Flash, 128KX8, 90ns, PDIP32, 0.600 INCH, PLASTIC, DIP-32
| 参数名称 | 属性值 |
| 厂商名称 | Winbond(华邦电子) |
| 零件包装代码 | DIP |
| 包装说明 | DIP, DIP32,.6 |
| 针数 | 32 |
| Reach Compliance Code | compliant |
| ECCN代码 | EAR99 |
| 最长访问时间 | 90 ns |
| 其他特性 | HARDWARE AND SOFTWARE DATA PROTECTION; 10-YEARS DATA RETENTION; 10K PROGRAM/ERASE CYCLE |
| 命令用户界面 | NO |
| 数据轮询 | YES |
| 数据保留时间-最小值 | 10 |
| 耐久性 | 10000 Write/Erase Cycles |
| JESD-30 代码 | R-PDIP-T32 |
| 长度 | 41.91 mm |
| 内存密度 | 1048576 bit |
| 内存集成电路类型 | FLASH |
| 内存宽度 | 8 |
| 功能数量 | 1 |
| 部门数/规模 | 1K |
| 端子数量 | 32 |
| 字数 | 131072 words |
| 字数代码 | 128000 |
| 工作模式 | ASYNCHRONOUS |
| 最高工作温度 | 70 °C |
| 最低工作温度 | |
| 组织 | 128KX8 |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | DIP |
| 封装等效代码 | DIP32,.6 |
| 封装形状 | RECTANGULAR |
| 封装形式 | IN-LINE |
| 并行/串行 | PARALLEL |
| 电源 | 5 V |
| 编程电压 | 5 V |
| 认证状态 | Not Qualified |
| 座面最大高度 | 5.33 mm |
| 部门规模 | 128 |
| 最大待机电流 | 0.0001 A |
| 最大压摆率 | 0.05 mA |
| 最大供电电压 (Vsup) | 5.5 V |
| 最小供电电压 (Vsup) | 4.5 V |
| 标称供电电压 (Vsup) | 5 V |
| 表面贴装 | NO |
| 技术 | CMOS |
| 温度等级 | COMMERCIAL |
| 端子形式 | THROUGH-HOLE |
| 端子节距 | 2.54 mm |
| 端子位置 | DUAL |
| 切换位 | YES |
| 类型 | NOR TYPE |
| 宽度 | 15.24 mm |
| 最长写入周期时间 (tWC) | 10 ms |
| W29EE011-90B | W29EE011P15N | W29EE011Q-90 | W29EE011Q-15 | W29EE011P90N | W29EE011-15B | W29EE011-15N | W29EE011-90N | W29EE011Q15B | W29EE011Q90B | |
|---|---|---|---|---|---|---|---|---|---|---|
| 描述 | Flash, 128KX8, 90ns, PDIP32, 0.600 INCH, PLASTIC, DIP-32 | Flash, 128KX8, 150ns, PQCC32, PLASTIC, LCC-32 | Flash, 128KX8, 90ns, PDSO32, 8 X 14 MM, STSOP-32 | Flash, 128KX8, 150ns, PDSO32, 8 X 14 MM, STSOP-32 | Flash, 128KX8, 90ns, PQCC32, PLASTIC, LCC-32 | Flash, 128KX8, 150ns, PDIP32, 0.600 INCH, PLASTIC, DIP-32 | Flash, 128KX8, 150ns, PDIP32, 0.600 INCH, PLASTIC, DIP-32 | Flash, 128KX8, 90ns, PDIP32, 0.600 INCH, PLASTIC, DIP-32 | Flash, 128KX8, 150ns, PDSO32, 8 X 14 MM, STSOP-32 | Flash, 128KX8, 90ns, PDSO32, 8 X 14 MM, STSOP-32 |
| 零件包装代码 | DIP | QFJ | TSOP | TSOP | QFJ | DIP | DIP | DIP | TSOP | TSOP |
| 包装说明 | DIP, DIP32,.6 | QCCJ, LDCC32,.5X.6 | TSSOP, TSSOP32,.56,20 | TSSOP, TSSOP32,.56,20 | QCCJ, LDCC32,.5X.6 | DIP, DIP32,.6 | DIP, DIP32,.6 | DIP, DIP32,.6 | TSSOP, TSSOP32,.56,20 | TSSOP, TSSOP32,.56,20 |
| 针数 | 32 | 32 | 32 | 32 | 32 | 32 | 32 | 32 | 32 | 32 |
| Reach Compliance Code | compliant | not_compliant | unknown | not_compliant | not_compliant | compliant | compliant | compliant | not_compliant | not_compliant |
| ECCN代码 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 |
| 最长访问时间 | 90 ns | 150 ns | 90 ns | 150 ns | 90 ns | 150 ns | 150 ns | 90 ns | 150 ns | 90 ns |
