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Datasheet> 器件分类 > 可编程逻辑器件> 可编程逻辑> EPM9320ARC208-15

EPM9320ARC208-15: 产品描述EE PLD, 16ns, CMOS, PQFP208, HEAT SINK, POWER, QFP-208; 产品类别可编程逻辑器件可编程逻辑; 文件大小2MB，共37页; 制造商Altera (Intel)

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EPM9320ARC208-15概述

EE PLD, 16ns, CMOS, PQFP208, HEAT SINK, POWER, QFP-208

EPM9320ARC208-15规格参数

参数名称	属性值
是否Rohs认证	不符合
厂商名称	Altera (Intel)
零件包装代码	QFP
包装说明	HFQFP,
针数	208
Reach Compliance Code	compliant
ECCN代码	EAR99
其他特性	320 MACROCELLS; 484 FLIP-FLOPS; 20 LABS; CONFIGURABLE I/O OPERATION WITH 3.3V OR 5V
JESD-30 代码	S-PQFP-G208
JESD-609代码	e3
长度	28 mm
专用输入次数
I/O 线路数量	132
端子数量	208
最高工作温度	70 °C
最低工作温度
组织	0 DEDICATED INPUTS, 132 I/O
输出函数	MACROCELL
封装主体材料	PLASTIC/EPOXY
封装代码	HFQFP
封装形状	SQUARE
封装形式	FLATPACK, HEAT SINK/SLUG, FINE PITCH
可编程逻辑类型	EE PLD
传播延迟	16 ns
认证状态	Not Qualified
座面最大高度	4.07 mm
最大供电电压	5.25 V
最小供电电压	4.75 V
标称供电电压	5 V
表面贴装	YES
技术	CMOS
温度等级	COMMERCIAL
端子面层	MATTE TIN
端子形式	GULL WING
端子节距	0.5 mm
端子位置	QUAD
宽度	28 mm

