Bus Driver, FCT Series, 2-Func, 4-Bit, True Output, CMOS, CQCC20, LCC-20
| 参数名称 | 属性值 |
| 是否无铅 | 含铅 |
| 是否Rohs认证 | 不符合 |
| 厂商名称 | IDT (Integrated Device Technology) |
| 零件包装代码 | QLCC |
| 包装说明 | LCC-20 |
| 针数 | 20 |
| Reach Compliance Code | compliant |
| 其他特性 | INPUTS CAN BE DRIVEN BY 3.3V OR 5V COMPONENTS |
| 系列 | FCT |
| JESD-30 代码 | S-CQCC-N20 |
| JESD-609代码 | e0 |
| 长度 | 8.89 mm |
| 负载电容（CL） | 50 pF |
| 逻辑集成电路类型 | BUS DRIVER |
| 位数 | 4 |
| 功能数量 | 2 |
| 端口数量 | 2 |
| 端子数量 | 20 |
| 最高工作温度 | 85 °C |
| 最低工作温度 | -40 °C |
| 输出特性 | 3-STATE |
| 输出极性 | TRUE |
| 封装主体材料 | CERAMIC, METAL-SEALED COFIRED |
| 封装代码 | QCCN |
| 封装形状 | SQUARE |
| 封装形式 | CHIP CARRIER |
| 峰值回流温度（摄氏度） | 225 |
| 传播延迟（tpd） | 4.8 ns |
| 认证状态 | Not Qualified |
| 座面最大高度 | 2.54 mm |
| 最大供电电压 (Vsup) | 3.6 V |
| 最小供电电压 (Vsup) | 3 V |
| 标称供电电压 (Vsup) | 3.3 V |
| 表面贴装 | YES |
| 技术 | CMOS |
| 温度等级 | INDUSTRIAL |
| 端子面层 | TIN LEAD |
| 端子形式 | NO LEAD |
| 端子节距 | 1.27 mm |
| 端子位置 | QUAD |
| 处于峰值回流温度下的最长时间 | 30 |
| 宽度 | 8.89 mm |
| IDT74FCT3244AL | IDT74FCT3244AE | IDT54FCT3244AEB | IDT54FCT3244ALB | IDT54FCT3244EB | IDT54FCT3244LB | IDT74FCT3244L | IDT74FCT3244E | |
|---|---|---|---|---|---|---|---|---|
| 描述 | Bus Driver, FCT Series, 2-Func, 4-Bit, True Output, CMOS, CQCC20, LCC-20 | Bus Driver, FCT Series, 2-Func, 4-Bit, True Output, CMOS, CDFP20, CERPACK-20 | Bus Driver, FCT Series, 2-Func, 4-Bit, True Output, CMOS, CDFP20, CERPACK-20 | Bus Driver, FCT Series, 2-Func, 4-Bit, True Output, CMOS, CQCC20, LCC-20 | Bus Driver, FCT Series, 2-Func, 4-Bit, True Output, CMOS, CDFP20, CERPACK-20 | Bus Driver, FCT Series, 2-Func, 4-Bit, True Output, CMOS, CQCC20, LCC-20 | Bus Driver, FCT Series, 2-Func, 4-Bit, True Output, CMOS, CQCC20, LCC-20 | Bus Driver, FCT Series, 2-Func, 4-Bit, True Output, CMOS, CDFP20, CERPACK-20 |
| 是否无铅 | 含铅 | 含铅 | 含铅 | 含铅 | 含铅 | 含铅 | 含铅 | 含铅 |
| 是否Rohs认证 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 |
| 零件包装代码 | QLCC | DFP | DFP | QLCC | DFP | QLCC | QLCC | DFP |
| 包装说明 | LCC-20 | DFP, | DFP, FL20,.3 | QCCN, LCC20,.35SQ | DFP, FL20,.3 | QCCN, LCC20,.35SQ | LCC-20 | CERPACK-20 |
| 针数 | 20 | 20 | 20 | 20 | 20 | 20 | 20 | 20 |
| Reach Compliance Code | compliant | compliant | not_compliant | not_compliant | not_compliant | not_compliant | compliant | compliant |
| 厂商名称 | IDT (Integrated Device Technology) | - | IDT (Integrated Device Technology) | IDT (Integrated Device Technology) | IDT (Integrated Device Technology) | IDT (Integrated Device Technology) | IDT (Integrated Device Technology) | IDT (Integrated Device Technology) |
| 其他特性 | INPUTS CAN BE DRIVEN BY 3.3V OR 5V COMPONENTS | INPUTS CAN BE DRIVEN BY 3.3V OR 5V COMPONENTS | INPUTS CAN BE DRIVEN BY 3.3V OR 5V COMPONENTS | INPUTS CAN BE DRIVEN BY 3.3V OR 5V COMPONENTS | INPUTS CAN BE DRIVEN BY 3.3V OR 5V COMPONENTS | - | INPUTS CAN BE DRIVEN BY 3.3V OR 5V COMPONENTS | INPUTS CAN BE DRIVEN BY 3.3V OR 5V COMPONENTS |
