FAST CMOS
12-BIT TRI-PORT
BUS EXCHANGER
Integrated Device Technology, Inc.
IDT54/74FCT16260AT/CT/ET
IDT54/74FCT162260AT/CT/ET
FEATURES:
• Common features:
– 0.5 MICRON CMOS Technology
– High-speed, low-power CMOS replacement for
ABT functions
–
Typical t
SK
(o) (Output Skew) < 250ps
– Low input and output leakage
≤1µA
(max.)
– ESD > 2000V per MIL-STD-883, Method 3015;
> 200V using machine model (C = 200pF, R = 0)
– Packages include 25 mil pitch SSOP, 19.6 mil pitch
TSSOP, 15.7 mil pitch TVSOP and 25 mil pitch Cerpack
– Extended commercial range of -40°C to +85°C
– V
CC
= 5V
±10%
• Features for FCT16260AT/CT/ET:
– High drive outputs (-32mA I
OH
, 64mA I
OL
)
– Power off disable outputs permit “live insertion”
– Typical V
OLP
(Output Ground Bounce) < 1.0V at
V
CC
= 5V, T
A
= 25°C
• Features for FCT162260AT/CT/ET:
– Balanced Output Drivers:
±24mA
(commercial),
±16mA
(military)
– Reduced system switching noise
– Typical V
OLP
(Output Ground Bounce) < 0.6V at
V
CC
= 5V,T
A
= 25°C
DESCRIPTION:
The FCT16260AT/CT/ET and the FCT162260AT/CT/ET
Tri-Port Bus Exchangers are high-speed 12-bit latched bus
multiplexers/transceivers for use in high-speed microproces-
sor applications. These Bus Exchangers support memory
interleaving with latched outputs on the B ports and address
multiplexing with latched inputs on the B ports.
The Tri-Port Bus Exchanger has three 12-bit ports. Data
may be transferred between the A port and either/both of the
B ports. The latch enable (LE1B, LE2B, LEA1B and LEA2B)
inputs control data storage. When a latch-enable input is
HIGH, the latch is transparent. When a latch-enable input is
LOW, the data at the input is latched and remains latched until
the latch enable input is returned HIGH. Independent output
enables (
OE1B
and
OE2B
) allow reading from one port while
writing to the other port.
The FCT16260AT/CT/ET are ideally suited for driving high
capacitance loads and low impedance backplanes. The
output buffers are designed with power off disable capability
to allow "live insertion" of boards when used as backplane
drivers.
The FCT162260AT/CT/ET have balanced output drive
with current limiting resistors. This offers low ground bounce,
minimal undershoot, and controlled output fall times - reduc-
ing the need for external series terminating resistors.
FUNCTIONAL BLOCK DIAGRAM
OE1B
LEA1B
A-1B
LATCH
1B
1:12
12
LE1B
12
SEL
OEA
A
1:12
12
M1
U
X0
12
12
1B-A
LATCH
12
12
LE2B
2B-A
LATCH
12
LEA2B
OE2B
The IDT logo is a registered trademark of Integrated Device Technology, Inc.
A-2B
LATCH
12
2B
1:12
3032 drw 01
MILITARY AND COMMERCIAL TEMPERATURE RANGES
©1996
Integrated Device Technology, Inc.
