8-BIT, OTPROM, 8MHz, MICROCONTROLLER, PDIP28, 0.600 INCH, PLASTIC, DIP-28
| 参数名称 | 属性值 |
| 厂商名称 | ST(意法半导体) |
| 零件包装代码 | DIP |
| 包装说明 | 0.600 INCH, PLASTIC, DIP-28 |
| 针数 | 28 |
| Reach Compliance Code | compliant |
| 具有ADC | YES |
| 地址总线宽度 | |
| 位大小 | 8 |
| 最大时钟频率 | 8 MHz |
| DAC 通道 | NO |
| DMA 通道 | NO |
| 外部数据总线宽度 | |
| JESD-30 代码 | R-PDIP-T28 |
| 长度 | 35.64 mm |
| I/O 线路数量 | 21 |
| 端子数量 | 28 |
| 最高工作温度 | 85 °C |
| 最低工作温度 | -25 °C |
| PWM 通道 | NO |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | DIP |
| 封装形状 | RECTANGULAR |
| 封装形式 | IN-LINE |
| 认证状态 | Not Qualified |
| ROM可编程性 | OTPROM |
| 座面最大高度 | 4.8 mm |
| 速度 | 8 MHz |
| 最大供电电压 | 6 V |
| 最小供电电压 | 4.5 V |
| 表面贴装 | NO |
| 技术 | CMOS |
| 温度等级 | OTHER |
| 端子形式 | THROUGH-HOLE |
| 端子节距 | 2.54 mm |
| 端子位置 | DUAL |
| 宽度 | 15.24 mm |
| uPs/uCs/外围集成电路类型 | MICROCONTROLLER |
| ST62T94B8 | ST6294B8/XXX | ST6294M8/XXX | ST62T94M8 | ST62E94F1 | |
|---|---|---|---|---|---|
| 描述 | 8-BIT, OTPROM, 8MHz, MICROCONTROLLER, PDIP28, 0.600 INCH, PLASTIC, DIP-28 | 8-BIT, MROM, 8MHz, MICROCONTROLLER, PDIP28, 0.600 INCH, PLASTIC, DIP-28 | 8-BIT, MROM, 8MHz, MICROCONTROLLER, PDSO28, 0.300 INCH, PLASTIC, SO-28 | 8-BIT, OTPROM, 8MHz, MICROCONTROLLER, PDSO28, 0.300 INCH, PLASTIC, SO-28 | 8-BIT, UVPROM, 8MHz, MICROCONTROLLER, CDIP28, 0.600 INCH, FRIT SEALED, CERAMIC, DIP-28 |
| 厂商名称 | ST(意法半导体) | ST(意法半导体) | ST(意法半导体) | ST(意法半导体) | ST(意法半导体) |
| 零件包装代码 | DIP | DIP | SOIC | SOIC | DIP |
| 包装说明 | 0.600 INCH, PLASTIC, DIP-28 | DIP, | 0.300 INCH, PLASTIC, SO-28 | 0.300 INCH, PLASTIC, SO-28 | 0.600 INCH, FRIT SEALED, CERAMIC, DIP-28 |
| 针数 | 28 | 28 | 28 | 28 | 28 |
| Reach Compliance Code | compliant | unknown | compliant | compliant | compliant |
| 具有ADC | YES | YES | YES | YES | YES |
| 位大小 | 8 | 8 | 8 | 8 | 8 |
| 最大时钟频率 | 8 MHz | 8 MHz | 8 MHz | 8 MHz | 8 MHz |
| DAC 通道 | NO | NO | NO | NO | NO |
| DMA 通道 | NO | NO | NO | NO | NO |
| JESD-30 代码 | R-PDIP-T28 | R-PDIP-T28 | R-PDSO-G28 | R-PDSO-G28 | R-GDIP-T28 |
| I/O 线路数量 | 21 | 21 | 21 | 21 | 21 |
| 端子数量 | 28 | 28 | 28 | 28 | 28 |
| 最高工作温度 | 85 °C | 85 °C | 85 °C | 85 °C | 70 °C |
| 最低工作温度 | -25 °C | -25 °C | -25 °C | -25 °C | - |
| PWM 通道 | NO | NO | NO | NO | NO |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | CERAMIC, GLASS-SEALED |
| 封装代码 | DIP | DIP | SOP | SOP | WDIP |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | IN-LINE | IN-LINE | SMALL OUTLINE | SMALL OUTLINE | IN-LINE, WINDOW |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| ROM可编程性 | OTPROM | MROM | MROM | OTPROM | UVPROM |
| 座面最大高度 | 4.8 mm | 4.8 mm | 2.85 mm | 2.85 mm | 5.71 mm |
| 速度 | 8 MHz | 8 MHz | 8 MHz | 8 MHz | 8 MHz |
| 最大供电电压 | 6 V | 6 V | 6 V | 6 V | 6 V |
| 最小供电电压 | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V |
| 表面贴装 | NO | NO | YES | YES | NO |
| 技术 | CMOS | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | OTHER | OTHER | OTHER | OTHER | COMMERCIAL |
| 端子形式 | THROUGH-HOLE | THROUGH-HOLE | GULL WING | GULL WING | THROUGH-HOLE |
| 端子节距 | 2.54 mm | 2.54 mm | 1.27 mm | 1.27 mm | 2.54 mm |
| 端子位置 | DUAL | DUAL | DUAL | DUAL | DUAL |
| 宽度 | 15.24 mm | 15.24 mm | 7.5 mm | 7.5 mm | 15.24 mm |
| uPs/uCs/外围集成电路类型 | MICROCONTROLLER | MICROCONTROLLER | MICROCONTROLLER | MICROCONTROLLER | MICROCONTROLLER |
| 长度 | 35.64 mm | 35.64 mm | 17.9 mm | 17.9 mm | - |
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