EPM9320ABC356-7,EPM9320ABC356-7 pdf中文资料,EPM9320ABC356-7引脚图,EPM9320ABC356-7电路-Datasheet-电子工程世界

Datasheet> 器件分类 > 可编程逻辑器件> 可编程逻辑> EPM9320ABC356-7

EPM9320ABC356-7: 产品描述EE PLD, 8.2ns, 320-Cell, CMOS, PBGA356, HEAT SINK, BGA-356; 产品类别可编程逻辑器件可编程逻辑; 文件大小2MB，共37页; 制造商Altera (Intel)

下载文档详细参数选型对比全文预览

EPM9320ABC356-7概述

EE PLD, 8.2ns, 320-Cell, CMOS, PBGA356, HEAT SINK, BGA-356

EPM9320ABC356-7规格参数

参数名称	属性值
是否Rohs认证	不符合
厂商名称	Altera (Intel)
零件包装代码	BGA
包装说明	HLBGA, BGA356,26X26,50
针数	356
Reach Compliance Code	compliant
其他特性	320 MACROCELLS; 484 FLIP-FLOPS; 20 LABS; CONFIGURABLE I/O OPERATION WITH 3.3V OR 5V
系统内可编程	YES
JESD-30 代码	S-PBGA-B356
JESD-609代码	e0
JTAG BST	YES
长度	35 mm
专用输入次数
I/O 线路数量	168
宏单元数	320
端子数量	356
最高工作温度	70 °C
最低工作温度
组织	0 DEDICATED INPUTS, 168 I/O
输出函数	MACROCELL
封装主体材料	PLASTIC/EPOXY
封装代码	HLBGA
封装等效代码	BGA356,26X26,50
封装形状	SQUARE
封装形式	GRID ARRAY, HEAT SINK/SLUG, LOW PROFILE
峰值回流温度（摄氏度）	220
电源	3.3/5,5 V
可编程逻辑类型	EE PLD
传播延迟	8.2 ns
认证状态	Not Qualified
座面最大高度	1.63 mm
最大供电电压	5.25 V
最小供电电压	4.75 V
标称供电电压	5 V
表面贴装	YES
技术	CMOS
温度等级	COMMERCIAL
端子面层	Tin/Lead (Sn/Pb)
端子形式	BALL
端子节距	1.27 mm
端子位置	BOTTOM
处于峰值回流温度下的最长时间	NOT SPECIFIED
宽度	35 mm