| 其他特性 | HARDWARE AND SOFTWARE DATA PROTECTION; 10-YEARS DATA RETENTION; 10K PROGRAM/ERASE CYCLE | HARDWARE AND SOFTWARE DATA PROTECTION; 10-YEARS DATA RETENTION; 1K PROGRAM/ERASE CYCLE | HARDWARE AND SOFTWARE DATA PROTECTION; 10-YEARS DATA RETENTION; 1K PROGRAM/ERASE CYCLE | HARDWARE AND SOFTWARE DATA PROTECTION; 10-YEARS DATA RETENTION; 1K PROGRAM/ERASE CYCLE | HARDWARE AND SOFTWARE DATA PROTECTION; 10-YEARS DATA RETENTION; 1K PROGRAM/ERASE CYCLE | HARDWARE AND SOFTWARE DATA PROTECTION; 10-YEARS DATA RETENTION; 10K PROGRAM/ERASE CYCLE | HARDWARE AND SOFTWARE DATA PROTECTION; 10-YEARS DATA RETENTION; 1K PROGRAM/ERASE CYCLE | HARDWARE AND SOFTWARE DATA PROTECTION; 10-YEARS DATA RETENTION; 1K PROGRAM/ERASE CYCLE | HARDWARE AND SOFTWARE DATA PROTECTION; 10-YEARS DATA RETENTION; 10K PROGRAM/ERASE CYCLE | HARDWARE AND SOFTWARE DATA PROTECTION; 10-YEARS DATA RETENTION; 10K PROGRAM/ERASE CYCLE |
| 命令用户界面 | NO | NO | NO | NO | NO | NO | NO | NO | NO | NO |
| 数据轮询 | YES | YES | YES | YES | YES | YES | YES | YES | YES | YES |
| 数据保留时间-最小值 | 10 | 10 | 10 | 10 | 10 | 10 | 10 | 10 | 10 | 10 |
| 耐久性 | 10000 Write/Erase Cycles | 1000 Write/Erase Cycles | 1000 Write/Erase Cycles | 1000 Write/Erase Cycles | 1000 Write/Erase Cycles | 10000 Write/Erase Cycles | 1000 Write/Erase Cycles | 1000 Write/Erase Cycles | 10000 Write/Erase Cycles | 10000 Write/Erase Cycles |
| JESD-30 代码 | R-PDIP-T32 | R-PQCC-J32 | R-PDSO-G32 | R-PDSO-G32 | R-PQCC-J32 | R-PDIP-T32 | R-PDIP-T32 | R-PDIP-T32 | R-PDSO-G32 | R-PDSO-G32 |
| 长度 | 41.91 mm | 13.97 mm | 12.4 mm | 12.4 mm | 13.97 mm | 41.91 mm | 41.91 mm | 41.91 mm | 12.4 mm | 12.4 mm |
| 内存密度 | 1048576 bit | 1048576 bit | 1048576 bit | 1048576 bit | 1048576 bit | 1048576 bit | 1048576 bit | 1048576 bit | 1048576 bit | 1048576 bit |
| 内存集成电路类型 | FLASH | FLASH | FLASH | FLASH | FLASH | FLASH | FLASH | FLASH | FLASH | FLASH |
| 内存宽度 | 8 | 8 | 8 | 8 | 8 | 8 | 8 | 8 | 8 | 8 |
| 功能数量 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
| 部门数/规模 | 1K | 1K | 1K | 1K | 1K | 1K | 1K | 1K | 1K | 1K |
| 端子数量 | 32 | 32 | 32 | 32 | 32 | 32 | 32 | 32 | 32 | 32 |
| 字数 | 131072 words | 131072 words | 131072 words | 131072 words | 131072 words | 131072 words | 131072 words | 131072 words | 131072 words | 131072 words |
| 字数代码 | 128000 | 128000 | 128000 | 128000 | 128000 | 128000 | 128000 | 128000 | 128000 | 128000 |
| 工作模式 | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS |
| 最高工作温度 | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C |
| 组织 | 128KX8 | 128KX8 | 128KX8 | 128KX8 | 128KX8 | 128KX8 | 128KX8 | 128KX8 | 128KX8 | 128KX8 |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | DIP | QCCJ | TSSOP | TSSOP | QCCJ | DIP | DIP | DIP | TSSOP | TSSOP |
