Page Mode DRAM, 64KX4, 150ns, MOS, PQCC18
| 参数名称 | 属性值 |
| 是否Rohs认证 | 不符合 |
| 厂商名称 | Micron Technology |
| Reach Compliance Code | not_compliant |
| 最长访问时间 | 150 ns |
| I/O 类型 | COMMON |
| JESD-30 代码 | R-PQCC-J18 |
| JESD-609代码 | e0 |
| 内存密度 | 262144 bit |
| 内存集成电路类型 | PAGE MODE DRAM |
| 内存宽度 | 4 |
| 端子数量 | 18 |
| 字数 | 65536 words |
| 字数代码 | 64000 |
| 最高工作温度 | 70 °C |
| 最低工作温度 | |
| 组织 | 64KX4 |
| 输出特性 | 3-STATE |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | QCCJ |
| 封装等效代码 | LDCC18,.33X.53 |
| 封装形状 | RECTANGULAR |
| 封装形式 | CHIP CARRIER |
| 电源 | 5 V |
| 认证状态 | Not Qualified |
| 刷新周期 | 256 |
| 最大压摆率 | 0.045 mA |
| 标称供电电压 (Vsup) | 5 V |
| 表面贴装 | YES |
| 技术 | MOS |
| 温度等级 | COMMERCIAL |
| 端子面层 | Tin/Lead (Sn/Pb) |
| 端子形式 | J BEND |
| 端子节距 | 1.27 mm |
| 端子位置 | QUAD |
| MT4067EJ-15 | MT4067C-12 | MT4067C-10 | MT4067C-15 | MT4067EJ-10 | MT4067EJ-12 | |
|---|---|---|---|---|---|---|
| 描述 | Page Mode DRAM, 64KX4, 150ns, MOS, PQCC18 | Page Mode DRAM, 64KX4, 120ns, CMOS, CDIP18, 0.300 INCH, CERAMIC, DIP-18 | Page Mode DRAM, 64KX4, 100ns, CMOS, CDIP18, 0.300 INCH, CERAMIC, DIP-18 | Page Mode DRAM, 64KX4, 150ns, CMOS, CDIP18, 0.300 INCH, CERAMIC, DIP-18 | Page Mode DRAM, 64KX4, 100ns, MOS, PQCC18 | Page Mode DRAM, 64KX4, 120ns, MOS, PQCC18 |
| 是否Rohs认证 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 |
| 厂商名称 | Micron Technology | Micron Technology | Micron Technology | Micron Technology | Micron Technology | Micron Technology |
| Reach Compliance Code | not_compliant | not_compliant | not_compliant | not_compliant | not_compliant | not_compliant |
| 最长访问时间 | 150 ns | 120 ns | 100 ns | 150 ns | 100 ns | 120 ns |
| I/O 类型 | COMMON | COMMON | COMMON | COMMON | COMMON | COMMON |
| JESD-30 代码 | R-PQCC-J18 | R-CDIP-T18 | R-CDIP-T18 | R-CDIP-T18 | R-PQCC-J18 | R-PQCC-J18 |
| JESD-609代码 | e0 | e0 | e0 | e0 | e0 | e0 |
| 内存密度 | 262144 bit | 262144 bit | 262144 bit | 262144 bit | 262144 bit | 262144 bit |
| 内存集成电路类型 | PAGE MODE DRAM | PAGE MODE DRAM | PAGE MODE DRAM | PAGE MODE DRAM | PAGE MODE DRAM | PAGE MODE DRAM |
| 内存宽度 | 4 | 4 | 4 | 4 | 4 | 4 |
| 端子数量 | 18 | 18 | 18 | 18 | 18 | 18 |
| 字数 | 65536 words | 65536 words | 65536 words | 65536 words | 65536 words | 65536 words |
| 字数代码 | 64000 | 64000 | 64000 | 64000 | 64000 | 64000 |
| 最高工作温度 | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C |
| 组织 | 64KX4 | 64KX4 | 64KX4 | 64KX4 | 64KX4 | 64KX4 |
| 输出特性 | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE |
| 封装主体材料 | PLASTIC/EPOXY | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | QCCJ | DIP | DIP | DIP | QCCJ | QCCJ |
| 封装等效代码 | LDCC18,.33X.53 | DIP18,.3 | DIP18,.3 | DIP18,.3 | LDCC18,.33X.53 | LDCC18,.33X.53 |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | CHIP CARRIER | IN-LINE | IN-LINE | IN-LINE | CHIP CARRIER | CHIP CARRIER |
| 电源 | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 刷新周期 | 256 | 256 | 256 | 256 | 256 | 256 |
| 最大压摆率 | 0.045 mA | 0.055 mA | 0.055 mA | 0.045 mA | 0.055 mA | 0.055 mA |
| 标称供电电压 (Vsup) | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| 表面贴装 | YES | NO | NO | NO | YES | YES |
| 技术 | MOS | CMOS | CMOS | CMOS | MOS | MOS |
| 温度等级 | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL |
| 端子面层 | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| 端子形式 | J BEND | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | J BEND | J BEND |
| 端子节距 | 1.27 mm | 2.54 mm | 2.54 mm | 2.54 mm | 1.27 mm | 1.27 mm |
| 端子位置 | QUAD | DUAL | DUAL | DUAL | QUAD | QUAD |
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