AUGUST 1996
DSC-3032/6
5.4
1
IDT54/74FCT16260AT/CT/ET, 162260AT/CT/ET
FAST CMOS 12-BIT TRI-PORT BUS EXCHANGER
MILITARY AND COMMERCIAL TEMPERATURES RANGES
PIN CONFIGURATIONS
OEA
LE1B
2B
3
GND
2B
2
2B
1
V
CC
A
1
A
2
A
3
GND
A
4
A
5
A
6
A
7
A
8
A
9
GND
A
10
A
11
A
12
V
CC
1B
1
1B
2
GND
1B
3
LE2B
SEL
1
2
3
4
5
6
7
8
9
10
11
12
13
56
55
54
53
52
51
50
49
48
47
46
45
44
OE2B
LEA2B
2B
4
GND
2B
5
2B
6
V
CC
2B
7
2B
8
2B
9
GND
2B
10
2B
11
2B
12
1B
12
1B
11
1B
10
GND
1B
9
1B
8
1B
7
V
CC
1B
6
1B
5
GND
1B
4
LEA1B
OE1B
OEA
LE1B
2B
3
GND
2B
2
2B
1
V
CC
A
1
A
2
A
3
GND
A
4
A
5
A
6
A
7
A
8
A
9
GND
A
10
A
11
A
12
V
CC
1B
1
1B
2
GND
1B
3
LE2B
SEL
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
CERPACK
TOP VIEW
E56-1
56
55
54
53
52
51
50
49
48
47
46
45
44
43
42
41
40
39
38
37
36
35
34
33
32
31
30
29
OE2B
LEA2B
2B
4
GND
2B
5
2B
6
V
CC
2B
7
2B
8
2B
9
GND
2B
10
2B
11
2B
12
1B
12
1B
11
1B
10
GND
1B
9
1B
8
1B
7
V
CC
1B
6
1B
5
GND
1B
4
LEA1B
OE1B
3032 drw 03
14 SO56-1 43
SO56-2
15 SO56-3 42
16
17
18
19
20
21
22
23
24
25
26
27
28
41
40
39
38
37
36
35
34
33
32
31
30
29
SSOP/
TSSOP/TVSOP
TOP VIEW
3032 drw 02
5.4
2
IDT54/74FCT16260AT/CT/ET, 162260AT/CT/ET
FAST CMOS 12-BIT TRI-PORT BUS EXCHANGER
MILITARY AND COMMERCIAL TEMPERATURES RANGES
PIN DESCRIPTION
Signal
A
(1:12)
1B
(1:12)
2B
(1:12
)
LEA1B
LEA2B
LE1B
LE2B
SEL
I/O
I/O
I/O
I/O
I
I
I
I
I
I
I
I
Description
Bidirectional Data Port A. Usually connected to the CPU's Address/Data bus.
Bidirectional Data Port 1B. Connected to the even path or even bank of memory.
Bidirectional Data Port 2B. Connected to the odd path or odd bank of memory.
Latch Enable Input for A-1B Latch. The Latch is open when LEA1B is HIGH. Data from the A-port is latched on
the HIGH to LOW transition of LEA1B.
Latch Enable Input for A-2B Latch. The Latch is open when LEA2B is HIGH. Data from the A-Port is latched on
the HIGH to LOW transition of LEA2B.
Latch Enable Input for the 1B-A Latch. The Latch is open when LE1B is HIGH. Data from the 1B port is latched
on the HIGH to LOW transition of LE1B.
Latch Enable Input for the 2B-A Latch. The Latch is open when LE2B is HIGH. Data from the 2B port is latched
on the HIGH to LOW transition of LE2B.
1B or 2B Path Selection. When HIGH, SEL enables data transfer from 1B Port to A Port. When LOW, SEL enables
data transfer from 2B Port to A Port.
Output Enable for A Port (Active LOW).
Output Enable for 1B Port (Active LOW).
Output Enable for 2B Port (Active LOW).
3032 tbl 01
OEA
OE1B
OE2B
ABSOLUTE MAXIMUM RATINGS
(1)
Unit
V
V
°C
mA
FUNCTION TABLES
1B
H
L
X
X
X
X
X
2B
X
X
X
H
L
X
X
(2)
Symbol
Description
Max.
V
TERM(2)
Terminal Voltage with Respect to –0.5 to +7.0
GND
V
TERM(3)
Terminal Voltage with Respect to
–0.5 to
GND
V
CC
+0.5
T
STG
Storage Temperature
–65 to +150
I
OUT
DC Output Current
–60 to +120
Inputs
SEL LE1B
H
H
H
L
L
L
X
Inputs
LE2B
X
X
X
H
H
L
X
OEA
L
L
L
L
L
L
H
Output
A
H
L
A
(1)
H
L
A
(1)
Z
3032 tbl 04
H
H
L
X
X
X
X
3032 tbl 02
NOTES:
1. Stresses greater than those listed under ABSOLUTE MAXIMUM RAT-
INGS may cause permanent damage to the device. This is a stress rating
only and functional operation of the device at these or any other conditions
above those indicated in the operational sections of this specification is
not implied. Exposure to absolute maximum rating conditions for
extended periods may affect reliability.
