Non-Volatile SRAM, 512X8, 45ns, CMOS, CDIP28, HERMETIC SEALED, CERDIP-28
参数名称 | 属性值 |
是否Rohs认证 | 不符合 |
厂商名称 | Xicor Inc |
包装说明 | HERMETIC SEALED, CERDIP-28 |
Reach Compliance Code | unknown |
最长访问时间 | 45 ns |
其他特性 | EEPROM SOFTWARE STORE/RECALL; RETENTION/ENDURANCE - 100 YEARS/100000 CYCLES |
JESD-30 代码 | R-GDIP-T28 |
JESD-609代码 | e0 |
内存密度 | 4096 bit |
内存集成电路类型 | NON-VOLATILE SRAM |
内存宽度 | 8 |
功能数量 | 1 |
端口数量 | 1 |
端子数量 | 28 |
字数 | 512 words |
字数代码 | 512 |
工作模式 | ASYNCHRONOUS |
最高工作温度 | 125 °C |
最低工作温度 | -55 °C |
组织 | 512X8 |
可输出 | YES |
封装主体材料 | CERAMIC, GLASS-SEALED |
封装代码 | DIP |
封装等效代码 | DIP28,.6 |
封装形状 | RECTANGULAR |
封装形式 | IN-LINE |
并行/串行 | PARALLEL |
峰值回流温度(摄氏度) | NOT SPECIFIED |
电源 | 5 V |
认证状态 | Not Qualified |
筛选级别 | 38535Q/M;38534H;883B |
最大待机电流 | 0.00025 A |
最大压摆率 | 0.1 mA |
最大供电电压 (Vsup) | 5.5 V |
最小供电电压 (Vsup) | 4.5 V |
标称供电电压 (Vsup) | 5 V |
表面贴装 | NO |
技术 | CMOS |
温度等级 | MILITARY |
端子面层 | Tin/Lead (Sn/Pb) |
端子形式 | THROUGH-HOLE |
端子节距 | 2.54 mm |
端子位置 | DUAL |
处于峰值回流温度下的最长时间 | NOT SPECIFIED |
X20C05DMB-45 | X20C05S-35 | X20C05SI-35 | X20C05DMB-35 | X20C05DMB-55 | X20C05EMB-35 | X20C05EMB-55 | X20C05S-55 | X20C05SI-45 | X20C05SI-55 | |
---|---|---|---|---|---|---|---|---|---|---|
描述 | Non-Volatile SRAM, 512X8, 45ns, CMOS, CDIP28, HERMETIC SEALED, CERDIP-28 | Non-Volatile SRAM, 512X8, 35ns, CMOS, PDSO28, PLASTIC, SOIC-28 | Non-Volatile SRAM, 512X8, 35ns, CMOS, PDSO28, PLASTIC, SOIC-28 | Non-Volatile SRAM, 512X8, 35ns, CMOS, CDIP28, HERMETIC SEALED, CERDIP-28 | Non-Volatile SRAM, 512X8, 55ns, CMOS, CDIP28, HERMETIC SEALED, CERDIP-28 | Non-Volatile SRAM, 512KX8, 35ns, CMOS, CQCC32, | Non-Volatile SRAM, 512KX8, 55ns, CMOS, CQCC32, | Non-Volatile SRAM, 512X8, 55ns, CMOS, PDSO28, PLASTIC, SOIC-28 | Non-Volatile SRAM, 512X8, 45ns, CMOS, PDSO28, PLASTIC, SOIC-28 | Non-Volatile SRAM, 512X8, 55ns, CMOS, PDSO28, PLASTIC, SOIC-28 |
是否Rohs认证 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 |
Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknown | unknown | unknow | unknow | unknow |
最长访问时间 | 45 ns | 35 ns | 35 ns | 35 ns | 55 ns | 35 ns | 55 ns | 55 ns | 45 ns | 55 ns |
JESD-30 代码 | R-GDIP-T28 | R-PDSO-G28 | R-PDSO-G28 | R-GDIP-T28 | R-GDIP-T28 | R-XQCC-N32 | R-XQCC-N32 | R-PDSO-G28 | R-PDSO-G28 | R-PDSO-G28 |
JESD-609代码 | e0 | e0 | e0 | e0 | e0 | e0 | e0 | e0 | e0 | e0 |
内存密度 | 4096 bit | 4096 bit | 4096 bit | 4096 bit | 4096 bit | 4096 bit | 4096 bit | 4096 bi | 4096 bi | 4096 bi |
内存集成电路类型 | NON-VOLATILE SRAM | NON-VOLATILE SRAM | NON-VOLATILE SRAM | NON-VOLATILE SRAM | NON-VOLATILE SRAM | NON-VOLATILE SRAM | NON-VOLATILE SRAM | NON-VOLATILE SRAM | NON-VOLATILE SRAM | NON-VOLATILE SRAM |
内存宽度 | 8 | 8 | 8 | 8 | 8 | 8 | 8 | 8 | 8 | 8 |
端子数量 | 28 | 28 | 28 | 28 | 28 | 32 | 32 | 28 | 28 | 28 |
字数 | 512 words | 512 words | 512 words | 512 words | 512 words | 524288 words | 524288 words | 512 words | 512 words | 512 words |
字数代码 | 512 | 512 | 512 | 512 | 512 | 512000 | 512000 | 512 | 512 | 512 |
最高工作温度 | 125 °C | 70 °C | 85 °C | 125 °C | 125 °C | 125 °C | 125 °C | 70 °C | 85 °C | 85 °C |
最低工作温度 | -55 °C | - | -40 °C | -55 °C | -55 °C | -55 °C | -55 °C | - | -40 °C | -40 °C |
组织 | 512X8 | 512X8 | 512X8 | 512X8 | 512X8 | 512KX8 | 512KX8 | 512X8 | 512X8 | 512X8 |
封装主体材料 | CERAMIC, GLASS-SEALED | PLASTIC/EPOXY | PLASTIC/EPOXY | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED | CERAMIC | CERAMIC | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
