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MT4067EJ-8

产品描述Page Mode DRAM, 64KX4, 80ns, MOS, PQCC18
产品类别存储    存储   
文件大小514KB,共10页
制造商Micron Technology
官网地址http://www.mdtic.com.tw/
下载文档 详细参数 选型对比 全文预览

MT4067EJ-8概述

Page Mode DRAM, 64KX4, 80ns, MOS, PQCC18

MT4067EJ-8规格参数

参数名称属性值
是否Rohs认证不符合
厂商名称Micron Technology
Reach Compliance Codenot_compliant
最长访问时间80 ns
I/O 类型COMMON
JESD-30 代码R-PQCC-J18
JESD-609代码e0
内存密度262144 bit
内存集成电路类型PAGE MODE DRAM
内存宽度4
端子数量18
字数65536 words
字数代码64000
最高工作温度70 °C
最低工作温度
组织64KX4
输出特性3-STATE
封装主体材料PLASTIC/EPOXY
封装代码QCCJ
封装等效代码LDCC18,.33X.53
封装形状RECTANGULAR
封装形式CHIP CARRIER
电源5 V
认证状态Not Qualified
刷新周期256
标称供电电压 (Vsup)5 V
表面贴装YES
技术MOS
温度等级COMMERCIAL
端子面层Tin/Lead (Sn/Pb)
端子形式J BEND
端子节距1.27 mm
端子位置QUAD

