16MX1 FAST PAGE DRAM, 60ns, CDFP28, FP-28
| 参数名称 | 属性值 |
| 厂商名称 | Texas Instruments(德州仪器) |
| 零件包装代码 | DFP |
| 包装说明 | DFP, |
| 针数 | 28 |
| Reach Compliance Code | unknown |
| ECCN代码 | EAR99 |
| 访问模式 | FAST PAGE |
| 最长访问时间 | 60 ns |
| 其他特性 | RAS ONLY; CAS BEFORE RAS; HIDDEN REFRESH |
| JESD-30 代码 | R-CDFP-F28 |
| 长度 | 19.685 mm |
| 内存密度 | 16777216 bit |
| 内存集成电路类型 | FAST PAGE DRAM |
| 内存宽度 | 1 |
| 功能数量 | 1 |
| 端口数量 | 1 |
| 端子数量 | 28 |
| 字数 | 16777216 words |
| 字数代码 | 16000000 |
| 工作模式 | ASYNCHRONOUS |
| 最高工作温度 | 125 °C |
| 最低工作温度 | -55 °C |
| 组织 | 16MX1 |
| 封装主体材料 | CERAMIC, METAL-SEALED COFIRED |
| 封装代码 | DFP |
| 封装形状 | RECTANGULAR |
| 封装形式 | FLATPACK |
| 认证状态 | Not Qualified |
| 刷新周期 | 2048 |
| 座面最大高度 | 3.32 mm |
| 最大供电电压 (Vsup) | 5.5 V |
| 最小供电电压 (Vsup) | 4.5 V |
| 标称供电电压 (Vsup) | 5 V |
| 表面贴装 | YES |
| 技术 | CMOS |
| 温度等级 | MILITARY |
| 端子形式 | FLAT |
| 端子节距 | 1.27 mm |
| 端子位置 | DUAL |
| 宽度 | 11.43 mm |
| SMJ417100-60HKBM | SMJ417100-80HKBM | SMJ417100-80FNCM | SMJ417100-70FNCM | SMJ417100-10FNCM | SMJ417100-60FNCM | SMJ417100-70HKBM | SMJ417100-10HKBM | |
|---|---|---|---|---|---|---|---|---|
| 描述 | 16MX1 FAST PAGE DRAM, 60ns, CDFP28, FP-28 | 16MX1 FAST PAGE DRAM, 80ns, CDFP28, FP-28 | IC 16M X 1 FAST PAGE DRAM, 80 ns, CDSO24, 0.450 INCH, CERAMIC, SOLCC-28/24, Dynamic RAM | 16MX1 FAST PAGE DRAM, 70ns, CDSO24, 0.450 INCH, CERAMIC, SOLCC-28/24 | 16MX1 FAST PAGE DRAM, 100ns, CDSO24, 0.450 INCH, CERAMIC, SOLCC-28/24 | 16MX1 FAST PAGE DRAM, 60ns, CDSO24, 0.450 INCH, CERAMIC, SOLCC-28/24 | 16MX1 FAST PAGE DRAM, 70ns, CDFP28, FP-28 | IC 16M X 1 FAST PAGE DRAM, 100 ns, CDFP28, FP-28, Dynamic RAM |
| 零件包装代码 | DFP | DFP | DLCC | DLCC | DLCC | DLCC | DFP | DFP |
| 包装说明 | DFP, | DFP, | SON, | SON, | SON, | SON, | DFP, | DFP, |
| 针数 | 28 | 28 | 28/24 | 28/24 | 28/24 | 28/24 | 28 | 28 |
| Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknown | unknown | unknow |
| ECCN代码 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 |
| 访问模式 | FAST PAGE | FAST PAGE | FAST PAGE | FAST PAGE | FAST PAGE | FAST PAGE | FAST PAGE | FAST PAGE |
| 最长访问时间 | 60 ns | 80 ns | 80 ns | 70 ns | 100 ns | 60 ns | 70 ns | 100 ns |
| 其他特性 | RAS ONLY; CAS BEFORE RAS; HIDDEN REFRESH | RAS ONLY; CAS BEFORE RAS; HIDDEN REFRESH | RAS ONLY; CAS BEFORE RAS; HIDDEN REFRESH | RAS ONLY; CAS BEFORE RAS; HIDDEN REFRESH | RAS ONLY; CAS BEFORE RAS; HIDDEN REFRESH | RAS ONLY; CAS BEFORE RAS; HIDDEN REFRESH | RAS ONLY; CAS BEFORE RAS; HIDDEN REFRESH | RAS ONLY; CAS BEFORE RAS; HIDDEN REFRESH |
| JESD-30 代码 | R-CDFP-F28 | R-CDFP-F28 | R-CDSO-N24 | R-CDSO-N24 | R-CDSO-N24 | R-CDSO-N24 | R-CDFP-F28 | R-CDFP-F28 |
| 长度 | 19.685 mm | 19.685 mm | 19.685 mm | 19.685 mm | 19.685 mm | 19.685 mm | 19.685 mm | 19.685 mm |
| 内存密度 | 16777216 bit | 16777216 bit | 16777216 bit | 16777216 bit | 16777216 bit | 16777216 bit | 16777216 bit | 16777216 bi |
| 内存集成电路类型 | FAST PAGE DRAM | FAST PAGE DRAM | FAST PAGE DRAM | FAST PAGE DRAM | FAST PAGE DRAM | FAST PAGE DRAM | FAST PAGE DRAM | FAST PAGE DRAM |
| 内存宽度 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
| 功能数量 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
| 端口数量 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
| 端子数量 | 28 | 28 | 24 | 24 | 24 | 24 | 28 | 28 |
| 字数 | 16777216 words | 16777216 words | 16777216 words | 16777216 words | 16777216 words | 16777216 words | 16777216 words | 16777216 words |
| 字数代码 | 16000000 | 16000000 | 16000000 | 16000000 | 16000000 | 16000000 | 16000000 | 16000000 |
| 工作模式 | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS |
| 最高工作温度 | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C |
| 最低工作温度 | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C |
| 组织 | 16MX1 | 16MX1 | 16MX1 | 16MX1 | 16MX1 | 16MX1 | 16MX1 | 16MX1 |
| 封装主体材料 | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED |
| 封装代码 | DFP | DFP | SON | SON | SON | SON | DFP | DFP |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | FLATPACK | FLATPACK | SMALL OUTLINE | SMALL OUTLINE | SMALL OUTLINE | SMALL OUTLINE | FLATPACK | FLATPACK |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 刷新周期 | 2048 | 2048 | 2048 | 2048 | 2048 | 2048 | 2048 | 2048 |
| 座面最大高度 | 3.32 mm | 3.32 mm | 3.18 mm | 3.18 mm | 3.18 mm | 3.18 mm | 3.32 mm | 3.32 mm |
| 最大供电电压 (Vsup) | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
| 最小供电电压 (Vsup) | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V |
| 标称供电电压 (Vsup) | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| 表面贴装 | YES | YES | YES | YES | YES | YES | YES | YES |
| 技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY |
| 端子形式 | FLAT | FLAT | NO LEAD | NO LEAD | NO LEAD | NO LEAD | FLAT | FLAT |
| 端子节距 | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm |
| 端子位置 | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL |
| 宽度 | 11.43 mm | 11.43 mm | 11.43 mm | 11.43 mm | 11.43 mm | 11.43 mm | 11.43 mm | 11.43 mm |
| Base Number Matches | - | 1 | 1 | 1 | 1 | 1 | - | - |
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