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89HPES16NT2ZABCI

产品描述Bus Controller, PBGA484
产品类别嵌入式处理器和控制器    微控制器和处理器   
文件大小568KB,共29页
制造商IDT (Integrated Device Technology)
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89HPES16NT2ZABCI概述

Bus Controller, PBGA484

89HPES16NT2ZABCI规格参数

参数名称属性值
是否Rohs认证不符合
厂商名称IDT (Integrated Device Technology)
包装说明BGA, BGA484,22X22,40
Reach Compliance Codenot_compliant
JESD-30 代码S-PBGA-B484
JESD-609代码e0
湿度敏感等级3
端子数量484
最高工作温度85 °C
最低工作温度-40 °C
封装主体材料PLASTIC/EPOXY
封装代码BGA
封装等效代码BGA484,22X22,40
封装形状SQUARE
封装形式GRID ARRAY
电源1,3.3 V
认证状态Not Qualified
表面贴装YES
温度等级INDUSTRIAL
端子面层Tin/Lead (Sn63Pb37)
端子形式BALL
端子节距1 mm
端子位置BOTTOM

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16-Lane 2-Port Non-Transparent
PCI Express® Switch
®
89HPES16NT2
Data Sheet
Advance Information*
Device Overview
The 89HPES16NT2 is a member of the IDT PRECISE™ family of
PCI Express® switching solutions offering the next-generation I/O inter-
connect standard. The PES16NT2 is a 16-lane, 2-port peripheral chip
that provides high-performance switching and non-transparent bridging
(NTB) functions between a PCIe® upstream port and an NTB down-
stream port. The PES16NT2 is a part of the IDT PCIe System Intercon-
nect Products and is intended to be used with IDT PCIe System
Interconnect Switches. Together, the chipset targets multi-host and intel-
ligent I/O applications such as communications, storage, and blade
servers where inter-domain communication is required.
Features
High Performance PCI Express Switch
Sixteen PCI Express lanes (2.5Gbps), two switch ports
Delivers 64 Gbps (8 GBps) of aggregate switching capacity
Low latency cut-through switch architecture
Support for Max Payload size up to 2048 bytes
Supports one virtual channel and eight traffic classes
PCI Express Base specification Revision 1.0a compliant
Flexible Architecture with Numerous Configuration Options
Supports automatic per port link width negotiation (x8, x4, x2,
or x1)
Static lane reversal on all ports
Automatic polarity inversion on all lanes
Supports locked transactions, allowing use with legacy soft-
ware
Ability to load device configuration from serial EEPROM
Ability to control device via SMBus
Non-Transparent Port
Crosslink support on NTB port
Four mapping windows supported
Each may be configured as a 32-bit memory or I/O window
May be paired to form a 64-bit memory window
Interprocessor communication
Thirty-two inbound and outbound doorbells
Four inbound and outbound message registers
Two shared scratchpad registers
Allows up to sixteen masters to communicate through the non-
transparent port
No limit on the number of supported outstanding transactions
through the non-transparent bridge
Completely symmetric non-transparent bridge operation
allows similar/same configuration software to be run
Supports direct connection to a transparent or non-transparent
port of another switch
Highly Integrated Solution
Requires no external components
Incorporates on-chip internal memory for packet buffering and
queueing
Integrates sixteen 2.5 Gbps embedded full duplex SerDes, 8B/
10B encoder/decoder (no separate transceivers needed)
Block Diagram
2-Port Switch Core
Frame Buffer
Route Table
Port
Arbitration
Scheduler
Transaction Layer
Data Link Layer
Transaction Layer
Data Link Layer
Non-
Transparent
Bridge
Multiplexer / Demultiplexer
Phy
Logical
Layer
Phy
Logical
Layer
Phy
Logical
Layer
Multiplexer / Demultiplexer
Phy
Logical
Layer
Phy
Logical
Layer
Phy
Logical
Layer
...
...
SerDes
SerDes
SerDes
SerDes
SerDes
SerDes
16 PCI Express Lanes
x8 Upstream Port and One x8 Downstream Port
Figure 1 Internal Block Diagram
IDT and the IDT logo are trademarks of Integrated Device Technology, Inc.
1 of 29
©
2007 Integrated Device Technology, Inc.
*Notice: The information in this document is subject to change without notice
March 26, 2007
DSC 6925
Advance Information

89HPES16NT2ZABCI相似产品对比

89HPES16NT2ZABCI 89HPES16NT2ZABCGI
描述 Bus Controller, PBGA484 Bus Controller, PBGA484
是否Rohs认证 不符合 符合
厂商名称 IDT (Integrated Device Technology) IDT (Integrated Device Technology)
Reach Compliance Code not_compliant compliant
JESD-30 代码 S-PBGA-B484 S-PBGA-B484
JESD-609代码 e0 e1
湿度敏感等级 3 3
端子数量 484 484
最高工作温度 85 °C 85 °C
最低工作温度 -40 °C -40 °C
封装主体材料 PLASTIC/EPOXY PLASTIC/EPOXY
封装代码 BGA BGA
封装等效代码 BGA484,22X22,40 BGA484,22X22,40
封装形状 SQUARE SQUARE
封装形式 GRID ARRAY GRID ARRAY
电源 1,3.3 V 1,3.3 V
认证状态 Not Qualified Not Qualified
表面贴装 YES YES
温度等级 INDUSTRIAL INDUSTRIAL
端子面层 Tin/Lead (Sn63Pb37) Tin/Silver/Copper (Sn/Ag/Cu)
端子形式 BALL BALL
端子节距 1 mm 1 mm
端子位置 BOTTOM BOTTOM

 
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