LV/LV-A/LVX/H SERIES, DUAL POSITIVE EDGE TRIGGERED D FLIP-FLOP, COMPLEMENTARY OUTPUT, PDSO14, TVSOP-14
参数名称 | 属性值 |
厂商名称 | Texas Instruments(德州仪器) |
零件包装代码 | SOIC |
包装说明 | TSSOP, TSSOP14,.25,16 |
针数 | 14 |
Reach Compliance Code | unknown |
系列 | LV/LV-A/LVX/H |
JESD-30 代码 | R-PDSO-G14 |
长度 | 4.4 mm |
逻辑集成电路类型 | D FLIP-FLOP |
位数 | 1 |
功能数量 | 2 |
端子数量 | 14 |
最高工作温度 | 85 °C |
最低工作温度 | -40 °C |
输出极性 | COMPLEMENTARY |
封装主体材料 | PLASTIC/EPOXY |
封装代码 | TSSOP |
封装等效代码 | TSSOP14,.25,16 |
封装形状 | RECTANGULAR |
封装形式 | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
传播延迟(tpd) | 23 ns |
认证状态 | Not Qualified |
座面最大高度 | 1.2 mm |
最大供电电压 (Vsup) | 5.5 V |
最小供电电压 (Vsup) | 2 V |
标称供电电压 (Vsup) | 2.5 V |
表面贴装 | YES |
技术 | CMOS |
温度等级 | INDUSTRIAL |
端子形式 | GULL WING |
端子节距 | 0.4 mm |
端子位置 | DUAL |
触发器类型 | POSITIVE EDGE |
宽度 | 3.6 mm |
最小 fmax | 110 MHz |
SN74LV74ADGV | SN74LV74ANS | SN54LV74AJ | SN54LV74AFK | SN54LV74AW | |
---|---|---|---|---|---|
描述 | LV/LV-A/LVX/H SERIES, DUAL POSITIVE EDGE TRIGGERED D FLIP-FLOP, COMPLEMENTARY OUTPUT, PDSO14, TVSOP-14 | LV/LV-A/LVX/H SERIES, DUAL POSITIVE EDGE TRIGGERED D FLIP-FLOP, COMPLEMENTARY OUTPUT, PDSO14, PLASTIC, SOP-14 | LV/LV-A/LVX/H SERIES, DUAL POSITIVE EDGE TRIGGERED D FLIP-FLOP, COMPLEMENTARY OUTPUT, CDIP14, CERAMIC, DIP-14 | LV/LV-A/LVX/H SERIES, DUAL POSITIVE EDGE TRIGGERED D FLIP-FLOP, COMPLEMENTARY OUTPUT, CQCC20, CERAMIC, LCC-20 | LV/LV-A/LVX/H SERIES, DUAL POSITIVE EDGE TRIGGERED D FLIP-FLOP, COMPLEMENTARY OUTPUT, CDFP14, CERAMIC, DFP-14 |
零件包装代码 | SOIC | SOIC | DIP | QLCC | DFP |
包装说明 | TSSOP, TSSOP14,.25,16 | SOP, SOP14,.3 | DIP, | QCCN, | CERAMIC, DFP-14 |
针数 | 14 | 14 | 14 | 20 | 14 |
Reach Compliance Code | unknown | compliant | unknown | unknown | unknown |
系列 | LV/LV-A/LVX/H | LV/LV-A/LVX/H | LV/LV-A/LVX/H | LV/LV-A/LVX/H | LV/LV-A/LVX/H |
JESD-30 代码 | R-PDSO-G14 | R-PDSO-G14 | R-GDIP-T14 | S-CQCC-N20 | R-GDFP-F14 |
长度 | 4.4 mm | 10.2 mm | 19.56 mm | 8.89 mm | 9.21 mm |
逻辑集成电路类型 | D FLIP-FLOP | D FLIP-FLOP | D FLIP-FLOP | D FLIP-FLOP | D FLIP-FLOP |
位数 | 1 | 1 | 1 | 1 | 1 |
功能数量 | 2 | 2 | 2 | 2 | 2 |
端子数量 | 14 | 14 | 14 | 20 | 14 |
最高工作温度 | 85 °C | 85 °C | 125 °C | 125 °C | 125 °C |
最低工作温度 | -40 °C | -40 °C | -55 °C | -55 °C | -55 °C |
输出极性 | COMPLEMENTARY | COMPLEMENTARY | COMPLEMENTARY | COMPLEMENTARY | COMPLEMENTARY |
封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | CERAMIC, GLASS-SEALED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, GLASS-SEALED |
封装代码 | TSSOP | SOP | DIP | QCCN | DFP |
封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | SQUARE | RECTANGULAR |
封装形式 | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE | IN-LINE | CHIP CARRIER | FLATPACK |
传播延迟(tpd) | 23 ns | 23 ns | 23 ns | 10.5 ns | 10.5 ns |
认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
座面最大高度 | 1.2 mm | 2 mm | 5.08 mm | 2.03 mm | 2.03 mm |
最大供电电压 (Vsup) | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
最小供电电压 (Vsup) | 2 V | 2 V | 2 V | 2 V | 2 V |
标称供电电压 (Vsup) | 2.5 V | 2.5 V | 2.5 V | 3.3 V | 3.3 V |
表面贴装 | YES | YES | NO | YES | YES |
技术 | CMOS | CMOS | CMOS | CMOS | CMOS |
温度等级 | INDUSTRIAL | INDUSTRIAL | MILITARY | MILITARY | MILITARY |
端子形式 | GULL WING | GULL WING | THROUGH-HOLE | NO LEAD | FLAT |
端子节距 | 0.4 mm | 1.27 mm | 2.54 mm | 1.27 mm | 1.27 mm |
端子位置 | DUAL | DUAL | DUAL | QUAD | DUAL |
触发器类型 | POSITIVE EDGE | POSITIVE EDGE | POSITIVE EDGE | POSITIVE EDGE | POSITIVE EDGE |
宽度 | 3.6 mm | 5.3 mm | 7.62 mm | 8.89 mm | 6.29 mm |
最小 fmax | 110 MHz | 110 MHz | 110 MHz | 75 MHz | 75 MHz |
厂商名称 | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | - | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) |
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