32-BIT, FLASH, 116MHz, MICROCONTROLLER, PBGA208, 17 X 17 MM, 1 MM PITCH, ROHS COMPLIANT, MO151AAF-1, MAPBGA-208
参数名称 | 属性值 |
是否无铅 | 不含铅 |
是否Rohs认证 | 符合 |
厂商名称 | NXP(恩智浦) |
零件包装代码 | BGA |
包装说明 | 17 X 17 MM, 1 MM PITCH, ROHS COMPLIANT, MO151AAF-1, MAPBGA-208 |
针数 | 208 |
Reach Compliance Code | compliant |
ECCN代码 | 3A991 |
具有ADC | YES |
地址总线宽度 | |
位大小 | 32 |
最大时钟频率 | 40 MHz |
DAC 通道 | NO |
DMA 通道 | YES |
外部数据总线宽度 | |
JESD-30 代码 | S-PBGA-B208 |
JESD-609代码 | e2 |
长度 | 17 mm |
湿度敏感等级 | 3 |
端子数量 | 208 |
最高工作温度 | 105 °C |
最低工作温度 | -40 °C |
PWM 通道 | NO |
封装主体材料 | PLASTIC/EPOXY |
封装代码 | FBGA |
封装形状 | SQUARE |
封装形式 | GRID ARRAY, FINE PITCH |
峰值回流温度(摄氏度) | 260 |
认证状态 | Not Qualified |
ROM可编程性 | FLASH |
座面最大高度 | 2 mm |
速度 | 116 MHz |
最大供电电压 | 5.5 V |
最小供电电压 | 4.5 V |
标称供电电压 | 5 V |
表面贴装 | YES |
技术 | CMOS |
温度等级 | INDUSTRIAL |
端子面层 | Tin/Silver (Sn/Ag) |
端子形式 | BALL |
端子节距 | 0.5 mm |
端子位置 | BOTTOM |
处于峰值回流温度下的最长时间 | 40 |
宽度 | 17 mm |
uPs/uCs/外围集成电路类型 | MICROCONTROLLER |
PPC5668GF0AVMG | MPC5668GF0AVMJ | MPC5668GF0AVMJR | PPC5668GF0AVMJ | SPC5668GF0AVMGR | PPC5668GF0AVMJR | PPC5668GF0AVMGR | |
---|---|---|---|---|---|---|---|
描述 | 32-BIT, FLASH, 116MHz, MICROCONTROLLER, PBGA208, 17 X 17 MM, 1 MM PITCH, ROHS COMPLIANT, MO151AAF-1, MAPBGA-208 | 32-BIT, FLASH, 116MHz, MICROCONTROLLER, PBGA256, 17 X 17 MM, 1 MM PITCH, ROHS COMPLIANT, MAPBGA-256 | 32-BIT, FLASH, 116MHz, MICROCONTROLLER, PBGA256, 17 X 17 MM, 1 MM PITCH, ROHS COMPLIANT, MAPBGA-256 | 32-BIT, FLASH, 116MHz, MICROCONTROLLER, PBGA256, 17 X 17 MM, 1 MM PITCH, ROHS COMPLIANT, MAPBGA-256 | 32-BIT, FLASH, 116MHz, MICROCONTROLLER, PBGA208, 17 X 17 MM, 1 MM PITCH, ROHS COMPLIANT, MO151AAF-1, MAPBGA-208 | 32-BIT, FLASH, 116MHz, MICROCONTROLLER, PBGA256, 17 X 17 MM, 1 MM PITCH, ROHS COMPLIANT, MAPBGA-256 | 32-BIT, FLASH, 116MHz, MICROCONTROLLER, PBGA208, 17 X 17 MM, 1 MM PITCH, ROHS COMPLIANT, MO151AAF-1, MAPBGA-208 |
零件包装代码 | BGA | BGA | BGA | BGA | BGA | BGA | BGA |
包装说明 | 17 X 17 MM, 1 MM PITCH, ROHS COMPLIANT, MO151AAF-1, MAPBGA-208 | 17 X 17 MM, 1 MM PITCH, ROHS COMPLIANT, MAPBGA-256 | 17 X 17 MM, 1 MM PITCH, ROHS COMPLIANT, MAPBGA-256 | 17 X 17 MM, 1 MM PITCH, ROHS COMPLIANT, MAPBGA-256 | 17 X 17 MM, 1 MM PITCH, ROHS COMPLIANT, MO151AAF-1, MAPBGA-208 | LBGA, | 17 X 17 MM, 1 MM PITCH, ROHS COMPLIANT, MO151AAF-1, MAPBGA-208 |
针数 | 208 | 256 | 256 | 256 | 208 | 256 | 208 |
Reach Compliance Code | compliant | compliant | compliant | compliant | compliant | unknown | compliant |
