CAPACITOR, CERAMIC, 50 V, BX, 0.47 uF, SURFACE MOUNT, 2225
电容, 陶瓷, 50 V, BX, 0.47 uF, 表面贴装, 2225
参数名称 | 属性值 |
最大工作温度 | 125 Cel |
最小工作温度 | -55 Cel |
负偏差 | 10 % |
正偏差 | 10 % |
额定直流电压urdc | 50 V |
加工封装描述 | CHIP |
状态 | ACTIVE |
端子涂层 | TIN LEAD |
安装特点 | SURFACE MOUNT |
制造商系列 | CDR06 |
尺寸编码 | 2225 |
电容 | 0.4700 uF |
包装形状 | RECTANGULAR PACKAGE |
电容类型 | CERAMIC |
端子形状 | WRAPAROUND |
温度系数 | 15% |
温度特性代码 | BX |
多层 | Yes |
CDR02 | CDR01 | CDR03 | CDR04 | CDR05 | CDR06 | CDR06BX474AKUR | |
---|---|---|---|---|---|---|---|
描述 | CAPACITOR, CERAMIC, 50 V, BX, 0.47 uF, SURFACE MOUNT, 2225 | CAPACITOR, CERAMIC, 50 V, BX, 0.47 uF, SURFACE MOUNT, 2225 | CAPACITOR, CERAMIC, 50 V, BX, 0.47 uF, SURFACE MOUNT, 2225 | CAPACITOR, CERAMIC, 50 V, BX, 0.47 uF, SURFACE MOUNT, 2225 | CAPACITOR, CERAMIC, 50 V, BX, 0.47 uF, SURFACE MOUNT, 2225 | CAPACITOR, CERAMIC, 50 V, BX, 0.47 uF, SURFACE MOUNT, 2225 | CAPACITOR, CERAMIC, 50 V, BX, 0.47 uF, SURFACE MOUNT, 2225 |
最大工作温度 | 125 Cel | 125 Cel | 125 Cel | 125 Cel | 125 Cel | 125 Cel | 125 Cel |
最小工作温度 | -55 Cel | -55 Cel | -55 Cel | -55 Cel | -55 Cel | -55 Cel | -55 Cel |
负偏差 | 10 % | 10 % | 10 % | 10 % | 10 % | 10 % | 10 % |
正偏差 | 10 % | 10 % | 10 % | 10 % | 10 % | 10 % | 10 % |
额定直流电压urdc | 50 V | 50 V | 50 V | 50 V | 50 V | 50 V | 50 V |
加工封装描述 | CHIP | CHIP | CHIP | CHIP | CHIP | CHIP | CHIP |
状态 | ACTIVE | ACTIVE | ACTIVE | ACTIVE | ACTIVE | ACTIVE | ACTIVE |
端子涂层 | TIN LEAD | TIN LEAD | TIN LEAD | TIN LEAD | TIN LEAD | TIN LEAD | TIN LEAD |
安装特点 | SURFACE MOUNT | SURFACE MOUNT | SURFACE MOUNT | SURFACE MOUNT | SURFACE MOUNT | SURFACE MOUNT | SURFACE MOUNT |
制造商系列 | CDR06 | CDR06 | CDR06 | CDR06 | CDR06 | CDR06 | CDR06 |
尺寸编码 | 2225 | 2225 | 2225 | 2225 | 2225 | 2225 | 2225 |
电容 | 0.4700 uF | 0.4700 uF | 0.4700 uF | 0.4700 uF | 0.4700 uF | 0.4700 uF | 0.4700 uF |
包装形状 | RECTANGULAR PACKAGE | RECTANGULAR PACKAGE | RECTANGULAR PACKAGE | RECTANGULAR PACKAGE | RECTANGULAR PACKAGE | RECTANGULAR PACKAGE | RECTANGULAR PACKAGE |
电容类型 | CERAMIC | CERAMIC | CERAMIC | CERAMIC | CERAMIC | CERAMIC | CERAMIC |
端子形状 | WRAPAROUND | WRAPAROUND | WRAPAROUND | WRAPAROUND | WRAPAROUND | WRAPAROUND | WRAPAROUND |
温度系数 | 15% | 15% | 15% | 15% | 15% | 15% | 15% |
温度特性代码 | BX | BX | BX | BX | BX | BX | BX |
多层 | Yes | Yes | Yes | Yes | Yes | Yes | Yes |
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