IDT72B04S15LB概述

FIFO, 4KX9, 15ns, Asynchronous, CQCC32, LCC-32

IDT72B04S15LB规格参数

参数名称	属性值
厂商名称	IDT (Integrated Device Technology)
零件包装代码	QFJ
包装说明	QCCN,
针数	32
Reach Compliance Code	unknown
ECCN代码	EAR99
最长访问时间	15 ns
周期时间	25 ns
JESD-30 代码	R-CQCC-N32
JESD-609代码	e0
内存密度	36864 bit
内存宽度	9
功能数量	1
端子数量	32
字数	4096 words
字数代码	4000
工作模式	ASYNCHRONOUS
最高工作温度	125 °C
最低工作温度	-55 °C
组织	4KX9
可输出	NO
封装主体材料	CERAMIC, METAL-SEALED COFIRED
封装代码	QCCN
封装形状	RECTANGULAR
封装形式	CHIP CARRIER
并行/串行	PARALLEL
认证状态	Not Qualified
表面贴装	YES
技术	CMOS
温度等级	MILITARY
端子面层	TIN LEAD
端子形式	NO LEAD
端子位置	QUAD

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IDT72B04S15LB相似产品对比

	IDT72B04S15LB	IDT72B04S15JB	IDT72B04S15P	IDT72B04S15PB	IDT72B04S15L	IDT72B04S15J	IDT72B04S15DB	IDT72B04S15D
描述	FIFO, 4KX9, 15ns, Asynchronous, CQCC32, LCC-32	FIFO, 4KX9, 15ns, Asynchronous, PQCC32, PLASTIC, LCC-32	FIFO, 4KX9, 15ns, Asynchronous, PDIP28, PLASTIC, DIP-28	FIFO, 4KX9, 15ns, Asynchronous, PDIP28, PLASTIC, DIP-28	FIFO, 4KX9, 15ns, Asynchronous, CQCC32, LCC-32	FIFO, 4KX9, 15ns, Asynchronous, PQCC32, PLASTIC, LCC-32	FIFO, 4KX9, 15ns, Asynchronous, CDIP28, CERDIP-28	FIFO, 4KX9, 15ns, Asynchronous, CDIP28, CERDIP-28
零件包装代码	QFJ	QFJ	DIP	DIP	QFJ	QFJ	DIP	DIP
包装说明	QCCN,	PLASTIC, LCC-32	DIP,	DIP,	QCCN,	PLASTIC, LCC-32	DIP,	DIP,
针数	32	32	28	28	32	32	28	28
Reach Compliance Code	unknown	unknown	unknown	unknown	unknown	unknown	unknown	unknown
ECCN代码	EAR99	EAR99	EAR99	EAR99	EAR99	EAR99	EAR99	EAR99
最长访问时间	15 ns	15 ns	15 ns	15 ns	15 ns	15 ns	15 ns	15 ns
周期时间	25 ns	25 ns	25 ns	25 ns	25 ns	25 ns	25 ns	25 ns
JESD-30 代码	R-CQCC-N32	R-PQCC-J32	R-PDIP-T28	R-PDIP-T28	R-CQCC-N32	R-PQCC-J32	R-GDIP-T28	R-GDIP-T28
JESD-609代码	e0	e0	e0	e0	e0	e0	e0	e0
内存密度	36864 bit	36864 bit	36864 bit	36864 bit	36864 bit	36864 bit	36864 bit	36864 bit
内存宽度	9	9	9	9	9	9	9	9
功能数量	1	1	1	1	1	1	1	1
端子数量	32	32	28	28	32	32	28	28
字数	4096 words	4096 words	4096 words	4096 words	4096 words	4096 words	4096 words	4096 words
字数代码	4000	4000	4000	4000	4000	4000	4000	4000
工作模式	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS
最高工作温度	125 °C	125 °C	70 °C	125 °C	70 °C	70 °C	125 °C	70 °C
组织	4KX9	4KX9	4KX9	4KX9	4KX9	4KX9	4KX9	4KX9
可输出	NO	NO	NO	NO	NO	NO	NO	NO
封装主体材料	CERAMIC, METAL-SEALED COFIRED	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	CERAMIC, METAL-SEALED COFIRED	PLASTIC/EPOXY	CERAMIC, GLASS-SEALED	CERAMIC, GLASS-SEALED
封装代码	QCCN	QCCJ	DIP	DIP	QCCN	QCCJ	DIP	DIP
封装形状	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
封装形式	CHIP CARRIER	CHIP CARRIER	IN-LINE	IN-LINE	CHIP CARRIER	CHIP CARRIER	IN-LINE	IN-LINE
并行/串行	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL
认证状态	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
表面贴装	YES	YES	NO	NO	YES	YES	NO	NO
技术	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS
温度等级	MILITARY	MILITARY	COMMERCIAL	MILITARY	COMMERCIAL	COMMERCIAL	MILITARY	COMMERCIAL
端子面层	TIN LEAD	TIN LEAD	TIN LEAD	TIN LEAD	TIN LEAD	TIN LEAD	TIN LEAD	TIN LEAD
端子形式	NO LEAD	J BEND	THROUGH-HOLE	THROUGH-HOLE	NO LEAD	J BEND	THROUGH-HOLE	THROUGH-HOLE
端子位置	QUAD	QUAD	DUAL	DUAL	QUAD	QUAD	DUAL	DUAL
厂商名称	IDT (Integrated Device Technology)	-	IDT (Integrated Device Technology)	IDT (Integrated Device Technology)	IDT (Integrated Device Technology)	IDT (Integrated Device Technology)	IDT (Integrated Device Technology)	IDT (Integrated Device Technology)

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