SNJ54BCT29827BNT概述

BCT/FBT SERIES, 10-BIT DRIVER, TRUE OUTPUT, CDIP24, 0.300 INCH, CERAMIC, DIP-24

SNJ54BCT29827BNT规格参数

参数名称	属性值
厂商名称	Texas Instruments(德州仪器)
零件包装代码	DIP
包装说明	0.300 INCH, CERAMIC, DIP-24
针数	24
Reach Compliance Code	unknown
系列	BCT/FBT
JESD-30 代码	R-GDIP-T24
长度	32.004 mm
逻辑集成电路类型	BUS DRIVER
位数	10
功能数量	1
端口数量	2
端子数量	24
最高工作温度	125 °C
最低工作温度	-55 °C
输出特性	3-STATE
输出极性	TRUE
封装主体材料	CERAMIC, GLASS-SEALED
封装代码	DIP
封装形状	RECTANGULAR
封装形式	IN-LINE
传播延迟（tpd）	7.7 ns
认证状态	Not Qualified
座面最大高度	5.08 mm
最大供电电压 (Vsup)	5.5 V
最小供电电压 (Vsup)	4.5 V
标称供电电压 (Vsup)	5 V
表面贴装	NO
技术	CMOS
温度等级	MILITARY
端子形式	THROUGH-HOLE
端子节距	2.54 mm
端子位置	DUAL
宽度	7.62 mm

SNJ54BCT29827BNT相似产品对比

	SNJ54BCT29827BNT	SNJ54BCT29827BDW	SNJ54BCT29827BDWR	SN74BCT29827BJT	SN74BCT29827BW	SN54BCT29827BDW	SN54BCT29827BDWR	SN54BCT29827BNT
描述	BCT/FBT SERIES, 10-BIT DRIVER, TRUE OUTPUT, CDIP24, 0.300 INCH, CERAMIC, DIP-24	BCT/FBT SERIES, 10-BIT DRIVER, TRUE OUTPUT, PDSO24, PLASTIC, SO-24	BCT/FBT SERIES, 10-BIT DRIVER, TRUE OUTPUT, PDSO24, PLASTIC, SO-24	BCT/FBT SERIES, 10-BIT DRIVER, TRUE OUTPUT, CDIP24, 0.300 INCH, CERAMIC, DIP-24	BCT/FBT SERIES, 10-BIT DRIVER, TRUE OUTPUT, PDFP24, PLASTIC, DFP-24	BCT/FBT SERIES, 10-BIT DRIVER, TRUE OUTPUT, PDSO24, PLASTIC, SO-24	BCT/FBT SERIES, 10-BIT DRIVER, TRUE OUTPUT, PDSO24, PLASTIC, SO-24	BCT/FBT SERIES, 10-BIT DRIVER, TRUE OUTPUT, CDIP24, 0.300 INCH, CERAMIC, DIP-24
零件包装代码	DIP	SOIC	SOIC	DIP	DFP	SOIC	SOIC	DIP
包装说明	0.300 INCH, CERAMIC, DIP-24	SOP,	SOP,	DIP,	DFP,	SOP,	SOP,	DIP,
针数	24	24	24	24	24	24	24	24
Reach Compliance Code	unknown	unknown	unknown	unknown	unknown	unknown	unknown	unknown
系列	BCT/FBT	BCT/FBT	BCT/FBT	BCT/FBT	BCT/FBT	BCT/FBT	BCT/FBT	BCT/FBT
JESD-30 代码	R-GDIP-T24	R-PDSO-G24	R-PDSO-G24	R-GDIP-T24	R-PDFP-F24	R-PDSO-G24	R-PDSO-G24	R-GDIP-T24
长度	32.004 mm	15.4 mm	15.4 mm	32.005 mm	14.36 mm	15.4 mm	15.4 mm	32.004 mm
逻辑集成电路类型	BUS DRIVER	BUS DRIVER	BUS DRIVER	BUS DRIVER	BUS DRIVER	BUS DRIVER	BUS DRIVER	BUS DRIVER
位数	10	10	10	10	10	10	10	10
功能数量	1	1	1	1	1	1	1	1
端口数量	2	2	2	2	2	2	2	2
端子数量	24	24	24	24	24	24	24	24
最高工作温度	125 °C	125 °C	125 °C	70 °C	70 °C	125 °C	125 °C	125 °C
最低工作温度	-55 °C	-55 °C	-55 °C	-	-	-55 °C	-55 °C	-55 °C
输出特性	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE
输出极性	TRUE	TRUE	TRUE	TRUE	TRUE	TRUE	TRUE	TRUE
封装主体材料	CERAMIC, GLASS-SEALED	PLASTIC/EPOXY	PLASTIC/EPOXY	CERAMIC, GLASS-SEALED	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	CERAMIC, GLASS-SEALED
封装代码	DIP	SOP	SOP	DIP	DFP	SOP	SOP	DIP
封装形状	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
封装形式	IN-LINE	SMALL OUTLINE	SMALL OUTLINE	IN-LINE	FLATPACK	SMALL OUTLINE	SMALL OUTLINE	IN-LINE
传播延迟（tpd）	7.7 ns	7.7 ns	7.7 ns	7.5 ns	7.5 ns	7.7 ns	7.7 ns	7.7 ns
认证状态	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
座面最大高度	5.08 mm	2.65 mm	2.65 mm	5.08 mm	2.29 mm	2.65 mm	2.65 mm	5.08 mm
最大供电电压 (Vsup)	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V
最小供电电压 (Vsup)	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V
标称供电电压 (Vsup)	5 V	5 V	5 V	5 V	5 V	5 V	5 V	5 V
表面贴装	NO	YES	YES	NO	YES	YES	YES	NO
技术	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS
温度等级	MILITARY	MILITARY	MILITARY	COMMERCIAL	COMMERCIAL	MILITARY	MILITARY	MILITARY
端子形式	THROUGH-HOLE	GULL WING	GULL WING	THROUGH-HOLE	FLAT	GULL WING	GULL WING	THROUGH-HOLE
端子节距	2.54 mm	1.27 mm	1.27 mm	2.54 mm	1.27 mm	1.27 mm	1.27 mm	2.54 mm
端子位置	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL
宽度	7.62 mm	7.5 mm	7.5 mm	7.62 mm	9.09 mm	7.5 mm	7.5 mm	7.62 mm

SNJ54BCT29827BNT

SNJ54BCT29827BNT概述

SNJ54BCT29827BNT规格参数

SNJ54BCT29827BNT相似产品对比

推荐资源