EPM9320ABC356-7相似产品对比

	EPM9320ABC356-7	EPM9560ARC208-15	EPM9560ARI208-15	EPM9560ARC240-15	EPM9560ARI240-15	EPM9320ARI208-7	EPM9320ARC208-15	EPM9320ARC208-7	EPM9320ABC356-15
描述	EE PLD, 8.2ns, 320-Cell, CMOS, PBGA356, HEAT SINK, BGA-356	EE PLD, 16.6ns, CMOS, PQFP208, HEAT SINK, POWER, QFP-208	EE PLD, 16.6ns, CMOS, PQFP208, HEAT SINK, POWER, QFP-208	EE PLD, 16.6ns, CMOS, PQFP240, HEAT SINK, POWER, QFP-240	EE PLD, 16.6ns, CMOS, PQFP240, HEAT SINK, POWER, QFP-240	EE PLD, 8.2ns, 320-Cell, CMOS, PQFP208, HEAT SINK, POWER, QFP-208	EE PLD, 16ns, CMOS, PQFP208, HEAT SINK, POWER, QFP-208	EE PLD, 8.2ns, 320-Cell, CMOS, PQFP208, HEAT SINK, POWER, QFP-208	EE PLD, 16ns, CMOS, PBGA356, HEAT SINK, BGA-356
厂商名称	Altera (Intel)	Altera (Intel)	Altera (Intel)	Altera (Intel)	Altera (Intel)	Altera (Intel)	Altera (Intel)	Altera (Intel)	Altera (Intel)
零件包装代码	BGA	QFP	QFP	QFP	QFP	QFP	QFP	QFP	BGA
包装说明	HLBGA, BGA356,26X26,50	HFQFP,	HFQFP,	HFQFP,	HFQFP,	HFQFP, HQFP208,1.2SQ,20	HFQFP,	HFQFP, HQFP208,1.2SQ,20	HLBGA,
针数	356	208	208	240	240	208	208	208	356
Reach Compliance Code	compliant	compliant	unknown	compliant	compliant	compliant	compliant	compliant	compliant
其他特性	320 MACROCELLS; 484 FLIP-FLOPS; 20 LABS; CONFIGURABLE I/O OPERATION WITH 3.3V OR 5V	560 MACROCELLS; 772 FLIP-FLOPS; 35 LABS; CONFIGURABLE I/O OPERATION WITH 3.3V OR 5V	560 MACROCELLS; 772 FLIP-FLOPS; 35 LABS; CONFIGURABLE I/O OPERATION WITH 3.3V OR 5V	560 MACROCELLS; 772 FLIP-FLOPS; 35 LABS; CONFIGURABLE I/O OPERATION WITH 3.3V OR 5V	560 MACROCELLS; 772 FLIP-FLOPS; 35 LABS; CONFIGURABLE I/O OPERATION WITH 3.3V OR 5V	320 MACROCELLS; 484 FLIP-FLOPS; 20 LABS; CONFIGURABLE I/O OPERATION WITH 3.3V OR 5V	320 MACROCELLS; 484 FLIP-FLOPS; 20 LABS; CONFIGURABLE I/O OPERATION WITH 3.3V OR 5V	320 MACROCELLS; 484 FLIP-FLOPS; 20 LABS; CONFIGURABLE I/O OPERATION WITH 3.3V OR 5V	320 MACROCELLS; 484 FLIP-FLOPS; 20 LABS; CONFIGURABLE I/O OPERATION WITH 3.3V OR 5V
JESD-30 代码	S-PBGA-B356	S-PQFP-G208	S-PQFP-G208	S-PQFP-G240	S-PQFP-G240	S-PQFP-G208	S-PQFP-G208	S-PQFP-G208	S-PBGA-B356
JESD-609代码	e0	e3	e3	e3	e3	e0	e3	e0	e1
长度	35 mm	28 mm	28 mm	32 mm	32 mm	28 mm	28 mm	28 mm	35 mm
I/O 线路数量	168	153	153	191	191	132	132	132	168
端子数量	356	208	208	240	240	208	208	208	356
最高工作温度	70 °C	70 °C	85 °C	70 °C	85 °C	85 °C	70 °C	70 °C	70 °C
组织	0 DEDICATED INPUTS, 168 I/O	0 DEDICATED INPUTS, 153 I/O	0 DEDICATED INPUTS, 153 I/O	0 DEDICATED INPUTS, 191 I/O	0 DEDICATED INPUTS, 191 I/O	0 DEDICATED INPUTS, 132 I/O	0 DEDICATED INPUTS, 132 I/O	0 DEDICATED INPUTS, 132 I/O	0 DEDICATED INPUTS, 168 I/O
输出函数	MACROCELL	MACROCELL	MACROCELL	MACROCELL	MACROCELL	MACROCELL	MACROCELL	MACROCELL	MACROCELL
封装主体材料	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
封装代码	HLBGA	HFQFP	HFQFP	HFQFP	HFQFP	HFQFP	HFQFP	HFQFP	HLBGA
封装形状	SQUARE	SQUARE	SQUARE	SQUARE	SQUARE	SQUARE	SQUARE	SQUARE	SQUARE
封装形式	GRID ARRAY, HEAT SINK/SLUG, LOW PROFILE	FLATPACK, HEAT SINK/SLUG, FINE PITCH	FLATPACK, HEAT SINK/SLUG, FINE PITCH	FLATPACK, HEAT SINK/SLUG, FINE PITCH	FLATPACK, HEAT SINK/SLUG, FINE PITCH	FLATPACK, HEAT SINK/SLUG, FINE PITCH	FLATPACK, HEAT SINK/SLUG, FINE PITCH	FLATPACK, HEAT SINK/SLUG, FINE PITCH	GRID ARRAY, HEAT SINK/SLUG, LOW PROFILE
可编程逻辑类型	EE PLD	EE PLD	EE PLD	EE PLD	EE PLD	EE PLD	EE PLD	EE PLD	EE PLD
传播延迟	8.2 ns	16.6 ns	16.6 ns	16.6 ns	16.6 ns	8.2 ns	16 ns	8.2 ns	16 ns
认证状态	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
座面最大高度	1.63 mm	4.07 mm	4.07 mm	4.2 mm	4.2 mm	4.07 mm	4.07 mm	4.07 mm	1.63 mm
最大供电电压	5.25 V	5.25 V	5.5 V	5.25 V	5.5 V	5.5 V	5.25 V	5.25 V	5.25 V
最小供电电压	4.75 V	4.75 V	4.5 V	4.75 V	4.5 V	4.5 V	4.75 V	4.75 V	4.75 V
标称供电电压	5 V	5 V	5 V	5 V	5 V	5 V	5 V	5 V	5 V
表面贴装	YES	YES	YES	YES	YES	YES	YES	YES	YES
技术	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS
温度等级	COMMERCIAL	COMMERCIAL	INDUSTRIAL	COMMERCIAL	INDUSTRIAL	INDUSTRIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL
端子面层	Tin/Lead (Sn/Pb)	MATTE TIN	MATTE TIN	MATTE TIN	MATTE TIN	Tin/Lead (Sn/Pb)	MATTE TIN	Tin/Lead (Sn/Pb)	TIN SILVER COPPER
端子形式	BALL	GULL WING	GULL WING	GULL WING	GULL WING	GULL WING	GULL WING	GULL WING	BALL
端子节距	1.27 mm	0.5 mm	0.5 mm	0.5 mm	0.5 mm	0.5 mm	0.5 mm	0.5 mm	1.27 mm
端子位置	BOTTOM	QUAD	QUAD	QUAD	QUAD	QUAD	QUAD	QUAD	BOTTOM
宽度	35 mm	28 mm	28 mm	32 mm	32 mm	28 mm	28 mm	28 mm	35 mm
是否Rohs认证	不符合	不符合	-	不符合	不符合	不符合	不符合	不符合	不符合
ECCN代码	-	3A991	-	3A991	3A991	-	EAR99	-	EAR99

EPM9320ABC356-7

EPM9320ABC356-7概述

EPM9320ABC356-7规格参数

EPM9320ABC356-7相似产品对比

推荐资源