Memory IC
| 参数名称 | 属性值 |
| 厂商名称 | FUJITSU(富士通) |
| 零件包装代码 | SOIC |
| 包装说明 | , |
| 针数 | 32 |
| Reach Compliance Code | compliant |
| MB841000-80LPF | MB841000-10PF | MB841000-80PF | MB841000-12LPF | MB841000-12PF | MB841000-12LP | MB841000-80LP | |
|---|---|---|---|---|---|---|---|
| 描述 | Memory IC | Standard SRAM, 128KX8, 100ns, CMOS, PDSO32 | Standard SRAM, 128KX8, 80ns, CMOS, PDSO32 | Standard SRAM, 128KX8, 120ns, CMOS, PDSO32 | Standard SRAM, 128KX8, 120ns, CMOS, PDSO32 | Standard SRAM, 128KX8, 120ns, CMOS, PDIP32 | Standard SRAM, 128KX8, 80ns, CMOS, PDIP32 |
| 零件包装代码 | SOIC | SOIC | SOIC | SOIC | SOIC | DIP | DIP |
| 包装说明 | , | SOP, SOP32,.56 | SOP, SOP32,.56 | SOP, SOP32,.56 | SOP, SOP32,.56 | DIP, DIP32,.6 | DIP, DIP32,.6 |
| 针数 | 32 | 32 | 32 | 32 | 32 | 32 | 32 |
| Reach Compliance Code | compliant | compliant | compliant | compliant | compliant | compliant | compliant |
| 厂商名称 | FUJITSU(富士通) | FUJITSU(富士通) | FUJITSU(富士通) | FUJITSU(富士通) | FUJITSU(富士通) | FUJITSU(富士通) | - |
| 是否Rohs认证 | - | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 |
| 最长访问时间 | - | 100 ns | 80 ns | 120 ns | 120 ns | 120 ns | 80 ns |
| I/O 类型 | - | COMMON | COMMON | COMMON | COMMON | COMMON | COMMON |
| JESD-30 代码 | - | R-PDSO-G32 | R-PDSO-G32 | R-PDSO-G32 | R-PDSO-G32 | R-PDIP-T32 | R-PDIP-T32 |
| JESD-609代码 | - | e0 | e0 | e0 | e0 | e0 | e0 |
| 内存密度 | - | 1048576 bit | 1048576 bit | 1048576 bit | 1048576 bit | 1048576 bit | 1048576 bit |
| 内存集成电路类型 | - | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM |
| 内存宽度 | - | 8 | 8 | 8 | 8 | 8 | 8 |
| 端子数量 | - | 32 | 32 | 32 | 32 | 32 | 32 |
| 字数 | - | 131072 words | 131072 words | 131072 words | 131072 words | 131072 words | 131072 words |
| 字数代码 | - | 128000 | 128000 | 128000 | 128000 | 128000 | 128000 |
| 工作模式 | - | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS |
| 最高工作温度 | - | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C |
| 组织 | - | 128KX8 | 128KX8 | 128KX8 | 128KX8 | 128KX8 | 128KX8 |
| 输出特性 | - | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE |
| 封装主体材料 | - | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | - | SOP | SOP | SOP | SOP | DIP | DIP |
| 封装等效代码 | - | SOP32,.56 | SOP32,.56 | SOP32,.56 | SOP32,.56 | DIP32,.6 | DIP32,.6 |
| 封装形状 | - | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | - | SMALL OUTLINE | SMALL OUTLINE | SMALL OUTLINE | SMALL OUTLINE | IN-LINE | IN-LINE |
| 并行/串行 | - | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL |
| 电源 | - | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| 认证状态 | - | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 最大待机电流 | - | 0.0005 A | 0.0005 A | 0.0001 A | 0.0005 A | 0.0001 A | 0.0001 A |
| 最小待机电流 | - | 2 V | 2 V | 2 V | 2 V | 2 V | 2 V |
| 最大压摆率 | - | 0.08 mA | 0.08 mA | 0.08 mA | 0.08 mA | 0.08 mA | 0.08 mA |
| 标称供电电压 (Vsup) | - | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| 表面贴装 | - | YES | YES | YES | YES | NO | NO |
| 技术 | - | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | - | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL |
| 端子面层 | - | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| 端子形式 | - | GULL WING | GULL WING | GULL WING | GULL WING | THROUGH-HOLE | THROUGH-HOLE |
| 端子节距 | - | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm | 2.54 mm | 2.54 mm |
| 端子位置 | - | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL |
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