Standard SRAM, 64KX16, 12ns, CMOS, PDSO44, PLASTIC, TSOP2-44
| 参数名称 | 属性值 |
| 是否无铅 | 含铅 |
| 是否Rohs认证 | 不符合 |
| 厂商名称 | Integrated Silicon Solution ( ISSI ) |
| 零件包装代码 | TSOP2 |
| 包装说明 | PLASTIC, TSOP2-44 |
| 针数 | 44 |
| Reach Compliance Code | compliant |
| ECCN代码 | 3A991.B.2.B |
| 最长访问时间 | 12 ns |
| I/O 类型 | COMMON |
| JESD-30 代码 | R-PDSO-G44 |
| JESD-609代码 | e0 |
| 长度 | 18.415 mm |
| 内存密度 | 1048576 bit |
| 内存集成电路类型 | STANDARD SRAM |
| 内存宽度 | 16 |
| 湿度敏感等级 | 3 |
| 功能数量 | 1 |
| 端子数量 | 44 |
| 字数 | 65536 words |
| 字数代码 | 64000 |
| 工作模式 | ASYNCHRONOUS |
| 最高工作温度 | 70 °C |
| 最低工作温度 | |
| 组织 | 64KX16 |
| 输出特性 | 3-STATE |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | TSOP2 |
| 封装等效代码 | TSOP44,.46,32 |
| 封装形状 | RECTANGULAR |
| 封装形式 | SMALL OUTLINE, THIN PROFILE |
| 并行/串行 | PARALLEL |
| 峰值回流温度（摄氏度） | NOT SPECIFIED |
| 电源 | 3.3 V |
| 认证状态 | Not Qualified |
| 座面最大高度 | 1.2 mm |
| 最大待机电流 | 0.001 A |
| 最小待机电流 | 3 V |
| 最大压摆率 | 0.09 mA |
| 最大供电电压 (Vsup) | 3.63 V |
| 最小供电电压 (Vsup) | 2.97 V |
| 标称供电电压 (Vsup) | 3.3 V |
| 表面贴装 | YES |
| 技术 | CMOS |
| 温度等级 | COMMERCIAL |
| 端子面层 | Tin/Lead (Sn/Pb) |
| 端子形式 | GULL WING |
| 端子节距 | 0.8 mm |
| 端子位置 | DUAL |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED |
| 宽度 | 10.16 mm |
| IS61LV6416L-12T | IS61LV6416L-12B | IS61LV6416L-12K | IS61LV6416L-12KI | IS61LV6416L-8B | IS61LV6416L-8K | IS61LV6416L-10B | IS61LV6416L-12BI | |
|---|---|---|---|---|---|---|---|---|
| 描述 | Standard SRAM, 64KX16, 12ns, CMOS, PDSO44, PLASTIC, TSOP2-44 | Standard SRAM, 64KX16, 12ns, CMOS, PBGA48, 6 X 8 MM, MINI, BGA-48 | Standard SRAM, 64KX16, 12ns, CMOS, PDSO44, 0.400 INCH, PLASTIC, SOJ-44 | Standard SRAM, 64KX16, 12ns, CMOS, PDSO44, 0.400 INCH, PLASTIC, SOJ-44 | Standard SRAM, 64KX16, 8ns, CMOS, PBGA48, 6 X 8 MM, MINI, BGA-48 | Standard SRAM, 64KX16, 8ns, CMOS, PDSO44, 0.400 INCH, PLASTIC, SOJ-44 | Standard SRAM, 64KX16, 10ns, CMOS, PBGA48, 6 X 8 MM, MINI, BGA-48 | Standard SRAM, 64KX16, 12ns, CMOS, PBGA48, 6 X 8 MM, MINI, BGA-48 |
| 是否Rohs认证 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 |
| 零件包装代码 | TSOP2 | BGA | SOJ | SOJ | BGA | SOJ | BGA | BGA |
| 包装说明 | PLASTIC, TSOP2-44 | 6 X 8 MM, MINI, BGA-48 | 0.400 INCH, PLASTIC, SOJ-44 | 0.400 INCH, PLASTIC, SOJ-44 | 6 X 8 MM, MINI, BGA-48 | 0.400 INCH, PLASTIC, SOJ-44 | 6 X 8 MM, MINI, BGA-48 | 6 X 8 MM, MINI, BGA-48 |
| 针数 | 44 | 48 | 44 | 44 | 48 | 44 | 48 | 48 |
| Reach Compliance Code | compliant | compliant | compliant | compliant | compliant | compliant | compliant | compliant |
| ECCN代码 | 3A991.B.2.B | 3A991.B.2.B | 3A991.B.2.B | 3A991.B.2.B | 3A991.B.2.B | 3A991.B.2.B | 3A991.B.2.B | 3A991.B.2.B |
| 最长访问时间 | 12 ns | 12 ns | 12 ns | 12 ns | 8 ns | 8 ns | 10 ns | 12 ns |
| JESD-30 代码 | R-PDSO-G44 | R-PBGA-B48 | R-PDSO-J44 | R-PDSO-J44 | R-PBGA-B48 | R-PDSO-J44 | R-PBGA-B48 | R-PBGA-B48 |