2. All device terminals except FCT162XXXT Output and I/O terminals.
3. Output and I/O terminals for FCT162XXXT.
Outputs
A
H
L
LEA1B LEA2B
H
H
H
H
L
L
L
X
X
X
X
H
H
L
L
H
H
L
X
X
X
X
OE1B OE2B
L
L
L
L
L
L
L
H
L
H
L
L
L
L
L
L
L
L
H
H
L
L
1B
H
L
H
L
B
(1)
B
(1)
B
(1)
Z
Active
Z
Active
2B
H
L
B
(1)
B
(1)
H
L
B
(1)
Z
Z
Active
Active
CAPACITANCE
(T
A
= +25°C, F = 1.0MH
Z
)
Symbol
Parameter
(1)
C
IN
Input
Capacitance
C
I/O
I/O
Capacitance
Conditions
V
IN
= 0V
V
OUT
= 0V
Typ.
3.5
3.5
Max.
6.0
8.0
Unit
pF
pF
3032 tbl 03
H
L
H
L
X
X
X
X
X
NOTE:
1. This parameter is measured at characterization but not tested.
3032 tbl 05
NOTES:
1. Output level before the indicated steady-state input conditions were
established.
2. H = HIGH Voltage Level
L = LOW Voltage Level
X = Don't Care
Z = High Impedance
↑
= LOW-to-HIGH Transition
5.4
3
IDT54/74FCT16260AT/CT/ET, 162260AT/CT/ET
FAST CMOS 12-BIT TRI-PORT BUS EXCHANGER
MILITARY AND COMMERCIAL TEMPERATURES RANGES
DC ELECTRICAL CHARACTERISTICS OVER OPERATING RANGE
Following Conditions Apply Unless Otherwise Specified:
Commercial: T
A
= –40°C to +85°C, V
CC
= 5.0V
±
10%; Military: T
A
= –55°C to +125°C, V
CC
= 5.0V
±
10%
Symbol
V
IH
V
IL
I
I H
I
I L
I
OZH
I
OZL
V
IK
I
OS
V
H
I
CCL
I
CCH
I
CCZ
Parameter
Input HIGH Level
Input LOW Level
Input HIGH Current (Input pins)
(5)
Input HIGH Current (I/O pins)
(5)
Input LOW Current (Input pins)
(5)
Input LOW Current (I/O pins)
(5)
High Impedance Output Current
(3-State Output pins)
(5)
Clamp Diode Voltage
Short Circuit Current
Input Hysteresis
Quiescent Power Supply Current
V
CC
= Min., I
IN
= –18mA
V
CC
= Max., V
O
= GND
(3)
—
Test Conditions
(1)
Guaranteed Logic HIGH Level
Guaranteed Logic LOW Level
V
CC
= Max.
V
I
= V
CC
V
I
= GND
V
CC
= Max.
V
O
= 2.7V
V
O
= 0.5V
Min.
2.0
—
—
—
—
—
—
—
—
–80
—
—
Typ.
(2)
—
—
—
—
—
—
—
—
–
0.7
–
140
Max.
—
Unit
V
V
µA
0.8
±1
±1
±1
±1
±1
±1
–
1.2
–
225
—
µA
V
mA
mV
µA
100
5
V
CC
= Max., V
IN
= GND or V
CC
500
3032 tbl 06
OUTPUT DRIVE CHARACTERISTICS FOR FCT16260T
Symbol
I
O
V
OH
Parameter
Output Drive Current
Output HIGH Voltage
Test Conditions
(1)
V
CC
= Max., V
O
= 2.5V
(3)
V
CC
= Min.
V
IN
= V
IH
or V
IL
I
OH
= –3mA
I
OH
= –12mA MIL.
I
OH
= –15mA COM'L.
I
OH
= –24mA MIL.
I
OH
= –32mA COM'L.
(4)
I
OL
= 48mA MIL.
I
OL
= 64mA COM'L.
≤
4.5V
Min.
–50
2.5
2.4
2.0
—
—
Typ.
(2)
—
Max.
–
180
—
—
—
0.55
±1
Unit
mA
V
V
V
V
µA
3032 tbl 07
3.5
3.5
3.0
0.2
—
V
OL
I
OFF
Output LOW Voltage
Input/Output Power Off Leakage
(5)
V
CC
= Min.