EPM9320ARC208-15相似产品对比

	EPM9320ARC208-15	EPM9560ARC208-15	EPM9560ARI208-15	EPM9560ARC240-15	EPM9560ARI240-15	EPM9320ARI208-7	EPM9320ARC208-7	EPM9320ABC356-15	EPM9320ABC356-7
描述	EE PLD, 16ns, CMOS, PQFP208, HEAT SINK, POWER, QFP-208	EE PLD, 16.6ns, CMOS, PQFP208, HEAT SINK, POWER, QFP-208	EE PLD, 16.6ns, CMOS, PQFP208, HEAT SINK, POWER, QFP-208	EE PLD, 16.6ns, CMOS, PQFP240, HEAT SINK, POWER, QFP-240	EE PLD, 16.6ns, CMOS, PQFP240, HEAT SINK, POWER, QFP-240	EE PLD, 8.2ns, 320-Cell, CMOS, PQFP208, HEAT SINK, POWER, QFP-208	EE PLD, 8.2ns, 320-Cell, CMOS, PQFP208, HEAT SINK, POWER, QFP-208	EE PLD, 16ns, CMOS, PBGA356, HEAT SINK, BGA-356	EE PLD, 8.2ns, 320-Cell, CMOS, PBGA356, HEAT SINK, BGA-356
厂商名称	Altera (Intel)	Altera (Intel)	Altera (Intel)	Altera (Intel)	Altera (Intel)	Altera (Intel)	Altera (Intel)	Altera (Intel)	Altera (Intel)
零件包装代码	QFP	QFP	QFP	QFP	QFP	QFP	QFP	BGA	BGA
包装说明	HFQFP,	HFQFP,	HFQFP,	HFQFP,	HFQFP,	HFQFP, HQFP208,1.2SQ,20	HFQFP, HQFP208,1.2SQ,20	HLBGA,	HLBGA, BGA356,26X26,50
针数	208	208	208	240	240	208	208	356	356
Reach Compliance Code	compliant	compliant	unknown	compliant	compliant	compliant	compliant	compliant	compliant
其他特性	320 MACROCELLS; 484 FLIP-FLOPS; 20 LABS; CONFIGURABLE I/O OPERATION WITH 3.3V OR 5V	560 MACROCELLS; 772 FLIP-FLOPS; 35 LABS; CONFIGURABLE I/O OPERATION WITH 3.3V OR 5V	560 MACROCELLS; 772 FLIP-FLOPS; 35 LABS; CONFIGURABLE I/O OPERATION WITH 3.3V OR 5V	560 MACROCELLS; 772 FLIP-FLOPS; 35 LABS; CONFIGURABLE I/O OPERATION WITH 3.3V OR 5V	560 MACROCELLS; 772 FLIP-FLOPS; 35 LABS; CONFIGURABLE I/O OPERATION WITH 3.3V OR 5V	320 MACROCELLS; 484 FLIP-FLOPS; 20 LABS; CONFIGURABLE I/O OPERATION WITH 3.3V OR 5V	320 MACROCELLS; 484 FLIP-FLOPS; 20 LABS; CONFIGURABLE I/O OPERATION WITH 3.3V OR 5V	320 MACROCELLS; 484 FLIP-FLOPS; 20 LABS; CONFIGURABLE I/O OPERATION WITH 3.3V OR 5V	320 MACROCELLS; 484 FLIP-FLOPS; 20 LABS; CONFIGURABLE I/O OPERATION WITH 3.3V OR 5V
JESD-30 代码	S-PQFP-G208	S-PQFP-G208	S-PQFP-G208	S-PQFP-G240	S-PQFP-G240	S-PQFP-G208	S-PQFP-G208	S-PBGA-B356	S-PBGA-B356
JESD-609代码	e3	e3	e3	e3	e3	e0	e0	e1	e0
长度	28 mm	28 mm	28 mm	32 mm	32 mm	28 mm	28 mm	35 mm	35 mm
I/O 线路数量	132	153	153	191	191	132	132	168	168
端子数量	208	208	208	240	240	208	208	356	356
最高工作温度	70 °C	70 °C	85 °C	70 °C	85 °C	85 °C	70 °C	70 °C	70 °C
组织	0 DEDICATED INPUTS, 132 I/O	0 DEDICATED INPUTS, 153 I/O	0 DEDICATED INPUTS, 153 I/O	0 DEDICATED INPUTS, 191 I/O	0 DEDICATED INPUTS, 191 I/O	0 DEDICATED INPUTS, 132 I/O	0 DEDICATED INPUTS, 132 I/O	0 DEDICATED INPUTS, 168 I/O	0 DEDICATED INPUTS, 168 I/O
输出函数	MACROCELL	MACROCELL	MACROCELL	MACROCELL	MACROCELL	MACROCELL	MACROCELL	MACROCELL	MACROCELL
封装主体材料	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
封装代码	HFQFP	HFQFP	HFQFP	HFQFP	HFQFP	HFQFP	HFQFP	HLBGA	HLBGA
封装形状	SQUARE	SQUARE	SQUARE	SQUARE	SQUARE	SQUARE	SQUARE	SQUARE	SQUARE
封装形式	FLATPACK, HEAT SINK/SLUG, FINE PITCH	FLATPACK, HEAT SINK/SLUG, FINE PITCH	FLATPACK, HEAT SINK/SLUG, FINE PITCH	FLATPACK, HEAT SINK/SLUG, FINE PITCH	FLATPACK, HEAT SINK/SLUG, FINE PITCH	FLATPACK, HEAT SINK/SLUG, FINE PITCH	FLATPACK, HEAT SINK/SLUG, FINE PITCH	GRID ARRAY, HEAT SINK/SLUG, LOW PROFILE	GRID ARRAY, HEAT SINK/SLUG, LOW PROFILE
可编程逻辑类型	EE PLD	EE PLD	EE PLD	EE PLD	EE PLD	EE PLD	EE PLD	EE PLD	EE PLD
传播延迟	16 ns	16.6 ns	16.6 ns	16.6 ns	16.6 ns	8.2 ns	8.2 ns	16 ns	8.2 ns
认证状态	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
座面最大高度	4.07 mm	4.07 mm	4.07 mm	4.2 mm	4.2 mm	4.07 mm	4.07 mm	1.63 mm	1.63 mm
最大供电电压	5.25 V	5.25 V	5.5 V	5.25 V	5.5 V	5.5 V	5.25 V	5.25 V	5.25 V
最小供电电压	4.75 V	4.75 V	4.5 V	4.75 V	4.5 V	4.5 V	4.75 V	4.75 V	4.75 V
标称供电电压	5 V	5 V	5 V	5 V	5 V	5 V	5 V	5 V	5 V
表面贴装	YES	YES	YES	YES	YES	YES	YES	YES	YES
技术	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS
温度等级	COMMERCIAL	COMMERCIAL	INDUSTRIAL	COMMERCIAL	INDUSTRIAL	INDUSTRIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL
端子面层	MATTE TIN	MATTE TIN	MATTE TIN	MATTE TIN	MATTE TIN	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	TIN SILVER COPPER	Tin/Lead (Sn/Pb)
端子形式	GULL WING	GULL WING	GULL WING	GULL WING	GULL WING	GULL WING	GULL WING	BALL	BALL
端子节距	0.5 mm	0.5 mm	0.5 mm	0.5 mm	0.5 mm	0.5 mm	0.5 mm	1.27 mm	1.27 mm
端子位置	QUAD	QUAD	QUAD	QUAD	QUAD	QUAD	QUAD	BOTTOM	BOTTOM
宽度	28 mm	28 mm	28 mm	32 mm	32 mm	28 mm	28 mm	35 mm	35 mm
是否Rohs认证	不符合	不符合	-	不符合	不符合	不符合	不符合	不符合	不符合
ECCN代码	EAR99	3A991	-	3A991	3A991	-	-	EAR99	-

EPM9320ARC208-15

EPM9320ARC208-15概述

EPM9320ARC208-15规格参数

EPM9320ARC208-15相似产品对比

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