MT4067EJ-8相似产品对比

MT4067EJ-8 MT4067EC-15XT MT4067EC-12XT MT4067EC-12/883C MT4067EC-10XT MT4067EC-15/883C MT4067EC-10/883C MT4067C-20/883C MT4067C-20
描述 Page Mode DRAM, 64KX4, 80ns, MOS, PQCC18 Page Mode DRAM, 64KX4, 150ns, CMOS, CQCC18, CERAMIC, LCC-18 Page Mode DRAM, 64KX4, 120ns, CMOS, CQCC18, CERAMIC, LCC-18 Page Mode DRAM, 64KX4, 120ns, CMOS, CQCC18, CERAMIC, LCC-18 Page Mode DRAM, 64KX4, 100ns, CMOS, CQCC18, CERAMIC, LCC-18 Page Mode DRAM, 64KX4, 150ns, CMOS, CQCC18, CERAMIC, LCC-18 Page Mode DRAM, 64KX4, 100ns, CMOS, CQCC18, CERAMIC, LCC-18 Page Mode DRAM, 64KX4, 200ns, CMOS, CDIP18, 0.300 INCH, CERAMIC, DIP-18 Page Mode DRAM, 64KX4, 200ns, CMOS, CDIP18, 0.300 INCH, CERAMIC, DIP-18
是否Rohs认证 不符合 不符合 不符合 不符合 不符合 不符合 不符合 不符合 不符合
Reach Compliance Code not_compliant not_compliant not_compliant not_compliant not_compliant not_compliant not_compliant _compli not_compliant
最长访问时间 80 ns 150 ns 120 ns 120 ns 100 ns 150 ns 100 ns 200 ns 200 ns
I/O 类型 COMMON COMMON COMMON COMMON COMMON COMMON COMMON COMMON COMMON
JESD-30 代码 R-PQCC-J18 X-CQCC-N18 X-CQCC-N18 X-CQCC-N18 X-CQCC-N18 X-CQCC-N18 X-CQCC-N18 R-CDIP-T18 R-CDIP-T18
JESD-609代码 e0 e0 e0 e0 e0 e0 e0 e0 e0
内存密度 262144 bit 262144 bit 262144 bit 262144 bit 262144 bit 262144 bit 262144 bit 262144 bi 262144 bit
内存集成电路类型 PAGE MODE DRAM PAGE MODE DRAM PAGE MODE DRAM PAGE MODE DRAM PAGE MODE DRAM PAGE MODE DRAM PAGE MODE DRAM PAGE MODE DRAM PAGE MODE DRAM
内存宽度 4 4 4 4 4 4 4 4 4
端子数量 18 18 18 18 18 18 18 18 18
字数 65536 words 65536 words 65536 words 65536 words 65536 words 65536 words 65536 words 65536 words 65536 words
字数代码 64000 64000 64000 64000 64000 64000 64000 64000 64000
最高工作温度 70 °C 125 °C 125 °C 110 °C 125 °C 110 °C 110 °C 110 °C 70 °C
最低工作温度 - -55 °C -55 °C -55 °C -55 °C -55 °C -55 °C -55 °C -
组织 64KX4 64KX4 64KX4 64KX4 64KX4 64KX4 64KX4 64KX4 64KX4
输出特性 3-STATE 3-STATE 3-STATE 3-STATE 3-STATE 3-STATE 3-STATE 3-STATE 3-STATE
封装主体材料 PLASTIC/EPOXY CERAMIC, METAL-SEALED COFIRED CERAMIC, METAL-SEALED COFIRED CERAMIC, METAL-SEALED COFIRED CERAMIC, METAL-SEALED COFIRED CERAMIC, METAL-SEALED COFIRED CERAMIC, METAL-SEALED COFIRED CERAMIC, METAL-SEALED COFIRED CERAMIC, METAL-SEALED COFIRED
封装代码 QCCJ QCCN QCCN QCCN QCCN QCCN QCCN DIP DIP
封装等效代码 LDCC18,.33X.53 LCC18,.3X.5 LCC18,.3X.5 LCC18,.3X.5 LCC18,.3X.5 LCC18,.3X.5 LCC18,.3X.5 DIP18,.3 DIP18,.3
封装形状 RECTANGULAR UNSPECIFIED UNSPECIFIED UNSPECIFIED UNSPECIFIED UNSPECIFIED UNSPECIFIED RECTANGULAR RECTANGULAR
封装形式 CHIP CARRIER CHIP CARRIER CHIP CARRIER CHIP CARRIER CHIP CARRIER CHIP CARRIER CHIP CARRIER IN-LINE IN-LINE
电源 5 V 5 V 5 V 5 V 5 V 5 V 5 V 5 V 5 V
认证状态 Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified
刷新周期 256 256 256 256 256 256 256 256 256
标称供电电压 (Vsup) 5 V 5 V 5 V 5 V 5 V 5 V 5 V 5 V 5 V
表面贴装 YES YES YES YES YES YES YES NO NO
技术 MOS CMOS CMOS CMOS CMOS CMOS CMOS CMOS CMOS
温度等级 COMMERCIAL MILITARY MILITARY OTHER MILITARY OTHER OTHER OTHER COMMERCIAL
端子面层 Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb)
端子形式 J BEND NO LEAD NO LEAD NO LEAD NO LEAD NO LEAD NO LEAD THROUGH-HOLE THROUGH-HOLE
端子节距 1.27 mm 1.27 mm 1.27 mm 1.27 mm 1.27 mm 1.27 mm 1.27 mm 2.54 mm 2.54 mm
端子位置 QUAD QUAD QUAD QUAD QUAD QUAD QUAD DUAL DUAL
厂商名称 Micron Technology Micron Technology Micron Technology Micron Technology Micron Technology Micron Technology Micron Technology Micron Technology -
包装说明 - CERAMIC, LCC-18 CERAMIC, LCC-18 CERAMIC, LCC-18 CERAMIC, LCC-18 CERAMIC, LCC-18 CERAMIC, LCC-18 0.300 INCH, CERAMIC, DIP-18 0.300 INCH, CERAMIC, DIP-18
ECCN代码 - EAR99 EAR99 EAR99 EAR99 EAR99 EAR99 EAR99 EAR99
访问模式 - PAGE PAGE PAGE PAGE PAGE PAGE PAGE PAGE
其他特性 - RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH
功能数量 - 1 1 1 1 1 1 1 1
端口数量 - 1 1 1 1 1 1 1 1
工作模式 - ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS
筛选级别 - MIL-STD-883 Class B MIL-STD-883 Class B MIL-STD-883 Class B MIL-STD-883 Class B MIL-STD-883 Class B MIL-STD-883 Class B MIL-STD-883 Class B MIL-STD-883 Class B
最大供电电压 (Vsup) - 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V
最小供电电压 (Vsup) - 4.5 V 4.5 V 4.5 V 4.5 V 4.5 V 4.5 V 4.5 V 4.5 V

 
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