TQFP-64, Tray
| 参数名称 | 属性值 |
| Brand Name | Integrated Device Technology |
| 是否无铅 | 含铅 |
| 是否Rohs认证 | 不符合 |
| 厂商名称 | IDT (Integrated Device Technology) |
| 零件包装代码 | TQFP |
| 包装说明 | STQFP-64 |
| 针数 | 64 |
| 制造商包装代码 | PP64 |
| Reach Compliance Code | not_compliant |
| ECCN代码 | EAR99 |
| 最长访问时间 | 12 ns |
| 其他特性 | RETRANSMIT; AUTO POWER DOWN MODE; IT CAN ALSO BE CONFIGURED AS 128K X 9 |
| 备用内存宽度 | 9 |
| 最大时钟频率 (fCLK) | 50 MHz |
| 周期时间 | 20 ns |
| JESD-30 代码 | S-PQFP-G64 |
| JESD-609代码 | e0 |
| 长度 | 10 mm |
| 内存密度 | 1179648 bit |
| 内存集成电路类型 | OTHER FIFO |
| 内存宽度 | 18 |
| 湿度敏感等级 | 3 |
| 功能数量 | 1 |
| 端子数量 | 64 |
| 字数 | 65536 words |
| 字数代码 | 64000 |
| 工作模式 | SYNCHRONOUS |
| 最高工作温度 | 70 °C |
| 最低工作温度 | |
| 组织 | 64KX18 |
| 可输出 | YES |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | LFQFP |
| 封装等效代码 | QFP64,.47SQ,20 |
| 封装形状 | SQUARE |
| 封装形式 | FLATPACK, LOW PROFILE, FINE PITCH |
| 并行/串行 | PARALLEL |
| 峰值回流温度（摄氏度） | 240 |
| 电源 | 5 V |
| 认证状态 | Not Qualified |
| 座面最大高度 | 1.6 mm |
| 最大压摆率 | 0.09 mA |
| 最大供电电压 (Vsup) | 5.5 V |
| 最小供电电压 (Vsup) | 4.5 V |
| 标称供电电压 (Vsup) | 5 V |
| 表面贴装 | YES |
| 技术 | CMOS |
| 温度等级 | COMMERCIAL |
| 端子面层 | Tin/Lead (Sn85Pb15) |
| 端子形式 | GULL WING |
| 端子节距 | 0.5 mm |
| 端子位置 | QUAD |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED |
| 宽度 | 10 mm |
| 72294L20TF | 72284L15PF | 72284L15TF | 72294L15TF | 72294L20PF | 72294L15PF | 72294L10TF | 72294L10PF | 72284L10PF | |
|---|---|---|---|---|---|---|---|---|---|
| 描述 | TQFP-64, Tray | TQFP-64, Tray | TQFP-64, Tray | TQFP-64, Tray | TQFP-64, Tray | TQFP-64, Tray | TQFP-64, Tray | TQFP-64, Tray | TQFP-64, Tray |
| Brand Name | Integrated Device Technology | Integrated Device Technology | Integrated Device Technology | Integrated Device Technology | Integrated Device Technology | Integrated Device Technology | Integrated Device Technology | Integrated Device Technology | Integrated Device Technology |
| 是否无铅 | 含铅 | 含铅 | 含铅 | 含铅 | 含铅 | 含铅 | 含铅 | 含铅 | 含铅 |
| 是否Rohs认证 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 |
| 零件包装代码 | TQFP | TQFP | TQFP | TQFP | TQFP | TQFP | TQFP | TQFP | TQFP |
| 包装说明 | STQFP-64 | TQFP-64 | STQFP-64 | STQFP-64 | TQFP-64 | TQFP-64 | STQFP-64 | TQFP-64 | TQFP-64 |
| 针数 | 64 | 64 | 64 | 64 | 64 | 64 | 64 | 64 | 64 |
| 制造商包装代码 | PP64 | PN64 | PP64 | PP64 | PN64 | PN64 | PP64 | PN64 | PN64 |
| Reach Compliance Code | not_compliant | not_compliant | not_compliant | not_compliant | not_compliant | not_compliant | not_compliant | not_compliant | _compli |
| ECCN代码 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 |
| 最长访问时间 | 12 ns | 10 ns | 10 ns | 10 ns | 12 ns | 10 ns | 6.5 ns | 6.5 ns | 6.5 ns |
| 其他特性 | RETRANSMIT; AUTO POWER DOWN MODE; IT CAN ALSO BE CONFIGURED AS 128K X 9 | RETRANSMIT; AUTO POWER DOWN MODE; IT CAN ALSO BE CONFIGURED AS 64K X 9 | RETRANSMIT; AUTO POWER DOWN MODE; IT CAN ALSO BE CONFIGURED AS 64K X 9 | RETRANSMIT; AUTO POWER DOWN MODE; IT CAN ALSO BE CONFIGURED AS 128K X 9 | RETRANSMIT; AUTO POWER DOWN MODE; IT CAN ALSO BE CONFIGURED AS 128K X 9 | RETRANSMIT; AUTO POWER DOWN MODE; IT CAN ALSO BE CONFIGURED AS 128K X 9 | RETRANSMIT; AUTO POWER DOWN MODE; IT CAN ALSO BE CONFIGURED AS 128K X 9 | RETRANSMIT; AUTO POWER DOWN MODE; IT CAN ALSO BE CONFIGURED AS 128K X 9 | RETRANSMIT; AUTO POWER DOWN MODE; IT CAN ALSO BE CONFIGURED AS 64K X 9 |
| 备用内存宽度 | 9 | 9 | 9 | 9 | 9 | 9 | 9 | 9 | 9 |
| 最大时钟频率 (fCLK) | 50 MHz | 66 MHz | 66 MHz | 66 MHz | 50 MHz | 66 MHz | 100 MHz | 100 MHz | 100 MHz |
| 周期时间 | 20 ns | 15 ns | 15 ns | 15 ns | 20 ns | 15 ns | 10 ns | 10 ns | 10 ns |
