Standard SRAM, 64KX16, 55ns, CMOS, 8 X 8 MM, LEAD FREE, QFN-56
参数名称 | 属性值 |
是否无铅 | 不含铅 |
是否Rohs认证 | 符合 |
厂商名称 | Cypress(赛普拉斯) |
零件包装代码 | QFN |
包装说明 | HVQCCN, |
针数 | 56 |
Reach Compliance Code | compliant |
ECCN代码 | EAR99 |
最长访问时间 | 55 ns |
JESD-30 代码 | S-XQCC-N56 |
JESD-609代码 | e3 |
长度 | 8 mm |
内存密度 | 1048576 bit |
内存集成电路类型 | STANDARD SRAM |
内存宽度 | 16 |
湿度敏感等级 | 3 |
功能数量 | 1 |
端子数量 | 56 |
字数 | 65536 words |
字数代码 | 64000 |
工作模式 | ASYNCHRONOUS |
最高工作温度 | 85 °C |
最低工作温度 | -40 °C |
组织 | 64KX16 |
封装主体材料 | UNSPECIFIED |
封装代码 | HVQCCN |
封装形状 | SQUARE |
封装形式 | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
并行/串行 | PARALLEL |
峰值回流温度(摄氏度) | 260 |
认证状态 | Not Qualified |
座面最大高度 | 1 mm |
最大供电电压 (Vsup) | 3.6 V |
最小供电电压 (Vsup) | 2.2 V |
标称供电电压 (Vsup) | 3 V |
表面贴装 | YES |
技术 | CMOS |
温度等级 | INDUSTRIAL |
端子面层 | Matte Tin (Sn) |
端子形式 | NO LEAD |
端子节距 | 0.5 mm |
端子位置 | QUAD |
处于峰值回流温度下的最长时间 | 20 |
宽度 | 8 mm |
CY62126DV30LL-55LFXI | CY62126DV30LL-70LFXI | CY62126DV30L-55ZSE | CY62126DV30LL-45ZXI | CY62126DV30L-70BVIT | CY62126DV30LL-70ZIT | CY62126DV30LL-70ZXIT | CY62126DV30LL-45LFXI | CY62126DV30L-55BVXI | |
---|---|---|---|---|---|---|---|---|---|
描述 | Standard SRAM, 64KX16, 55ns, CMOS, 8 X 8 MM, LEAD FREE, QFN-56 | Standard SRAM, 64KX16, 70ns, CMOS, 8 X 8 MM, LEAD FREE, QFN-56 | Standard SRAM, 64KX16, 55ns, CMOS, PDSO44, TSOP2-44 | Standard SRAM, 64KX16, 45ns, CMOS, PDSO44, LEAD FREE, TSOP2-44 | Standard SRAM, 64KX16, 70ns, CMOS, PBGA48, 6 X 8 MM, 1 MM HEIGHT, VFBGA-48 | Standard SRAM, 64KX16, 70ns, CMOS, PDSO44, TSOP2-44 | Standard SRAM, 64KX16, 70ns, CMOS, PDSO44, LEAD FREE, TSOP2-44 | Standard SRAM, 64KX16, 45ns, CMOS, 8 X 8 MM, LEAD FREE, QFN-56 | Standard SRAM, 64KX16, 55ns, CMOS, PBGA48, 6 X 8 MM, 1 MM HEIGHT, VFBGA-48 |
零件包装代码 | QFN | QFN | TSOP2 | TSOP2 | BGA | TSOP2 | TSOP2 | QFN | BGA |
包装说明 | HVQCCN, | HVQCCN, | TSOP2, | TSOP2, | VFBGA, | TSOP2, | TSOP2, | HVQCCN, | VFBGA, |
针数 | 56 | 56 | 44 | 44 | 48 | 44 | 44 | 56 | 48 |
Reach Compliance Code | compliant | compliant | compliant | compliant | unknown | unknown | unknown | compliant | compliant |
ECCN代码 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 |
最长访问时间 | 55 ns | 70 ns | 55 ns | 45 ns | 70 ns | 70 ns | 70 ns | 45 ns | 55 ns |
JESD-30 代码 | S-XQCC-N56 | S-XQCC-N56 | R-PDSO-G44 | R-PDSO-G44 | R-PBGA-B48 | R-PDSO-G44 | R-PDSO-G44 | S-XQCC-N56 | R-PBGA-B48 |
JESD-609代码 | e3 | e3 | e0 | e3 | e0 | e0 | e3/e4 | e3 | e1 |
长度 | 8 mm | 8 mm | 18.415 mm | 18.415 mm | 8 mm | 18.415 mm | 18.415 mm | 8 mm | 8 mm |
内存密度 | 1048576 bit | 1048576 bit | 1048576 bit | 1048576 bit | 1048576 bit | 1048576 bit | 1048576 bit | 1048576 bit | 1048576 bit |
内存集成电路类型 | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM |
内存宽度 | 16 | 16 | 16 | 16 | 16 | 16 | 16 | 16 | 16 |
功能数量 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