V
IN
= V
IH
or V
IL
V
CC
= 0V, V
IN
or V
O
OUTPUT DRIVE CHARACTERISTICS FOR FCT162260T
Symbol
I
ODL
I
ODH
V
OH
V
OL
Parameter
Output LOW Current
Output HIGH Current
Output HIGH Voltage
Output LOW Voltage
Test Conditions
(1)
V
CC
= 5V, V
IN
= V
IH
or V
IL,
V
OUT
= 1.5V
(3)
V
CC
= 5V, V
IN
= V
IH
or V
IL,
V
OUT
= 1.5V
(3)
V
CC
= Min.
V
IN
= V
IH
or V
IL
V
CC
= Min.
V
IN
= V
IH
or V
IL
I
OH
= –16mA MIL.
I
OH
= –24mA COM'L.
I
OL
= 16mA MIL.
I
OL
= 24mA COM'L.
Min.
60
–60
2.4
—
Typ.
(2)
115
–115
3.3
0.3
Max.
200
–200
—
0.55
Unit
mA
mA
V
V
3032 lnk 08
NOTES:
1. For conditions shown as Max. or Min., use appropriate value specified under Electrical Characteristics for the applicable device type.
2. Typical values are at Vcc = 5.0V, +25°C ambient.
3. Not more than one output should be tested at one time. Duration of the test should not exceed one second.
4. Duration of the condition can not exceed one second.
5. The test limit for this parameter is
±
5µA at T
A
= –55°C.
5.4
4
IDT54/74FCT16260AT/CT/ET, 162260AT/CT/ET
FAST CMOS 12-BIT TRI-PORT BUS EXCHANGER
MILITARY AND COMMERCIAL TEMPERATURES RANGES
POWER SUPPLY CHARACTERISTICS
Symbol
∆I
CC
I
CCD
Parameter
Quiescent Power Supply Current
TTL Inputs HIGH
Dynamic Power Supply Current
(4)
Test Conditions
(1)
V
CC
= Max.
V
IN
= 3.4V
(3)
V
CC
= Max.
Outputs Open
One Output Port Enabled
LExx = V
CC
One Input Bit Toggling
One Output Bit Toggling
50% Duty Cycle
V
CC
= Max.
Outputs Open
fi = 10MHz
50% Duty Cycle
One Output Port Enabled
LExx = V
CC
One Input Bit Toggling
One Output Bit Toggling
V
CC
= Max.
Outputs Open
fi = 2.5MHz
50% Duty Cycle
One Output Port Enabled
LExx = V
CC
Twelve Input Bits Toggling
Twelve Output Bits Toggling
Min.
—
—
Typ.
(2)
0.5
60
Max.
1.5
100
Unit
mA
µA/
MHz
V
IN
= V
CC
V
IN
= GND
I
C
Total Power Supply Current
(6)
V
IN
= V
CC
V
IN
= GND
V
IN
= 3.4V
V
IN
= GND
—
0.6
1.5
mA
—
0.9
2.3
V
IN
= V
CC
V
IN
= GND
V
IN
= 3.4V
V
IN
= GND
—
1.8
3.5
(5)
—
4.8
12.5
(5)
NOTES:
1. For conditions shown as Max. or Min., use appropriate value specified under Electrical Characteristics for the applicable device type.
2. Typical values are at V
CC
= 5.0V, +25°C ambient.
3. Per TTL driven input (V
IN
= 3.4V). All other inputs at V
CC
or GND.
4. This parameter is not directly testable, but is derived for use in Total Power Supply Calculations.
5. Values for these conditions are examples of the I
CC
formula. These limits are guaranteed but not tested.
6. I
C
= I
QUIESCENT
+ I
INPUTS
+ I
DYNAMIC
I
C
= I
CC
+
∆I
CC
D
H
N
T
+ I
CCD
(f
CP
N
CP
/2 + f
i
N
i
)
I
CC
= Quiescent Current (I
CCL
,
I
CCH
and I
CCZ
)
∆I
CC
= Power Supply Current for a TTL High Input (V
IN
= 3.4V)
D
H
= Duty Cycle for TTL Inputs High
N
T
= Number of TTL Inputs at D
H
I
CCD
= Dynamic Current Caused by an Input Transition Pair (HLH or LHL)
f
CP
= Clock Frequency for Register Devices (Zero for Non-Register Devices)
N
CP
= Number of Clock Inputs at f
CP
f
i
= Input Frequency
N
i
= Number of Inputs at f
i
3032 tbl 09
5.4
5
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