| JESD-609代码 | e0 | e0 | e0 | e0 | e0 | e0 | e0 | e0 |
| 长度 | 18.415 mm | 8 mm | 28.58 mm | 28.58 mm | 8 mm | 28.58 mm | 8 mm | 8 mm |
| 内存密度 | 1048576 bit | 1048576 bit | 1048576 bit | 1048576 bit | 1048576 bit | 1048576 bit | 1048576 bit | 1048576 bit |
| 内存集成电路类型 | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM |
| 内存宽度 | 16 | 16 | 16 | 16 | 16 | 16 | 16 | 16 |
| 功能数量 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
| 端子数量 | 44 | 48 | 44 | 44 | 48 | 44 | 48 | 48 |
| 字数 | 65536 words | 65536 words | 65536 words | 65536 words | 65536 words | 65536 words | 65536 words | 65536 words |
| 字数代码 | 64000 | 64000 | 64000 | 64000 | 64000 | 64000 | 64000 | 64000 |
| 工作模式 | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS |
| 最高工作温度 | 70 °C | 70 °C | 70 °C | 85 °C | 70 °C | 70 °C | 70 °C | 85 °C |
| 组织 | 64KX16 | 64KX16 | 64KX16 | 64KX16 | 64KX16 | 64KX16 | 64KX16 | 64KX16 |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | TSOP2 | TFBGA | SOJ | SOJ | LFBGA | SOJ | LFBGA | LFBGA |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | SMALL OUTLINE, THIN PROFILE | GRID ARRAY, THIN PROFILE, FINE PITCH | SMALL OUTLINE | SMALL OUTLINE | GRID ARRAY, LOW PROFILE, FINE PITCH | SMALL OUTLINE | GRID ARRAY, LOW PROFILE, FINE PITCH | GRID ARRAY, LOW PROFILE, FINE PITCH |
| 并行/串行 | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL |
| 峰值回流温度（摄氏度） | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 座面最大高度 | 1.2 mm | 1.2 mm | 3.76 mm | 3.76 mm | 1.35 mm | 3.76 mm | 1.35 mm | 1.35 mm |
| 最大供电电压 (Vsup) | 3.63 V | 3.63 V | 3.63 V | 3.63 V | 3.63 V | 3.63 V | 3.63 V | 3.63 V |
| 最小供电电压 (Vsup) | 2.97 V | 2.97 V | 2.97 V | 2.97 V | 3.135 V | 3.135 V | 3.135 V | 2.97 V |
| 标称供电电压 (Vsup) | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V |
| 表面贴装 | YES | YES | YES | YES | YES | YES | YES | YES |
| 技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | COMMERCIAL | COMMERCIAL | COMMERCIAL | INDUSTRIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | INDUSTRIAL |
| 端子面层 | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| 端子形式 | GULL WING | BALL | J BEND | J BEND | BALL | J BEND | BALL | BALL |
| 端子节距 | 0.8 mm | 0.75 mm | 1.27 mm | 1.27 mm | 0.75 mm | 1.27 mm | 0.75 mm | 0.75 mm |
| 端子位置 | DUAL | BOTTOM | DUAL | DUAL | BOTTOM | DUAL | BOTTOM | BOTTOM |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| 宽度 | 10.16 mm | 6 mm | 10.16 mm | 10.16 mm | 6 mm | 10.16 mm | 6 mm | 6 mm |
| 是否无铅 | 含铅 | 含铅 | 含铅 | - | 含铅 | 含铅 | 含铅 | - |
| 厂商名称 | Integrated Silicon Solution ( ISSI ) | - | Integrated Silicon Solution ( ISSI ) | Integrated Silicon Solution ( ISSI ) | Integrated Silicon Solution ( ISSI ) | Integrated Silicon Solution ( ISSI ) | Integrated Silicon Solution ( ISSI ) | Integrated Silicon Solution ( ISSI ) |
| 湿度敏感等级 | 3 | 3 | 3 | - | 3 | 3 | 3 | - |
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