ECCN代码 | 3A991 | 3A991.A.2 | 3A991.A.2 | 3A991 | 3A991.A.2 | 3A991.A.2 | 3A991 |
具有ADC | YES | YES | YES | YES | YES | YES | YES |
位大小 | 32 | 32 | 32 | 32 | 32 | 32 | 32 |
最大时钟频率 | 40 MHz | 40 MHz | 40 MHz | 40 MHz | 40 MHz | 40 MHz | 40 MHz |
DAC 通道 | NO | NO | NO | NO | NO | NO | NO |
DMA 通道 | YES | YES | YES | YES | YES | YES | YES |
JESD-30 代码 | S-PBGA-B208 | S-PBGA-B256 | S-PBGA-B256 | S-PBGA-B256 | S-PBGA-B208 | S-PBGA-B256 | S-PBGA-B208 |
长度 | 17 mm | 17 mm | 17 mm | 17 mm | 17 mm | 17 mm | 17 mm |
端子数量 | 208 | 256 | 256 | 256 | 208 | 256 | 208 |
最高工作温度 | 105 °C | 105 °C | 105 °C | 105 °C | 105 °C | 105 °C | 105 °C |
最低工作温度 | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C |
PWM 通道 | NO | NO | NO | NO | NO | NO | NO |
封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
封装代码 | FBGA | LBGA | LBGA | LBGA | FBGA | LBGA | FBGA |
封装形状 | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE |
封装形式 | GRID ARRAY, FINE PITCH | GRID ARRAY, LOW PROFILE | GRID ARRAY, LOW PROFILE | GRID ARRAY, LOW PROFILE | GRID ARRAY, FINE PITCH | GRID ARRAY, LOW PROFILE | GRID ARRAY, FINE PITCH |
认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
ROM可编程性 | FLASH | FLASH | FLASH | FLASH | FLASH | FLASH | FLASH |
座面最大高度 | 2 mm | 1.6 mm | 1.6 mm | 1.6 mm | 2 mm | 1.6 mm | 2 mm |
速度 | 116 MHz | 116 MHz | 116 MHz | 116 MHz | 116 MHz | 116 MHz | 116 MHz |
最大供电电压 | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
最小供电电压 | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V |
标称供电电压 | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
表面贴装 | YES | YES | YES | YES | YES | YES | YES |
技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
温度等级 | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL |
端子形式 | BALL | BALL | BALL | BALL | BALL | BALL | BALL |
端子节距 | 0.5 mm | 1 mm | 1 mm | 1 mm | 0.5 mm | 1 mm | 0.5 mm |
端子位置 | BOTTOM | BOTTOM | BOTTOM | BOTTOM | BOTTOM | BOTTOM | BOTTOM |
宽度 | 17 mm | 17 mm | 17 mm | 17 mm | 17 mm | 17 mm | 17 mm |
uPs/uCs/外围集成电路类型 | MICROCONTROLLER | MICROCONTROLLER | MICROCONTROLLER | MICROCONTROLLER | MICROCONTROLLER | MICROCONTROLLER | MICROCONTROLLER |
是否Rohs认证 | 符合 | 符合 | 符合 | 符合 | 符合 | - | 符合 |
厂商名称 | NXP(恩智浦) | - | - | NXP(恩智浦) | NXP(恩智浦) | NXP(恩智浦) | NXP(恩智浦) |
峰值回流温度(摄氏度) | 260 | NOT SPECIFIED | NOT SPECIFIED | 260 | NOT SPECIFIED | - | 260 |
处于峰值回流温度下的最长时间 | 40 | NOT SPECIFIED | NOT SPECIFIED | 40 | NOT SPECIFIED | - | 40 |
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