LS SERIES, 6-BIT DRIVER, TRUE OUTPUT, CDFP16, CERAMIC, FP-16
参数名称 | 属性值 |
是否Rohs认证 | 不符合 |
包装说明 | DFP, FL16,.3 |
Reach Compliance Code | unknown |
控制类型 | ENABLE LOW |
系列 | LS |
JESD-30 代码 | R-GDFP-F16 |
JESD-609代码 | e0 |
长度 | 9.6645 mm |
逻辑集成电路类型 | BUS DRIVER |
最大I(ol) | 0.012 A |
位数 | 6 |
功能数量 | 1 |
端口数量 | 2 |
端子数量 | 16 |
最高工作温度 | 125 °C |
最低工作温度 | -55 °C |
输出特性 | 3-STATE |
输出极性 | TRUE |
封装主体材料 | CERAMIC, GLASS-SEALED |
封装代码 | DFP |
封装等效代码 | FL16,.3 |
封装形状 | RECTANGULAR |
封装形式 | FLATPACK |
峰值回流温度(摄氏度) | NOT SPECIFIED |
电源 | 5 V |
最大电源电流(ICC) | 24 mA |
Prop。Delay @ Nom-Sup | 16 ns |
传播延迟(tpd) | 25 ns |
认证状态 | Not Qualified |
座面最大高度 | 2.032 mm |
最大供电电压 (Vsup) | 5.5 V |
最小供电电压 (Vsup) | 4.5 V |
标称供电电压 (Vsup) | 5 V |
表面贴装 | YES |
技术 | TTL |
温度等级 | MILITARY |
端子面层 | Tin/Lead (Sn/Pb) |
端子形式 | FLAT |
端子节距 | 1.27 mm |
端子位置 | DUAL |
处于峰值回流温度下的最长时间 | NOT SPECIFIED |
宽度 | 6.604 mm |
Base Number Matches | 1 |
DM54LS365AW | 54LS365ALMQB | DBP-M999-03-8871-FG | DM74LS365AN | DM54LS365AJ | DM74LS265AM | |
---|---|---|---|---|---|---|
描述 | LS SERIES, 6-BIT DRIVER, TRUE OUTPUT, CDFP16, CERAMIC, FP-16 | LS SERIES, 6-BIT DRIVER, TRUE OUTPUT, CQCC20, CERAMIC, LCC-20 | Array/Network Resistor, Isolated, Tantalum Nitride/nickel Chrome, 0.2W, 8870ohm, 100V, 1% +/-Tol, -25,25ppm/Cel, 8726, | LS SERIES, 6-BIT DRIVER, TRUE OUTPUT, PDIP16, PLASTIC, DIP-16 | LS SERIES, 6-BIT DRIVER, TRUE OUTPUT, CDIP16, CERAMIC, DIP-16 | LS SERIES, 6-BIT DRIVER, TRUE OUTPUT, PDSO16, PLASTIC, SO-16 |
Reach Compliance Code | unknown | unknown | compliant | unknown | unknown | unknown |
端子数量 | 16 | 20 | 16 | 16 | 16 | 16 |
最高工作温度 | 125 °C | 125 °C | 150 °C | 70 °C | 125 °C | 70 °C |
最低工作温度 | -55 °C | -55 °C | -55 °C | - | -55 °C | - |
封装形状 | RECTANGULAR | SQUARE | RECTANGULAR PACKAGE | RECTANGULAR | RECTANGULAR | RECTANGULAR |
封装形式 | FLATPACK | CHIP CARRIER | DIP | IN-LINE | IN-LINE | SMALL OUTLINE |
技术 | TTL | TTL | TANTALUM NITRIDE/NICKEL CHROME | TTL | TTL | TTL |
是否Rohs认证 | 不符合 | - | 不符合 | 不符合 | 不符合 | - |
包装说明 | DFP, FL16,.3 | QCCN, LCC20,.35SQ | - | DIP, DIP16,.3 | DIP, DIP16,.3 | SOP, |
控制类型 | ENABLE LOW | ENABLE LOW | - | ENABLE LOW | ENABLE LOW | - |
系列 | LS | LS | - | LS | LS | LS |
JESD-30 代码 | R-GDFP-F16 | S-CQCC-N20 | - | R-PDIP-T16 | R-GDIP-T16 | R-PDSO-G16 |
长度 | 9.6645 mm | 8.89 mm | - | 19.304 mm | 19.304 mm | 9.9 mm |
逻辑集成电路类型 | BUS DRIVER | BUS DRIVER | - | BUS DRIVER | BUS DRIVER | BUS DRIVER |
最大I(ol) | 0.012 A | 0.012 A | - | 0.024 A | 0.012 A | - |
位数 | 6 | 6 | - | 6 | 6 | 6 |
功能数量 | 1 | 1 | - | 1 | 1 | 1 |
端口数量 | 2 | 2 | - | 2 | 2 | 2 |
输出特性 | 3-STATE | 3-STATE | - | 3-STATE | 3-STATE | 3-STATE |
输出极性 | TRUE | TRUE | - | TRUE | TRUE | TRUE |
封装主体材料 | CERAMIC, GLASS-SEALED | CERAMIC, METAL-SEALED COFIRED | - | PLASTIC/EPOXY | CERAMIC, GLASS-SEALED | PLASTIC/EPOXY |
封装代码 | DFP | QCCN | - | DIP | DIP | SOP |
封装等效代码 | FL16,.3 | LCC20,.35SQ | - | DIP16,.3 | DIP16,.3 | - |
电源 | 5 V | 5 V | - | 5 V | 5 V | - |
最大电源电流(ICC) | 24 mA | 24 mA | - | 24 mA | 24 mA | - |
Prop。Delay @ Nom-Sup | 16 ns | 16 ns | - | 16 ns | 16 ns | - |
传播延迟(tpd) | 25 ns | 25 ns | - | 25 ns | 25 ns | 25 ns |
认证状态 | Not Qualified | Not Qualified | - | Not Qualified | Not Qualified | Not Qualified |
座面最大高度 | 2.032 mm | 1.905 mm | - | 5.08 mm | 5.08 mm | 1.75 mm |
最大供电电压 (Vsup) | 5.5 V | 5.5 V | - | 5.25 V | 5.5 V | 5.25 V |
最小供电电压 (Vsup) | 4.5 V | 4.5 V | - | 4.75 V | 4.5 V | 4.75 V |
标称供电电压 (Vsup) | 5 V | 5 V | - | 5 V | 5 V | 5 V |
表面贴装 | YES | YES | - | NO | NO | YES |
温度等级 | MILITARY | MILITARY | - | COMMERCIAL | MILITARY | COMMERCIAL |
端子形式 | FLAT | NO LEAD | - | THROUGH-HOLE | THROUGH-HOLE | GULL WING |
端子节距 | 1.27 mm | 1.27 mm | - | 2.54 mm | 2.54 mm | 1.27 mm |
端子位置 | DUAL | QUAD | - | DUAL | DUAL | DUAL |
宽度 | 6.604 mm | 8.89 mm | - | 7.62 mm | 7.62 mm | 3.9 mm |
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