LS SERIES, 6-BIT DRIVER, TRUE OUTPUT, CDIP16, CERAMIC, DIP-16
| 参数名称 | 属性值 |
| 是否Rohs认证 | 不符合 |
| 厂商名称 | Texas Instruments(德州仪器) |
| 包装说明 | DIP, DIP16,.3 |
| Reach Compliance Code | unknown |
| 控制类型 | ENABLE LOW |
| 系列 | LS |
| JESD-30 代码 | R-GDIP-T16 |
| JESD-609代码 | e0 |
| 长度 | 19.304 mm |
| 逻辑集成电路类型 | BUS DRIVER |
| 最大I（ol） | 0.012 A |
| 位数 | 6 |
| 功能数量 | 1 |
| 端口数量 | 2 |
| 端子数量 | 16 |
| 最高工作温度 | 125 °C |
| 最低工作温度 | -55 °C |
| 输出特性 | 3-STATE |
| 输出极性 | TRUE |
| 封装主体材料 | CERAMIC, GLASS-SEALED |
| 封装代码 | DIP |
| 封装等效代码 | DIP16,.3 |
| 封装形状 | RECTANGULAR |
| 封装形式 | IN-LINE |
| 电源 | 5 V |
| 最大电源电流（ICC） | 24 mA |
| Prop。Delay @ Nom-Sup | 16 ns |
| 传播延迟（tpd） | 25 ns |
| 认证状态 | Not Qualified |
| 座面最大高度 | 5.08 mm |
| 最大供电电压 (Vsup) | 5.5 V |
| 最小供电电压 (Vsup) | 4.5 V |
| 标称供电电压 (Vsup) | 5 V |
| 表面贴装 | NO |
| 技术 | TTL |
| 温度等级 | MILITARY |
| 端子面层 | Tin/Lead (Sn/Pb) |
| 端子形式 | THROUGH-HOLE |
| 端子节距 | 2.54 mm |
| 端子位置 | DUAL |
| 宽度 | 7.62 mm |
| DM54LS365AJ | 54LS365ALMQB | DBP-M999-03-8871-FG | DM74LS365AN | DM54LS365AW | DM74LS265AM | |
|---|---|---|---|---|---|---|
| 描述 | LS SERIES, 6-BIT DRIVER, TRUE OUTPUT, CDIP16, CERAMIC, DIP-16 | LS SERIES, 6-BIT DRIVER, TRUE OUTPUT, CQCC20, CERAMIC, LCC-20 | Array/Network Resistor, Isolated, Tantalum Nitride/nickel Chrome, 0.2W, 8870ohm, 100V, 1% +/-Tol, -25,25ppm/Cel, 8726, | LS SERIES, 6-BIT DRIVER, TRUE OUTPUT, PDIP16, PLASTIC, DIP-16 | LS SERIES, 6-BIT DRIVER, TRUE OUTPUT, CDFP16, CERAMIC, FP-16 | LS SERIES, 6-BIT DRIVER, TRUE OUTPUT, PDSO16, PLASTIC, SO-16 |
| Reach Compliance Code | unknown | unknown | compliant | unknown | unknown | unknown |
| 端子数量 | 16 | 20 | 16 | 16 | 16 | 16 |
| 最高工作温度 | 125 °C | 125 °C | 150 °C | 70 °C | 125 °C | 70 °C |
| 最低工作温度 | -55 °C | -55 °C | -55 °C | - | -55 °C | - |
| 封装形状 | RECTANGULAR | SQUARE | RECTANGULAR PACKAGE | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | IN-LINE | CHIP CARRIER | DIP | IN-LINE | FLATPACK | SMALL OUTLINE |
| 技术 | TTL | TTL | TANTALUM NITRIDE/NICKEL CHROME | TTL | TTL | TTL |
| 是否Rohs认证 | 不符合 | - | 不符合 | 不符合 | 不符合 | - |
| 包装说明 | DIP, DIP16,.3 | QCCN, LCC20,.35SQ | - | DIP, DIP16,.3 | DFP, FL16,.3 | SOP, |
| 控制类型 | ENABLE LOW | ENABLE LOW | - | ENABLE LOW | ENABLE LOW | - |
| 系列 | LS | LS | - | LS | LS | LS |
| JESD-30 代码 | R-GDIP-T16 | S-CQCC-N20 | - | R-PDIP-T16 | R-GDFP-F16 | R-PDSO-G16 |
| 长度 | 19.304 mm | 8.89 mm | - | 19.304 mm | 9.6645 mm | 9.9 mm |
| 逻辑集成电路类型 | BUS DRIVER | BUS DRIVER | - | BUS DRIVER | BUS DRIVER | BUS DRIVER |
| 最大I（ol） | 0.012 A | 0.012 A | - | 0.024 A | 0.012 A | - |
| 位数 | 6 | 6 | - | 6 | 6 | 6 |
| 功能数量 | 1 | 1 | - | 1 | 1 | 1 |
| 端口数量 | 2 | 2 | - | 2 | 2 | 2 |
| 输出特性 | 3-STATE | 3-STATE | - | 3-STATE | 3-STATE | 3-STATE |
| 输出极性 | TRUE | TRUE | - | TRUE | TRUE | TRUE |
| 封装主体材料 | CERAMIC, GLASS-SEALED | CERAMIC, METAL-SEALED COFIRED | - | PLASTIC/EPOXY | CERAMIC, GLASS-SEALED | PLASTIC/EPOXY |
| 封装代码 | DIP | QCCN | - | DIP | DFP | SOP |
| 封装等效代码 | DIP16,.3 | LCC20,.35SQ | - | DIP16,.3 | FL16,.3 | - |
| 电源 | 5 V | 5 V | - | 5 V | 5 V | - |
| 最大电源电流（ICC） | 24 mA | 24 mA | - | 24 mA | 24 mA | - |
| Prop。Delay @ Nom-Sup | 16 ns | 16 ns | - | 16 ns | 16 ns | - |
| 传播延迟（tpd） | 25 ns | 25 ns | - | 25 ns | 25 ns | 25 ns |
| 认证状态 | Not Qualified | Not Qualified | - | Not Qualified | Not Qualified | Not Qualified |
| 座面最大高度 | 5.08 mm | 1.905 mm | - | 5.08 mm | 2.032 mm | 1.75 mm |
| 最大供电电压 (Vsup) | 5.5 V | 5.5 V | - | 5.25 V | 5.5 V | 5.25 V |
| 最小供电电压 (Vsup) | 4.5 V | 4.5 V | - | 4.75 V | 4.5 V | 4.75 V |
| 标称供电电压 (Vsup) | 5 V | 5 V | - | 5 V | 5 V | 5 V |
| 表面贴装 | NO | YES | - | NO | YES | YES |
| 温度等级 | MILITARY | MILITARY | - | COMMERCIAL | MILITARY | COMMERCIAL |
| 端子形式 | THROUGH-HOLE | NO LEAD | - | THROUGH-HOLE | FLAT | GULL WING |
| 端子节距 | 2.54 mm | 1.27 mm | - | 2.54 mm | 1.27 mm | 1.27 mm |
| 端子位置 | DUAL | QUAD | - | DUAL | DUAL | DUAL |
| 宽度 | 7.62 mm | 8.89 mm | - | 7.62 mm | 6.604 mm | 3.9 mm |
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