High-Immunity, 5.7kVRMS Reinforced Triple-Channel 2/1 Digital Isolator, 100Mbps 16-SOIC -55 to 125
| 参数名称 | 属性值 |
| Brand Name | Texas Instruments |
| 是否无铅 | 不含铅 |
| 是否Rohs认证 | 符合 |
| 厂商名称 | Texas Instruments(德州仪器) |
| 包装说明 | SOP, |
| Reach Compliance Code | compliant |
| Factory Lead Time | 12 weeks |
| Samacsys Description | High-immunity, 100-Mbps, 5.7-kVRMS reinforced triple-channel 2/1 digital isolator |
| 接口集成电路类型 | INTERFACE CIRCUIT |
| JESD-30 代码 | R-PDSO-G16 |
| JESD-609代码 | e4 |
| 长度 | 10.3 mm |
| 湿度敏感等级 | 2 |
| 功能数量 | 3 |
| 端子数量 | 16 |
| 最高工作温度 | 125 °C |
| 最低工作温度 | -55 °C |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | SOP |
| 封装形状 | RECTANGULAR |
| 封装形式 | SMALL OUTLINE |
| 座面最大高度 | 2.65 mm |
| 最大供电电压 | 5.5 V |
| 最小供电电压 | 2.25 V |
| 标称供电电压 | 2.5 V |
| 表面贴装 | YES |
| 技术 | CMOS |
| 温度等级 | MILITARY |
| 端子面层 | Nickel/Palladium/Gold (Ni/Pd/Au) |
| 端子形式 | GULL WING |
| 端子节距 | 1.27 mm |
| 端子位置 | DUAL |
| 宽度 | 7.5 mm |
| ISO7831DWR | ISO7831DW | ISO7831FDW | ISO7831FDWR | |
|---|---|---|---|---|
| 描述 | High-Immunity, 5.7kVRMS Reinforced Triple-Channel 2/1 Digital Isolator, 100Mbps 16-SOIC -55 to 125 | High-Immunity, 5.7kVRMS Reinforced Triple-Channel 2/1 Digital Isolator, 100Mbps 16-SOIC -55 to 125 | High-Immunity, 5.7kVRMS Reinforced Triple-Channel 2/1 Digital Isolator, 100Mbps 16-SOIC -55 to 125 | High-Immunity, 5.7kVRMS Reinforced Triple-Channel 2/1 Digital Isolator, 100Mbps 16-SOIC -55 to 125 |
| Brand Name | Texas Instruments | Texas Instruments | Texas Instruments | Texas Instruments |
| 是否无铅 | 不含铅 | 不含铅 | 不含铅 | 不含铅 |
| 是否Rohs认证 | 符合 | 符合 | 符合 | 符合 |
| 厂商名称 | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) |
| 包装说明 | SOP, | SOP, | SOP, | SOP, |
| Reach Compliance Code | compliant | compliant | compliant | compli |
| Factory Lead Time | 12 weeks | 6 weeks | 6 weeks | 12 weeks |
| 接口集成电路类型 | INTERFACE CIRCUIT | INTERFACE CIRCUIT | INTERFACE CIRCUIT | INTERFACE CIRCUIT |
| JESD-30 代码 | R-PDSO-G16 | R-PDSO-G16 | R-PDSO-G16 | R-PDSO-G16 |
| JESD-609代码 | e4 | e4 | e4 | e4 |
| 长度 | 10.3 mm | 10.3 mm | 10.3 mm | 10.3 mm |
| 湿度敏感等级 | 2 | 2 | 2 | 2 |
| 功能数量 | 3 | 3 | 3 | 3 |
| 端子数量 | 16 | 16 | 16 | 16 |
| 最高工作温度 | 125 °C | 125 °C | 125 °C | 125 °C |
| 最低工作温度 | -55 °C | -55 °C | -55 °C | -55 °C |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | SOP | SOP | SOP | SOP |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | SMALL OUTLINE | SMALL OUTLINE | SMALL OUTLINE | SMALL OUTLINE |
| 座面最大高度 | 2.65 mm | 2.65 mm | 2.65 mm | 2.65 mm |
| 最大供电电压 | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
| 最小供电电压 | 2.25 V | 2.25 V | 2.25 V | 2.25 V |
| 标称供电电压 | 2.5 V | 2.5 V | 2.5 V | 2.5 V |
| 表面贴装 | YES | YES | YES | YES |
| 技术 | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | MILITARY | MILITARY | MILITARY | MILITARY |
| 端子面层 | Nickel/Palladium/Gold (Ni/Pd/Au) | Nickel/Palladium/Gold (Ni/Pd/Au) | Nickel/Palladium/Gold (Ni/Pd/Au) | Nickel/Palladium/Gold (Ni/Pd/Au) |
| 端子形式 | GULL WING | GULL WING | GULL WING | GULL WING |
| 端子节距 | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm |
| 端子位置 | DUAL | DUAL | DUAL | DUAL |
| 宽度 | 7.5 mm | 7.5 mm | 7.5 mm | 7.5 mm |
电子工程世界版权所有
京B2-20211791
京ICP备10001474号-1
电信业务审批[2006]字第258号函
京公网安备 11010802033920号
Copyright © 2005-2024 EEWORLD.com.cn, Inc. All rights reserved
电子工程世界