端子数量 | 56 | 56 | 44 | 44 | 48 | 44 | 44 | 56 | 48 |
字数 | 65536 words | 65536 words | 65536 words | 65536 words | 65536 words | 65536 words | 65536 words | 65536 words | 65536 words |
字数代码 | 64000 | 64000 | 64000 | 64000 | 64000 | 64000 | 64000 | 64000 | 64000 |
工作模式 | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS |
最高工作温度 | 85 °C | 85 °C | 125 °C | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C |
最低工作温度 | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C |
组织 | 64KX16 | 64KX16 | 64KX16 | 64KX16 | 64KX16 | 64KX16 | 64KX16 | 64KX16 | 64KX16 |
封装主体材料 | UNSPECIFIED | UNSPECIFIED | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | UNSPECIFIED | PLASTIC/EPOXY |
封装代码 | HVQCCN | HVQCCN | TSOP2 | TSOP2 | VFBGA | TSOP2 | TSOP2 | HVQCCN | VFBGA |
封装形状 | SQUARE | SQUARE | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | SQUARE | RECTANGULAR |
封装形式 | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | SMALL OUTLINE, THIN PROFILE | SMALL OUTLINE, THIN PROFILE | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | SMALL OUTLINE, THIN PROFILE | SMALL OUTLINE, THIN PROFILE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
并行/串行 | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL |
认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
座面最大高度 | 1 mm | 1 mm | 1.194 mm | 1.194 mm | 1 mm | 1.194 mm | 1.194 mm | 1 mm | 1 mm |
最大供电电压 (Vsup) | 3.6 V | 3.6 V | 3.6 V | 3.6 V | 3.6 V | 3.6 V | 3.6 V | 3.6 V | 3.6 V |
最小供电电压 (Vsup) | 2.2 V | 2.2 V | 2.2 V | 2.2 V | 2.2 V | 2.2 V | 2.2 V | 2.2 V | 2.2 V |
标称供电电压 (Vsup) | 3 V | 3 V | 3 V | 3 V | 3 V | 3 V | 3 V | 3 V | 3 V |
表面贴装 | YES | YES | YES | YES | YES | YES | YES | YES | YES |
技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
温度等级 | INDUSTRIAL | INDUSTRIAL | AUTOMOTIVE | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL |
端子面层 | Matte Tin (Sn) | Matte Tin (Sn) | TIN LEAD | MATTE TIN | TIN LEAD | TIN LEAD | MATTE TIN/NICKEL PALLADIUM GOLD | Matte Tin (Sn) | TIN SILVER COPPER |
端子形式 | NO LEAD | NO LEAD | GULL WING | GULL WING | BALL | GULL WING | GULL WING | NO LEAD | BALL |
端子节距 | 0.5 mm | 0.5 mm | 0.8 mm | 0.8 mm | 0.75 mm | 0.8 mm | 0.8 mm | 0.5 mm | 0.75 mm |
端子位置 | QUAD | QUAD | DUAL | DUAL | BOTTOM | DUAL | DUAL | QUAD | BOTTOM |
宽度 | 8 mm | 8 mm | 10.16 mm | 10.16 mm | 6 mm | 10.16 mm | 10.16 mm | 8 mm | 6 mm |
是否无铅 | 不含铅 | 不含铅 | 含铅 | 不含铅 | - | - | - | 不含铅 | 不含铅 |
是否Rohs认证 | 符合 | 符合 | 不符合 | 符合 | - | - | - | 符合 | 符合 |
厂商名称 | Cypress(赛普拉斯) | - | - | Cypress(赛普拉斯) | - | Cypress(赛普拉斯) | Cypress(赛普拉斯) | Cypress(赛普拉斯) | Cypress(赛普拉斯) |
湿度敏感等级 | 3 | 3 | 3 | 3 | - | - | - | 3 | 3 |
峰值回流温度(摄氏度) | 260 | 260 | 240 | 260 | - | - | - | 260 | 260 |
处于峰值回流温度下的最长时间 | 20 | 20 | 30 | 20 | - | - | - | 20 | 20 |
电子工程世界版权所有 京B2-20211791 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号 Copyright © 2005-2024 EEWORLD.com.cn, Inc. All rights reserved