High-Immunity, 5.7kVRMS Reinforced Triple-Channel 2/1 Digital Isolator, 100Mbps 16-SOIC -55 to 125
参数名称 | 属性值 |
Brand Name | Texas Instruments |
是否无铅 | 不含铅 |
是否Rohs认证 | 符合 |
厂商名称 | Texas Instruments(德州仪器) |
包装说明 | SOP, |
Reach Compliance Code | compliant |
Factory Lead Time | 6 weeks |
Samacsys Description | ISO7831FDW Texas Instruments, PCB SMT, 3-Channel Digital Isolator 100Mbit/s, 5.7 kVrms, 16-Pin SOIC |
接口集成电路类型 | INTERFACE CIRCUIT |
JESD-30 代码 | R-PDSO-G16 |
JESD-609代码 | e4 |
长度 | 10.3 mm |
湿度敏感等级 | 2 |
功能数量 | 3 |
端子数量 | 16 |
最高工作温度 | 125 °C |
最低工作温度 | -55 °C |
封装主体材料 | PLASTIC/EPOXY |
封装代码 | SOP |
封装形状 | RECTANGULAR |
封装形式 | SMALL OUTLINE |
座面最大高度 | 2.65 mm |
最大供电电压 | 5.5 V |
最小供电电压 | 2.25 V |
标称供电电压 | 2.5 V |
表面贴装 | YES |
技术 | CMOS |
温度等级 | MILITARY |
端子面层 | Nickel/Palladium/Gold (Ni/Pd/Au) |
端子形式 | GULL WING |
端子节距 | 1.27 mm |
端子位置 | DUAL |
宽度 | 7.5 mm |
ISO7831FDW | ISO7831DW | ISO7831DWR | ISO7831FDWR | |
---|---|---|---|---|
描述 | High-Immunity, 5.7kVRMS Reinforced Triple-Channel 2/1 Digital Isolator, 100Mbps 16-SOIC -55 to 125 | High-Immunity, 5.7kVRMS Reinforced Triple-Channel 2/1 Digital Isolator, 100Mbps 16-SOIC -55 to 125 | High-Immunity, 5.7kVRMS Reinforced Triple-Channel 2/1 Digital Isolator, 100Mbps 16-SOIC -55 to 125 | High-Immunity, 5.7kVRMS Reinforced Triple-Channel 2/1 Digital Isolator, 100Mbps 16-SOIC -55 to 125 |
Brand Name | Texas Instruments | Texas Instruments | Texas Instruments | Texas Instruments |
是否无铅 | 不含铅 | 不含铅 | 不含铅 | 不含铅 |
是否Rohs认证 | 符合 | 符合 | 符合 | 符合 |
厂商名称 | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) |
包装说明 | SOP, | SOP, | SOP, | SOP, |
Reach Compliance Code | compliant | compliant | compliant | compli |
Factory Lead Time | 6 weeks | 6 weeks | 12 weeks | 12 weeks |
接口集成电路类型 | INTERFACE CIRCUIT | INTERFACE CIRCUIT | INTERFACE CIRCUIT | INTERFACE CIRCUIT |
JESD-30 代码 | R-PDSO-G16 | R-PDSO-G16 | R-PDSO-G16 | R-PDSO-G16 |
JESD-609代码 | e4 | e4 | e4 | e4 |
长度 | 10.3 mm | 10.3 mm | 10.3 mm | 10.3 mm |
湿度敏感等级 | 2 | 2 | 2 | 2 |
功能数量 | 3 | 3 | 3 | 3 |
端子数量 | 16 | 16 | 16 | 16 |
最高工作温度 | 125 °C | 125 °C | 125 °C | 125 °C |
最低工作温度 | -55 °C | -55 °C | -55 °C | -55 °C |
封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
封装代码 | SOP | SOP | SOP | SOP |
封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
封装形式 | SMALL OUTLINE | SMALL OUTLINE | SMALL OUTLINE | SMALL OUTLINE |
座面最大高度 | 2.65 mm | 2.65 mm | 2.65 mm | 2.65 mm |
最大供电电压 | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
最小供电电压 | 2.25 V | 2.25 V | 2.25 V | 2.25 V |
标称供电电压 | 2.5 V | 2.5 V | 2.5 V | 2.5 V |
表面贴装 | YES | YES | YES | YES |
技术 | CMOS | CMOS | CMOS | CMOS |
温度等级 | MILITARY | MILITARY | MILITARY | MILITARY |
端子面层 | Nickel/Palladium/Gold (Ni/Pd/Au) | Nickel/Palladium/Gold (Ni/Pd/Au) | Nickel/Palladium/Gold (Ni/Pd/Au) | Nickel/Palladium/Gold (Ni/Pd/Au) |
端子形式 | GULL WING | GULL WING | GULL WING | GULL WING |
端子节距 | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm |
端子位置 | DUAL | DUAL | DUAL | DUAL |
宽度 | 7.5 mm | 7.5 mm | 7.5 mm | 7.5 mm |
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