| 封装等效代码 | DIP32,.6 | LDCC32,.5X.6 | TSSOP32,.56,20 | TSSOP32,.56,20 | LDCC32,.5X.6 | DIP32,.6 | DIP32,.6 | DIP32,.6 | TSSOP32,.56,20 | TSSOP32,.56,20 |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | IN-LINE | CHIP CARRIER | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | CHIP CARRIER | IN-LINE | IN-LINE | IN-LINE | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
| 并行/串行 | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL |
| 电源 | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| 编程电压 | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 座面最大高度 | 5.33 mm | 3.56 mm | 1.2 mm | 1.2 mm | 3.56 mm | 5.33 mm | 5.33 mm | 5.33 mm | 1.2 mm | 1.2 mm |
| 部门规模 | 128 | 128 | 128 | 128 | 128 | 128 | 128 | 128 | 128 | 128 |
| 最大待机电流 | 0.0001 A | 0.0001 A | 0.0001 A | 0.0001 A | 0.0001 A | 0.0001 A | 0.0001 A | 0.0001 A | 0.0001 A | 0.0001 A |
| 最大压摆率 | 0.05 mA | 0.05 mA | 0.05 mA | 0.05 mA | 0.05 mA | 0.05 mA | 0.05 mA | 0.05 mA | 0.05 mA | 0.05 mA |
| 最大供电电压 (Vsup) | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
| 最小供电电压 (Vsup) | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V |
| 标称供电电压 (Vsup) | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| 表面贴装 | NO | YES | YES | YES | YES | NO | NO | NO | YES | YES |
| 技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL |
| 端子形式 | THROUGH-HOLE | J BEND | GULL WING | GULL WING | J BEND | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | GULL WING | GULL WING |
| 端子节距 | 2.54 mm | 1.27 mm | 0.5 mm | 0.5 mm | 1.27 mm | 2.54 mm | 2.54 mm | 2.54 mm | 0.5 mm | 0.5 mm |
| 端子位置 | DUAL | QUAD | DUAL | DUAL | QUAD | DUAL | DUAL | DUAL | DUAL | DUAL |
| 切换位 | YES | YES | YES | YES | YES | YES | YES | YES | YES | YES |
| 类型 | NOR TYPE | NOR TYPE | NOR TYPE | NOR TYPE | NOR TYPE | NOR TYPE | NOR TYPE | NOR TYPE | NOR TYPE | NOR TYPE |
| 宽度 | 15.24 mm | 11.43 mm | 8 mm | 8 mm | 11.43 mm | 15.24 mm | 15.24 mm | 15.24 mm | 8 mm | 8 mm |
| 最长写入周期时间 (tWC) | 10 ms | 10 ms | 10 ms | 10 ms | 10 ms | 10 ms | 10 ms | 10 ms | 10 ms | 10 ms |
| 厂商名称 | Winbond(华邦电子) | - | - | Winbond(华邦电子) | Winbond(华邦电子) | Winbond(华邦电子) | Winbond(华邦电子) | Winbond(华邦电子) | Winbond(华邦电子) | Winbond(华邦电子) |
| 是否Rohs认证 | - | 不符合 | 不符合 | 不符合 | 不符合 | - | - | - | 不符合 | 不符合 |
| JESD-609代码 | - | e0 | e0 | e0 | e0 | - | - | - | e0 | e0 |
| 峰值回流温度（摄氏度） | - | NOT SPECIFIED | NOT SPECIFIED | 240 | NOT SPECIFIED | - | - | - | 240 | 240 |
| 端子面层 | - | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | - | - | - | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| 处于峰值回流温度下的最长时间 | - | NOT SPECIFIED | NOT SPECIFIED | 30 | NOT SPECIFIED | - | - | - | 30 | 30 |
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