封装代码 | DIP | SOP | SOP | DIP | DIP | QCCN | QCCN | SOP | SOP | SOP |
封装等效代码 | DIP28,.6 | SOP28,.45 | SOP28,.45 | DIP28,.6 | DIP28,.6 | LCC32,.45X.55 | LCC32,.45X.55 | SOP28,.45 | SOP28,.45 | SOP28,.45 |
封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
封装形式 | IN-LINE | SMALL OUTLINE | SMALL OUTLINE | IN-LINE | IN-LINE | CHIP CARRIER | CHIP CARRIER | SMALL OUTLINE | SMALL OUTLINE | SMALL OUTLINE |
电源 | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
最大待机电流 | 0.00025 A | 0.00025 A | 0.00025 A | 0.00025 A | 0.00025 A | 0.00025 A | 0.00025 A | 0.00025 A | 0.00025 A | 0.00025 A |
最大压摆率 | 0.1 mA | 0.1 mA | 0.1 mA | 0.1 mA | 0.1 mA | 0.1 mA | 0.1 mA | 0.1 mA | 0.1 mA | 0.1 mA |
标称供电电压 (Vsup) | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
表面贴装 | NO | YES | YES | NO | NO | YES | YES | YES | YES | YES |
技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
温度等级 | MILITARY | COMMERCIAL | INDUSTRIAL | MILITARY | MILITARY | MILITARY | MILITARY | COMMERCIAL | INDUSTRIAL | INDUSTRIAL |
端子面层 | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
端子形式 | THROUGH-HOLE | GULL WING | GULL WING | THROUGH-HOLE | THROUGH-HOLE | NO LEAD | NO LEAD | GULL WING | GULL WING | GULL WING |
端子节距 | 2.54 mm | 1.27 mm | 1.27 mm | 2.54 mm | 2.54 mm | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm |
端子位置 | DUAL | DUAL | DUAL | DUAL | DUAL | QUAD | QUAD | DUAL | DUAL | DUAL |
厂商名称 | Xicor Inc | - | - | Xicor Inc | Xicor Inc | Xicor Inc | Xicor Inc | Xicor Inc | Xicor Inc | Xicor Inc |
包装说明 | HERMETIC SEALED, CERDIP-28 | PLASTIC, SOIC-28 | PLASTIC, SOIC-28 | HERMETIC SEALED, CERDIP-28 | HERMETIC SEALED, CERDIP-28 | - | - | PLASTIC, SOIC-28 | PLASTIC, SOIC-28 | PLASTIC, SOIC-28 |
其他特性 | EEPROM SOFTWARE STORE/RECALL; RETENTION/ENDURANCE - 100 YEARS/100000 CYCLES | EEPROM SOFTWARE STORE/RECALL; RETENTION/ENDURANCE - 100 YEARS/100000 CYCLES | EEPROM SOFTWARE STORE/RECALL; RETENTION/ENDURANCE - 100 YEARS/100000 CYCLES | EEPROM SOFTWARE STORE/RECALL; RETENTION/ENDURANCE - 100 YEARS/100000 CYCLES | EEPROM SOFTWARE STORE/RECALL; RETENTION/ENDURANCE - 100 YEARS/100000 CYCLES | - | - | EEPROM SOFTWARE STORE/RECALL; RETENTION/ENDURANCE - 100 YEARS/100000 CYCLES | EEPROM SOFTWARE STORE/RECALL; RETENTION/ENDURANCE - 100 YEARS/100000 CYCLES | EEPROM SOFTWARE STORE/RECALL; RETENTION/ENDURANCE - 100 YEARS/100000 CYCLES |
功能数量 | 1 | 1 | 1 | 1 | 1 | - | - | 1 | 1 | 1 |
端口数量 | 1 | 1 | 1 | 1 | 1 | - | - | 1 | 1 | 1 |
工作模式 | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | - | - | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS |
可输出 | YES | YES | YES | YES | YES | - | - | YES | YES | YES |
并行/串行 | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | - | - | PARALLEL | PARALLEL | PARALLEL |
峰值回流温度(摄氏度) | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | - | - | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
最大供电电压 (Vsup) | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | - | - | 5.5 V | 5.5 V | 5.5 V |
最小供电电压 (Vsup) | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | - | - | 4.5 V | 4.5 V | 4.5 V |
处于峰值回流温度下的最长时间 | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | - | - | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
电子工程世界版权所有 京B2-20211791 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号 Copyright © 2005-2024 EEWORLD.com.cn, Inc. All rights reserved