IC 64-BIT, 66.67 MHz, OTHER DSP, PBGA697, 24 X 24 MM, 0.80 MM PITCH, PLASTIC, BGA-697, Digital Signal Processor
参数名称 | 属性值 |
厂商名称 | Texas Instruments(德州仪器) |
零件包装代码 | BGA |
包装说明 | HFBGA, |
针数 | 697 |
Reach Compliance Code | unknown |
ECCN代码 | 3A001.A.3 |
其他特性 | ALSO REQUIRES 3.3V SUPPLY |
地址总线宽度 | 20 |
桶式移位器 | NO |
边界扫描 | YES |
最大时钟频率 | 66.67 MHz |
外部数据总线宽度 | 64 |
格式 | FIXED POINT |
内部总线架构 | MULTIPLE |
JESD-30 代码 | S-PBGA-B697 |
长度 | 24 mm |
低功率模式 | YES |
端子数量 | 697 |
封装主体材料 | PLASTIC/EPOXY |
封装代码 | HFBGA |
封装形状 | SQUARE |
封装形式 | GRID ARRAY, HEAT SINK/SLUG, FINE PITCH |
认证状态 | Not Qualified |
座面最大高度 | 3.1 mm |
最大供电电压 | 1.24 V |
最小供电电压 | 1.17 V |
标称供电电压 | 1.2 V |
表面贴装 | YES |
技术 | CMOS |
端子形式 | BALL |
端子节距 | 0.8 mm |
端子位置 | BOTTOM |
宽度 | 24 mm |
uPs/uCs/外围集成电路类型 | DIGITAL SIGNAL PROCESSOR, OTHER |
TMX320C6455ZTZ720 | TMX320C6455ZTZ850 | TMX320C6455ZTZ1 | |
---|---|---|---|
描述 | IC 64-BIT, 66.67 MHz, OTHER DSP, PBGA697, 24 X 24 MM, 0.80 MM PITCH, PLASTIC, BGA-697, Digital Signal Processor | 64-BIT, 66.67MHz, OTHER DSP, PBGA697, 24 X 24 MM, 0.80 MM PITCH, PLASTIC, BGA-697 | 64-BIT, 66.67MHz, OTHER DSP, PBGA697, 24 X 24 MM, 0.80 MM PITCH, LEAD FREE, PLASTIC, BGA-697 |
厂商名称 | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) |
零件包装代码 | BGA | BGA | BGA |
包装说明 | HFBGA, | HFBGA, | HFBGA, |
针数 | 697 | 697 | 697 |
Reach Compliance Code | unknown | unknown | unknown |
ECCN代码 | 3A001.A.3 | 3A001.A.3 | 3A001.A.3 |
其他特性 | ALSO REQUIRES 3.3V SUPPLY | ALSO REQUIRES 3.3V SUPPLY | ALSO REQUIRES 3.3V SUPPLY |
地址总线宽度 | 20 | 20 | 20 |
桶式移位器 | NO | NO | NO |
边界扫描 | YES | YES | YES |
最大时钟频率 | 66.67 MHz | 66.67 MHz | 66.67 MHz |
外部数据总线宽度 | 64 | 64 | 64 |
格式 | FIXED POINT | FIXED POINT | FIXED POINT |
内部总线架构 | MULTIPLE | MULTIPLE | MULTIPLE |
JESD-30 代码 | S-PBGA-B697 | S-PBGA-B697 | S-PBGA-B697 |
长度 | 24 mm | 24 mm | 24 mm |
低功率模式 | YES | YES | YES |
端子数量 | 697 | 697 | 697 |
封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
封装代码 | HFBGA | HFBGA | HFBGA |
封装形状 | SQUARE | SQUARE | SQUARE |
封装形式 | GRID ARRAY, HEAT SINK/SLUG, FINE PITCH | GRID ARRAY, HEAT SINK/SLUG, FINE PITCH | GRID ARRAY, HEAT SINK/SLUG, FINE PITCH |
认证状态 | Not Qualified | Not Qualified | Not Qualified |
座面最大高度 | 3.1 mm | 3.1 mm | 3.1 mm |
最大供电电压 | 1.24 V | 1.24 V | 1.24 V |
最小供电电压 | 1.17 V | 1.17 V | 1.17 V |
标称供电电压 | 1.2 V | 1.2 V | 1.2 V |
表面贴装 | YES | YES | YES |
技术 | CMOS | CMOS | CMOS |
端子形式 | BALL | BALL | BALL |
端子节距 | 0.8 mm | 0.8 mm | 0.8 mm |
端子位置 | BOTTOM | BOTTOM | BOTTOM |
宽度 | 24 mm | 24 mm | 24 mm |
uPs/uCs/外围集成电路类型 | DIGITAL SIGNAL PROCESSOR, OTHER | DIGITAL SIGNAL PROCESSOR, OTHER | DIGITAL SIGNAL PROCESSOR, OTHER |
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