| 系列 | FCT | FCT | FCT | FCT | FCT | - | FCT | FCT |
| JESD-30 代码 | S-CQCC-N20 | R-GDFP-F20 | R-GDFP-F20 | S-CQCC-N20 | R-GDFP-F20 | - | S-CQCC-N20 | R-GDFP-F20 |
| JESD-609代码 | e0 | e0 | e0 | e0 | e0 | - | e0 | e0 |
| 负载电容（CL） | 50 pF | 50 pF | 50 pF | 50 pF | 50 pF | - | 50 pF | 50 pF |
| 逻辑集成电路类型 | BUS DRIVER | BUS DRIVER | BUS DRIVER | BUS DRIVER | BUS DRIVER | - | BUS DRIVER | BUS DRIVER |
| 位数 | 4 | 4 | 4 | 4 | 4 | - | 4 | 4 |
| 功能数量 | 2 | 2 | 2 | 2 | 2 | - | 2 | 2 |
| 端口数量 | 2 | 2 | 2 | 2 | 2 | - | 2 | 2 |
| 端子数量 | 20 | 20 | 20 | 20 | 20 | - | 20 | 20 |
| 最高工作温度 | 85 °C | 85 °C | 125 °C | 125 °C | 125 °C | - | 85 °C | 85 °C |
| 最低工作温度 | -40 °C | -40 °C | -55 °C | -55 °C | -55 °C | - | -40 °C | -40 °C |
| 输出特性 | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | - | 3-STATE | 3-STATE |
| 输出极性 | TRUE | TRUE | TRUE | TRUE | TRUE | - | TRUE | TRUE |
| 封装主体材料 | CERAMIC, METAL-SEALED COFIRED | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, GLASS-SEALED | - | CERAMIC, METAL-SEALED COFIRED | CERAMIC, GLASS-SEALED |
| 封装代码 | QCCN | DFP | DFP | QCCN | DFP | - | QCCN | DFP |
| 封装形状 | SQUARE | RECTANGULAR | RECTANGULAR | SQUARE | RECTANGULAR | - | SQUARE | RECTANGULAR |
| 封装形式 | CHIP CARRIER | FLATPACK | FLATPACK | CHIP CARRIER | FLATPACK | - | CHIP CARRIER | FLATPACK |
| 峰值回流温度（摄氏度） | 225 | 225 | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | - | 225 | 225 |
| 传播延迟（tpd） | 4.8 ns | 4.8 ns | 5.1 ns | 5.1 ns | 7 ns | - | 6.5 ns | 6.5 ns |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | - | Not Qualified | Not Qualified |
| 座面最大高度 | 2.54 mm | 2.3368 mm | 2.3368 mm | 2.54 mm | 2.3368 mm | - | 2.54 mm | 2.3368 mm |
| 最大供电电压 (Vsup) | 3.6 V | 3.6 V | 3.6 V | 3.6 V | 3.6 V | - | 3.6 V | 3.6 V |
| 最小供电电压 (Vsup) | 3 V | 3 V | 3 V | 3 V | 3 V | - | 3 V | 3 V |
| 标称供电电压 (Vsup) | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | - | 3.3 V | 3.3 V |
| 表面贴装 | YES | YES | YES | YES | YES | - | YES | YES |
| 技术 | CMOS | CMOS | CMOS | CMOS | CMOS | - | CMOS | CMOS |
| 温度等级 | INDUSTRIAL | INDUSTRIAL | MILITARY | MILITARY | MILITARY | - | INDUSTRIAL | INDUSTRIAL |
| 端子面层 | TIN LEAD | TIN LEAD | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | - | TIN LEAD | TIN LEAD |
| 端子形式 | NO LEAD | FLAT | FLAT | NO LEAD | FLAT | - | NO LEAD | FLAT |
| 端子节距 | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm | - | 1.27 mm | 1.27 mm |
| 端子位置 | QUAD | DUAL | DUAL | QUAD | DUAL | - | QUAD | DUAL |
| 处于峰值回流温度下的最长时间 | 30 | 30 | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | - | 30 | 30 |
| 宽度 | 8.89 mm | 6.9215 mm | 6.9215 mm | 8.89 mm | 6.9215 mm | - | 8.89 mm | 6.9215 mm |
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