SPI BUS SERIAL EEPROM
| 参数名称 | 属性值 |
| 厂商名称 | ST(意法半导体) |
| 包装说明 | , |
| Reach Compliance Code | unknown |
| 内存集成电路类型 | EEPROM |
| 串行总线类型 | SPI |
| M24C02-RMC5TP/S | M24C04-WMC6TP/S | M24C01-RMC6TP/S | M24C08-FMB5TP/S | M24C04-RMB5TP/S | M24C04-RMC6TP/S | M24C02-RMC6TP/S | M24C01-WMC6TP/S | M24C08-FMC5TP/S | |
|---|---|---|---|---|---|---|---|---|---|
| 描述 | SPI BUS SERIAL EEPROM | SPI BUS SERIAL EEPROM | SPI BUS SERIAL EEPROM | SPI BUS SERIAL EEPROM | SPI BUS SERIAL EEPROM | SPI BUS SERIAL EEPROM | SPI BUS SERIAL EEPROM | SPI BUS SERIAL EEPROM | SPI BUS SERIAL EEPROM |
| 包装说明 | , | HVSON, | HVSON, | HVSON, | , | HVSON, | HVSON, | HVSON, | HVSON, |
| Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknown | unknown | unknown | unknown |
| 内存集成电路类型 | EEPROM | EEPROM | EEPROM | EEPROM | EEPROM | EEPROM | EEPROM | EEPROM | EEPROM |
| 串行总线类型 | SPI | SPI | SPI | SPI | SPI | SPI | SPI | SPI | SPI |
| 厂商名称 | ST(意法半导体) | - | ST(意法半导体) | ST(意法半导体) | ST(意法半导体) | ST(意法半导体) | ST(意法半导体) | ST(意法半导体) | ST(意法半导体) |
| 最大时钟频率 (fCLK) | - | 0.4 MHz | 0.4 MHz | 0.4 MHz | - | 0.4 MHz | 0.4 MHz | 0.4 MHz | 0.4 MHz |
| JESD-30 代码 | - | R-PDSO-N8 | R-PDSO-N8 | R-PDSO-N8 | - | R-PDSO-N8 | R-PDSO-N8 | R-PDSO-N8 | R-PDSO-N8 |
| 长度 | - | 3 mm | 3 mm | 3 mm | - | 3 mm | 3 mm | 3 mm | 3 mm |
| 内存密度 | - | 4096 bit | 1024 bit | 8192 bit | - | 4096 bit | 2048 bit | 1024 bit | 8192 bit |
| 内存宽度 | - | 8 | 8 | 8 | - | 8 | 8 | 8 | 8 |
| 功能数量 | - | 1 | 1 | 1 | - | 1 | 1 | 1 | 1 |
| 端子数量 | - | 8 | 8 | 8 | - | 8 | 8 | 8 | 8 |
| 字数 | - | 512 words | 128 words | 1024 words | - | 512 words | 256 words | 128 words | 1024 words |
| 字数代码 | - | 512 | 128 | 1000 | - | 512 | 256 | 128 | 1000 |
| 工作模式 | - | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | - | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS |
| 最高工作温度 | - | 85 °C | 85 °C | 85 °C | - | 85 °C | 85 °C | 85 °C | 85 °C |
| 最低工作温度 | - | -40 °C | -40 °C | -20 °C | - | -40 °C | -40 °C | -40 °C | -20 °C |
| 组织 | - | 512X8 | 128X8 | 1KX8 | - | 512X8 | 256X8 | 128X8 | 1KX8 |
| 封装主体材料 | - | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | - | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | - | HVSON | HVSON | HVSON | - | HVSON | HVSON | HVSON | HVSON |
| 封装形状 | - | RECTANGULAR | RECTANGULAR | RECTANGULAR | - | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | - | SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE | SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE | SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE | - | SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE | SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE | SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE | SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE |
| 并行/串行 | - | SERIAL | SERIAL | SERIAL | - | SERIAL | SERIAL | SERIAL | SERIAL |
| 座面最大高度 | - | 0.6 mm | 0.6 mm | 0.6 mm | - | 0.6 mm | 0.6 mm | 0.6 mm | 0.6 mm |
| 最大供电电压 (Vsup) | - | 5.5 V | 5.5 V | 5.5 V | - | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
| 最小供电电压 (Vsup) | - | 2.5 V | 1.8 V | 1.7 V | - | 1.8 V | 1.8 V | 2.5 V | 1.7 V |
| 表面贴装 | - | YES | YES | YES | - | YES | YES | YES | YES |
| 技术 | - | CMOS | CMOS | CMOS | - | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | - | INDUSTRIAL | INDUSTRIAL | OTHER | - | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | OTHER |
| 端子形式 | - | NO LEAD | NO LEAD | NO LEAD | - | NO LEAD | NO LEAD | NO LEAD | NO LEAD |
| 端子节距 | - | 0.5 mm | 0.5 mm | 0.5 mm | - | 0.5 mm | 0.5 mm | 0.5 mm | 0.5 mm |
| 端子位置 | - | DUAL | DUAL | DUAL | - | DUAL | DUAL | DUAL | DUAL |
| 宽度 | - | 2 mm | 2 mm | 2 mm | - | 2 mm | 2 mm | 2 mm | 2 mm |
| 最长写入周期时间 (tWC) | - | 5 ms | 5 ms | 5 ms | - | 5 ms | 5 ms | 5 ms | 5 ms |
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