| JESD-30 代码 | S-PQFP-G64 | S-PQFP-G64 | S-PQFP-G64 | S-PQFP-G64 | S-PQFP-G64 | S-PQFP-G64 | S-PQFP-G64 | S-PQFP-G64 | S-PQFP-G64 |
| JESD-609代码 | e0 | e0 | e0 | e0 | e0 | e0 | e0 | e0 | e0 |
| 长度 | 10 mm | 14 mm | 10 mm | 10 mm | 14 mm | 14 mm | 10 mm | 14 mm | 14 mm |
| 内存密度 | 1179648 bit | 589824 bit | 589824 bit | 1179648 bit | 1179648 bit | 1179648 bit | 1179648 bit | 1179648 bit | 589824 bi |
| 内存集成电路类型 | OTHER FIFO | OTHER FIFO | OTHER FIFO | OTHER FIFO | OTHER FIFO | OTHER FIFO | OTHER FIFO | OTHER FIFO | OTHER FIFO |
| 内存宽度 | 18 | 18 | 18 | 18 | 18 | 18 | 18 | 18 | 18 |
| 湿度敏感等级 | 3 | 3 | 3 | 3 | 3 | 3 | 3 | 3 | 3 |
| 功能数量 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
| 端子数量 | 64 | 64 | 64 | 64 | 64 | 64 | 64 | 64 | 64 |
| 字数 | 65536 words | 32768 words | 32768 words | 65536 words | 65536 words | 65536 words | 65536 words | 65536 words | 32768 words |
| 字数代码 | 64000 | 32000 | 32000 | 64000 | 64000 | 64000 | 64000 | 64000 | 32000 |
| 工作模式 | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS |
| 最高工作温度 | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C |
| 组织 | 64KX18 | 32KX18 | 32KX18 | 64KX18 | 64KX18 | 64KX18 | 64KX18 | 64KX18 | 32KX18 |
| 可输出 | YES | YES | YES | YES | YES | YES | YES | YES | YES |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | LFQFP | LQFP | LFQFP | LFQFP | LQFP | LQFP | LFQFP | LQFP | LQFP |
| 封装等效代码 | QFP64,.47SQ,20 | QFP64,.66SQ,32 | QFP64,.47SQ,20 | QFP64,.47SQ,20 | QFP64,.66SQ,32 | QFP64,.66SQ,32 | QFP64,.47SQ,20 | QFP64,.66SQ,32 | QFP64,.66SQ,32 |
| 封装形状 | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE |
| 封装形式 | FLATPACK, LOW PROFILE, FINE PITCH | FLATPACK, LOW PROFILE | FLATPACK, LOW PROFILE, FINE PITCH | FLATPACK, LOW PROFILE, FINE PITCH | FLATPACK, LOW PROFILE | FLATPACK, LOW PROFILE | FLATPACK, LOW PROFILE, FINE PITCH | FLATPACK, LOW PROFILE | FLATPACK, LOW PROFILE |
| 并行/串行 | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL |
| 峰值回流温度（摄氏度） | 240 | 240 | 240 | 240 | 240 | 240 | 240 | 240 | 240 |
| 电源 | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 座面最大高度 | 1.6 mm | 1.6 mm | 1.6 mm | 1.6 mm | 1.6 mm | 1.6 mm | 1.6 mm | 1.6 mm | 1.6 mm |
| 最大压摆率 | 0.09 mA | 0.09 mA | 0.09 mA | 0.09 mA | 0.09 mA | 0.09 mA | 0.09 mA | 0.09 mA | 0.09 mA |
| 最大供电电压 (Vsup) | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
| 最小供电电压 (Vsup) | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V |
| 标称供电电压 (Vsup) | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| 表面贴装 | YES | YES | YES | YES | YES | YES | YES | YES | YES |
| 技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL |
| 端子面层 | Tin/Lead (Sn85Pb15) | Tin/Lead (Sn85Pb15) | Tin/Lead (Sn85Pb15) | Tin/Lead (Sn85Pb15) | Tin/Lead (Sn85Pb15) | Tin/Lead (Sn85Pb15) | Tin/Lead (Sn85Pb15) | Tin/Lead (Sn85Pb15) | Tin/Lead (Sn85Pb15) |
| 端子形式 | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING |
| 端子节距 | 0.5 mm | 0.8 mm | 0.5 mm | 0.5 mm | 0.8 mm | 0.8 mm | 0.5 mm | 0.8 mm | 0.8 mm |
| 端子位置 | QUAD | QUAD | QUAD | QUAD | QUAD | QUAD | QUAD | QUAD | QUAD |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED | 20 | NOT SPECIFIED | NOT SPECIFIED | 20 | 20 | NOT SPECIFIED | 20 | 20 |
| 宽度 | 10 mm | 14 mm | 10 mm | 10 mm | 14 mm | 14 mm | 10 mm | 14 mm | 14 mm |
| 厂商名称 | IDT (Integrated Device Technology) | - | - | IDT (Integrated Device Technology) | IDT (Integrated Device Technology) | IDT (Integrated Device Technology) | IDT (Integrated Device Technology) | IDT (Integrated Device Technology) | IDT (Integrated Device Technology) |
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