	EAR99	EAR99
访问模式	FAST PAGE	FAST PAGE	FAST PAGE	FAST PAGE	FAST PAGE	FAST PAGE	FAST PAGE	FAST PAGE
最长访问时间	70 ns	80 ns	80 ns	70 ns	100 ns	60 ns	60 ns	100 ns
其他特性	RAS ONLY; CAS BEFORE RAS; HIDDEN REFRESH	RAS ONLY; CAS BEFORE RAS; HIDDEN REFRESH	RAS ONLY; CAS BEFORE RAS; HIDDEN REFRESH	RAS ONLY; CAS BEFORE RAS; HIDDEN REFRESH	RAS ONLY; CAS BEFORE RAS; HIDDEN REFRESH	RAS ONLY; CAS BEFORE RAS; HIDDEN REFRESH	RAS ONLY; CAS BEFORE RAS; HIDDEN REFRESH	RAS ONLY; CAS BEFORE RAS; HIDDEN REFRESH
JESD-30 代码	R-CDFP-F28	R-CDFP-F28	R-CDSO-N24	R-CDSO-N24	R-CDSO-N24	R-CDSO-N24	R-CDFP-F28	R-CDFP-F28
长度	19.685 mm	19.685 mm	19.685 mm	19.685 mm	19.685 mm	19.685 mm	19.685 mm	19.685 mm
内存密度	16777216 bit	16777216 bit	16777216 bit	16777216 bit	16777216 bit	16777216 bit	16777216 bit	16777216 bi
内存集成电路类型	FAST PAGE DRAM	FAST PAGE DRAM	FAST PAGE DRAM	FAST PAGE DRAM	FAST PAGE DRAM	FAST PAGE DRAM	FAST PAGE DRAM	FAST PAGE DRAM
内存宽度	1	1	1	1	1	1	1	1
功能数量	1	1	1	1	1	1	1	1
端口数量	1	1	1	1	1	1	1	1
端子数量	28	28	24	24	24	24	28	28
字数	16777216 words	16777216 words	16777216 words	16777216 words	16777216 words	16777216 words	16777216 words	16777216 words
字数代码	16000000	16000000	16000000	16000000	16000000	16000000	16000000	16000000
工作模式	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS
最高工作温度	125 °C	125 °C	125 °C	125 °C	125 °C	125 °C	125 °C	125 °C
最低工作温度	-55 °C	-55 °C	-55 °C	-55 °C	-55 °C	-55 °C	-55 °C	-55 °C
组织	16MX1	16MX1	16MX1	16MX1	16MX1	16MX1	16MX1	16MX1
封装主体材料	CERAMIC, METAL-SEALED COFIRED	CERAMIC, METAL-SEALED COFIRED	CERAMIC, METAL-SEALED COFIRED	CERAMIC, METAL-SEALED COFIRED	CERAMIC, METAL-SEALED COFIRED	CERAMIC, METAL-SEALED COFIRED	CERAMIC, METAL-SEALED COFIRED	CERAMIC, METAL-SEALED COFIRED
封装代码	DFP	DFP	SON	SON	SON	SON	DFP	DFP
封装形状	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
封装形式	FLATPACK	FLATPACK	SMALL OUTLINE	SMALL OUTLINE	SMALL OUTLINE	SMALL OUTLINE	FLATPACK	FLATPACK
认证状态	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
刷新周期	2048	2048	2048	2048	2048	2048	2048	2048
座面最大高度	3.32 mm	3.32 mm	3.18 mm	3.18 mm	3.18 mm	3.18 mm	3.32 mm	3.32 mm
最大供电电压 (Vsup)	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V
最小供电电压 (Vsup)	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V
标称供电电压 (Vsup)	5 V	5 V	5 V	5 V	5 V	5 V	5 V	5 V
表面贴装	YES	YES	YES	YES	YES	YES	YES	YES
技术	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS
温度等级	MILITARY	MILITARY	MILITARY	MILITARY	MILITARY	MILITARY	MILITARY	MILITARY
端子形式	FLAT	FLAT	NO LEAD	NO LEAD	NO LEAD	NO LEAD	FLAT	FLAT
端子节距	1.27 mm	1.27 mm	1.27 mm	1.27 mm	1.27 mm	1.27 mm	1.27 mm	1.27 mm
端子位置	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL
宽度	11.43 mm	11.43 mm	11.43 mm	11.43 mm	11.43 mm	11.43 mm	11.43 mm	11.43 mm
Base Number Matches	-	1	1	1	1	1	-	-

SMJ417100-70HKBM

SMJ417100-70HKBM概述

SMJ417100-70HKBM规格参数

SMJ417100-70HKBM相似产品对比

推荐资源